【摘要】：目前廣泛應(yīng)用的酚磺酸電鍍錫體系和甲磺酸電鍍錫體系分別存在酚類對(duì)環(huán)境與人體有害和甲磺酸易腐敗變質(zhì)、價(jià)格高的缺點(diǎn),本文試圖開(kāi)發(fā)一種新型電鍍錫體系來(lái)代替甲磺酸體系或酚磺酸體系。氨磺酸屬于固體強(qiáng)酸,受運(yùn)輸條件限制小,對(duì)儀器設(shè)備腐蝕小,氨磺酸溶液有一定的還原性,對(duì)于氨磺酸電鍍錫體系國(guó)內(nèi)外鮮有報(bào)道,可以說(shuō)氨磺酸體系是一種有發(fā)展前景的電鍍錫體系。本文主要對(duì)氨磺酸電鍍錫體系的工藝及錫沉積過(guò)程進(jìn)行研究,通過(guò)電化學(xué)工作站,SEM,XRD等方法,確定亞光和光亮電鍍錫的添加劑及工藝參數(shù),并考察兩種鍍液的鍍液性能。通過(guò)電化學(xué)工作站和SEM研究錫在兩種鍍液的成核過(guò)程及其動(dòng)力學(xué)參數(shù)。從氨磺酸鍍液的物理化學(xué)性質(zhì)和量子化學(xué)水平分析,符合酸性鍍錫的基本要求,通過(guò)連續(xù)電鍍測(cè)定Sn2+濃度可得氨磺酸鍍錫穩(wěn)定性良好。通過(guò)Hull槽篩選氨磺酸體系鍍亞光錫添加劑為EPE9400,通過(guò)電化學(xué)工作站,SEM和XRD方法分析EPE9400無(wú)整平能力,工藝參數(shù)為:EPE9400的濃度為0.56g/L,電流密度為1-2A/dm2,Sn2+濃度為15-30g/L,溫度為45℃。在低電流密度下錫沉積的電流效率在95%左右,當(dāng)電流密度達(dá)到4A/dm2時(shí),電流效率只有77%。在25-45℃下電流效率都在95%左右,氨磺酸亞錫鍍液分散能力30%左右,其深度能力極佳。通過(guò)電化學(xué)工作站和SEM確定氨磺酸體系鍍光亮錫鍍液的分散劑為TX-100,主光亮劑為芐叉丙酮,輔助光亮劑為乙二醛。通過(guò)Hull槽實(shí)驗(yàn),SEM和XRD方法,確定TX-100濃度為2g/L,芐叉丙酮濃度為1g/L,乙二醛濃度為0.128g/L,電流密度為4-6A/dm2。在1-5A/dm2范圍內(nèi),電流效率都在99%左右,沉積速率隨電流密度成線性增加,氨磺酸光亮鍍錫液的分散能力在28%左右,其深度能力較差。錫電極在亞光鍍液中的電沉積屬于擴(kuò)散控制,錫在不同電位下的電沉積更近于三維瞬時(shí)成核。錫在氨磺酸亞光鍍錫液的成核位點(diǎn)數(shù)在108cm-2左右,成核速率在100s-1左右,臨界成核吉布斯自由能在10-20J左右,臨界成核尺寸在0.5atom左右。錫在氨磺酸光亮鍍錫液中錫的成核過(guò)程更接近于三維瞬時(shí)成核。錫在氨磺酸光亮鍍液的成核位點(diǎn)數(shù)在109cm-2左右,成核速率在70s-1左右,臨界成核吉布斯自由能在10-20J左右,臨界成核尺寸在1atom左右。
[Abstract]:At present, the widely used tin electroplating system with phenol sulfonic acid and tin electroplating system with methyl sulfonic acid have the disadvantages of harmful to the environment and human body respectively, and are prone to corruption and deterioration of Mesosulfonic acid, so the price is high. This paper attempts to develop a new electroplating tin system to replace the mesonic acid system or phenol sulfonic acid system. Ammonia sulfonic acid is a kind of solid strong acid, which is limited by transportation conditions, corrodes little instrument and equipment, and has certain reductivity of ammonia sulfonic acid solution. There are few reports about ammonia sulfonic acid electroplating tin system at home and abroad. It can be said that the ammonia sulfonic acid system is a promising tin electroplating system. In this paper, the process and deposition process of tin electroplating system with ammonia sulfonic acid were studied. The additives and process parameters of glassy and bright tin electroplating were determined by means of electrochemical workstation and SEM,XRD, and the bath properties of the two kinds of plating bath were investigated. The nucleation process and kinetic parameters of tin in two kinds of bath were studied by electrochemical workstation and SEM. According to the physical and chemical properties and quantum chemical level of ammonia sulfonic acid plating solution, the stability of ammonia sulfonic acid tin plating can be obtained by measuring the concentration of Sn2 by continuous electroplating. The Hull bath was used to select the additive of nitrous tin plating in the system of ammonia sulfonic acid as EPE9400,. The electrochemistry workstation, SEM and XRD methods were used to analyze EPE9400 without leveling ability. The technological parameters were as follows: the concentration of EPE9400 was 0.56g / L, the current density was 1-2A / dm2. The concentration of Sn2 is 15-30 g / L and the temperature is 45 鈩，

本文編號(hào)：2318695