本文選題：KDP晶體 + 溫度原位測(cè)量��； 參考：《人工晶體學(xué)報(bào)》2016年04期

【摘要】：KDP晶體作為優(yōu)質(zhì)的非線性光學(xué)材料,具有脆性高、對(duì)溫度敏感等特性,在單點(diǎn)金剛石切削(SPDT)超精密加工中,微小的溫度和應(yīng)力變化有可能對(duì)晶體造成損傷,但是一直未有相關(guān)實(shí)驗(yàn)報(bào)道。本文采用紅外熱成像儀對(duì)SPDT加工過(guò)程進(jìn)行監(jiān)測(cè),結(jié)合Raman光譜技術(shù),研究KDP晶體在SPDT加工前后表面溫度和應(yīng)力的分布變化。大尺寸KDP晶體經(jīng)過(guò)快速微區(qū)切削后,在給定的切削工藝條件下,測(cè)量出切削部分最高瞬態(tài)溫度比附近未切削部分高出將近8℃。通過(guò)Raman測(cè)量,顯示切削后晶體表面存在殘余拉應(yīng)力。結(jié)合熱力耦合模擬仿真,進(jìn)一步分析了SPDT加工過(guò)程動(dòng)態(tài)切削溫度對(duì)晶體質(zhì)量的影響,為優(yōu)化加工參數(shù)提供依據(jù)。
[Abstract]:As a high quality nonlinear optical material, KDP crystal has the characteristics of high brittleness and sensitivity to temperature. In the ultra-precision machining of single point diamond cutting (SPDT), the tiny changes of temperature and stress may cause damage to the crystal. However, there have been no related experimental reports. In this paper, infrared thermal imager is used to monitor the processing process of SPDT, and Raman spectroscopy is used to study the distribution of temperature and stress on the surface of KDP crystal before and after SPDT processing. The maximum transient temperature of the large size KDP crystal is measured to be 8 鈩，

本文編號(hào)：2059904