本文選題：微膨脹型熱開(kāi)關(guān)　切入點(diǎn)：熱特性　出處：《光學(xué)精密工程》2016年10期 　論文類(lèi)型：期刊論文

【摘要】：為了提高空間熱控分系統(tǒng)的散熱調(diào)節(jié)能力和熱環(huán)境適應(yīng)性,設(shè)計(jì)了一種微米行程的微膨脹型熱開(kāi)關(guān)。介紹了熱開(kāi)關(guān)的結(jié)構(gòu)組成和工作原理,通過(guò)理論-仿真-試驗(yàn)相結(jié)合的方式,計(jì)算評(píng)估了熱開(kāi)關(guān)的斷開(kāi)熱阻、閉合熱阻和開(kāi)關(guān)比等關(guān)鍵熱特性。依據(jù)熱阻網(wǎng)絡(luò)串并聯(lián)關(guān)系計(jì)算熱開(kāi)關(guān)的理論特性,斷開(kāi)熱阻為301.71K/W,閉合熱阻為1.06K/W,開(kāi)關(guān)比約為283.6。基于有限元模型分析熱開(kāi)關(guān)斷開(kāi)/閉合過(guò)程的瞬態(tài)熱特性,熱端發(fā)熱功率為18 W時(shí),熱開(kāi)關(guān)閉合響應(yīng)時(shí)間為340s,觸發(fā)溫度為35.5℃,閉合熱阻約為2.3K/W。在2次熱開(kāi)關(guān)性能測(cè)試試驗(yàn)中,閉合熱阻和開(kāi)關(guān)比分別為1.08K/W、279.4和1.67K/W、180.7,試驗(yàn)數(shù)據(jù)與理論計(jì)算高度一致。同時(shí)指出:裝配調(diào)試過(guò)程的不確定性會(huì)造成微膨脹型熱開(kāi)關(guān)宏觀熱特性的小區(qū)域波動(dòng)。本文工作可為后續(xù)微膨脹型熱開(kāi)關(guān)的結(jié)構(gòu)優(yōu)化設(shè)計(jì)、機(jī)械加工細(xì)化和裝調(diào)方式改進(jìn)提供參考。
[Abstract]:In order to improve the heat dissipation ability and thermal environment adaptability of the space thermal control subsystem, a micro-expansion thermal switch with micron stroke is designed. The structure and working principle of the thermal switch are introduced. Through the combination of theory, simulation and experiment, the key thermal characteristics of the thermal switch, such as open thermal resistance, closed thermal resistance and switch ratio, are calculated and evaluated. The theoretical characteristics of the thermal switch are calculated according to the series-parallel relationship of the thermal resistance network. The thermal resistance is 301.71 K / W, the closing thermal resistance is 1.06K / W, and the switching ratio is about 283.6. The transient thermal characteristics of the hot switching / closing process are analyzed based on the finite element model. When the heating power at the hot end is 18 W, the closing response time is 340 s and the trigger temperature is 35.5 鈩，

本文編號(hào)：1577814