本文關鍵詞：Cu表面Ni基復合鍍層對無鉛焊料釬焊性能及界面可靠性的影響　出處：《北京理工大學》2015年碩士論文　論文類型：學位論文

  更多相關文章： 擴散阻擋層 潤濕性能 金屬間化合物 剪切強度 復合鍍層

【摘要】：近年來，隨著傳統(tǒng)SnPb共晶焊料逐漸被Sn-Ag-Cu系無鉛焊料取代，Sn與Cu之間的界面反應及其帶來的可靠性問題引起了人們的重視，一方面高熔點的Sn-Ag-Cu系無鉛焊料使釬焊溫度提高，另一方面無鉛焊料中大量Sn會與Cu發(fā)生反應，導致無鉛焊料/Cu之間形成過厚的界面金屬間化合物(IMC)層，給電子元器件使用可靠性帶來危害。在Cu基板或引腳表面鍍覆一層擴散阻擋層，減緩Sn與Cu反應程度、減小無鉛焊料/Cu界面IMC層的厚度，是提高無鉛焊料焊點可靠性的有效手段。 本論文采用化學鍍工藝，在Cu基板表面分別制備Ni鍍層、添加納米SiO2粒子的Ni基復合鍍層以及添加SiC的Ni基復合鍍層，系統(tǒng)研究了Ni基復合鍍層中粒子添加濃度對Sn-3.0Ag-0.5Cu(SAC305)焊料的潤濕性能、界面IMC生長和釬焊接頭剪切強度的影響規(guī)律，同時對比研究了在無鉛焊料中添加納米SiO2粒子對其在Cu基板、Ni鍍層以及Ni基復合鍍層上的潤濕性能、界面IMC生長和釬焊接頭剪切強度的影響。獲得了以下研究結果： （1）由于Ni/Sn反應比Cu/Sn之間的反應慢，降低了SAC305焊料在鍍鎳Cu基板上的潤濕力，但Cu基板表面的Ni鍍層可以有效抑制焊料/基板界面間IMC的生長，并提高接頭的剪切強度。 （2）在Ni鍍層中添加SiO2或SiC顆粒均能有效抑制SAC305/基板間界面IMC的生長，但與添加SiC粒子的Ni復合鍍層相比，添加納米SiO2的效果更好。在Ni鍍層中添加SiO2粒子不僅能有效抑制SAC305/基板間界面IMC的生長，還能明顯提高SAC305焊料在基板上的潤濕性能和釬焊接頭的剪切強度，SiO2粒子在Ni鍍層中的最佳添加量為6g/L。 （3）相比于SAC305焊料，通過向SAC305焊料中添加0.05wt.%的SiO2粒子，，可明顯改善焊料在Cu基板及鍍鎳Cu基板的潤濕性能，界面間IMC的生長速率常數(shù)ε更小，釬焊接頭的剪切強度更高。但，向焊料中納米SiO2粒子降低了其在Ni-SiO2復合鍍層上的潤濕性，減弱了復合鍍層對界面IMC生長的抑制作用，同時也降了釬焊接頭的剪切強度。
[Abstract]:In recent years, with the traditional SnPb eutectic solder gradually replaced by Sn-Ag-Cu lead-free solder, the interface reaction between Sn and Cu and the reliability problems caused by it have attracted much attention. On the one hand, the high melting point of Sn-Ag-Cu system lead-free solder increases the brazing temperature, on the other hand, a large amount of Sn in lead-free solder will react with Cu. A thick intermetallic intermetallic compound (IMC) layer is formed between lead free solder / copper, which endangers the reliability of electronic components. A diffusion barrier layer is coated on the Cu substrate or pin surface. It is an effective method to improve the reliability of lead-free solder joint by slowing down the reaction between Sn and Cu and decreasing the thickness of IMC layer at the lead-free solder / Cu interface. In this paper, Ni coating was prepared on Cu substrate by electroless plating, Ni based composite coating with nano SiO2 particles and Ni base composite coating with SiC were prepared. The wettability of Sn-3.0 Ag-0.5CuSAC305) solder in Ni based composite coating was studied systematically. The effect of interfacial IMC growth and shear strength of brazed joints on the Cu substrate was studied by comparing the addition of nano-sized SiO2 particles in lead-free solder. The wettability, interfacial IMC growth and shear strength of brazing joint on Ni coating and Ni-base composite coating were studied. 1) because the reaction of Ni/Sn is slower than that of Cu/Sn, the wettability of SAC305 solder on Ni-Cu substrate is decreased. However, Ni coating on Cu substrate can effectively inhibit the growth of IMC between solder and substrate interface and improve the shear strength of the joint. (2) addition of SiO2 or SiC particles to Ni coating can effectively inhibit the growth of IMC at the interface between SAC305 / substrate, but compared with Ni composite coating with SiC particles. The addition of nano SiO2 can not only inhibit the growth of IMC at the interface of SAC305 / substrate effectively, but also increase the effect of adding SiO2 particles in Ni coating. The wettability of SAC305 solder on the substrate and the shear strength of brazing joint can be improved obviously. The optimum addition amount of SiO2 particles in Ni coating is 6g / L. Compared with SAC305 solder, 0. 05 wt.% SiO2 particles were added to SAC305 solder. The wettability of solder on Cu substrate and Ni Cu substrate can be improved obviously. The growth rate constant 蔚 of IMC between interfaces is smaller and the shear strength of brazed joint is higher. Nano SiO2 particles in the solder decreased its wettability on the Ni-SiO2 composite coating, weakened the inhibition of IMC growth on the interface, and reduced the shear strength of the brazed joint.
【學位授予單位】：北京理工大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TG454;TG174.4

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