本文選題：固定化生物吸附劑 + 含銅電鍍廢水��； 參考：《電鍍與環(huán)�！�2017年06期

【摘要】：通過平板涂布法,從電鍍污泥中篩選得到1株吸附Cu~(2+)性能優(yōu)良的菌株,鑒定其為假單胞菌,并將其制成固定化生物吸附劑。研究了包埋比、吸附時間、溫度、Cu~(2+)初始質(zhì)量濃度、pH值、投加量對固定化生物吸附劑去除Cu~(2+)的影響。結(jié)果表明:當(dāng)包埋比為1∶5、吸附時間為60min、溫度為35℃、Cu~(2+)初始質(zhì)量濃度為100mg/L、pH值為6、投加量為10g/L時,固定化生物吸附劑對Cu~(2+)的去除率可達(dá)到85.2%。
[Abstract]:A strain with excellent Cu ~ (2) adsorption was obtained from electroplating sludge by plate coating method. The strain was identified as Pseudomonas and was made into immobilized biological adsorbent. The effects of embedding ratio, adsorption time, initial mass concentration of Cu ~ (2), pH value and dosage on removal of Cu ~ (2) by immobilized biological adsorbent were studied. The results show that when the embedding ratio is 1: 5, the adsorption time is 60 min, the initial mass concentration of Cu2 is 100 mg 路L ~ (2) pH = 6 at 35 鈩，

本文編號：2111314