【摘要】：采用熱軋與重熔的SIMA法制備了ZCu Sn10銅合金半固態(tài)坯料。先通過多向熱軋對ZCu Sn10銅合金坯料進行預變形,然后對其進行半固態(tài)溫度區(qū)間保溫不同時間的二次加熱處理。使用光學顯微鏡、掃描電鏡、能譜及圖像分析軟件等手段研究了坯料二次加熱過程中微觀組織的演化,并分析了α(Cu)球化組織的形成機制。結(jié)果表明:在熱軋變形量為16%、加熱溫度為930℃時,隨著保溫時間的延長半固態(tài)ZCu Sn10銅合金坯料初生α(Cu)逐漸發(fā)生球化,平均晶粒直徑先減小后增大,由二次加熱保溫8 min的68.24μm先減小至10 min的62.31μm然后增大至25 min的71.09μm;保溫10 min時平均晶粒直徑最小,液相率由保溫8 min時的18.14%逐漸增加到保溫25 min時的25.32%;形狀因子隨著保溫時間的延長先減小后增加,由保溫8 min時的2.91先減小至15 min時的1.67,然后增大到保溫25 min時的2.43。保溫15 min時的半固態(tài)組織最優(yōu),其平均晶粒直徑為65.64μm、液相率為23.66%、形狀因子為1.67。在半固態(tài)銅合金二次加熱過程中,組織演變的主要機制是加熱前期的晶粒合并長大和液相增加后的原子擴散導致的晶粒長大并球化。
[Abstract]:Semi-solid billets of ZCu Sn10 copper alloy were prepared by hot rolling and remelting SIMA method. The ZCu Sn10 copper alloy billet was pre-deformed by multi-direction hot rolling, and then treated with secondary heating at different time in the semi-solid temperature range. The microstructure evolution of billet during secondary heating was studied by means of optical microscope, scanning electron microscope, energy spectrum and image analysis software, and the formation mechanism of 偽 (Cu) spheroidized microstructure was analyzed. The results show that when the hot rolling deformation is 16 and the heating temperature is 930 鈩，

本文編號：2271566