【摘要】：提出一種在金屬銅上制備梯度潤濕表面(接觸角變化范圍90.3°~4.2°)的簡易方法。采用改進(jìn)的陽極氧化電化學(xué)沉積技術(shù),通過向陽極氧化系統(tǒng)的雙電極容器中滴加氫氧化鉀溶液,使銅箔電極上氫氧化銅納米帶陣列的生長程度與密度隨銅箔高度而變化,從而形成潤濕性梯度。所制備的潤濕梯度銅表面具有耐熱耐水特性,當(dāng)此銅表面置于100℃的水浴中10h后仍保持其潤濕性梯度。SEM、XRD和XPS測試結(jié)果表明,銅表面的氫氧化銅納米帶陣列的生長特性與分布是形成潤濕性梯度的主要原因。
[Abstract]:A simple method for preparing gradient wetting surface (contact angle 90.3 擄~ 4.2 擄) on copper was proposed. By using the improved anodic oxidation electrochemical deposition technique, the growth degree and density of copper hydroxide nanband array on copper foil electrode vary with the height of copper foil by dropping potassium hydroxide solution into the double electrode container of the anodic oxidation system, and the growth degree and density of copper nano-strip array on copper foil electrode vary with the height of copper foil. Thus, the wettability gradient is formed. The wettability gradient copper surface prepared has the characteristic of heat resistance and water resistance. When the copper surface is placed in water bath at 100 鈩，

本文編號：2470610