微米行程微膨脹型熱開關(guān)熱特性的仿真與試驗
發(fā)布時間:2018-03-07 04:00
本文選題:微膨脹型熱開關(guān) 切入點:熱特性 出處:《光學(xué)精密工程》2016年10期 論文類型:期刊論文
【摘要】:為了提高空間熱控分系統(tǒng)的散熱調(diào)節(jié)能力和熱環(huán)境適應(yīng)性,設(shè)計了一種微米行程的微膨脹型熱開關(guān)。介紹了熱開關(guān)的結(jié)構(gòu)組成和工作原理,通過理論-仿真-試驗相結(jié)合的方式,計算評估了熱開關(guān)的斷開熱阻、閉合熱阻和開關(guān)比等關(guān)鍵熱特性。依據(jù)熱阻網(wǎng)絡(luò)串并聯(lián)關(guān)系計算熱開關(guān)的理論特性,斷開熱阻為301.71K/W,閉合熱阻為1.06K/W,開關(guān)比約為283.6;谟邢拊P头治鰺衢_關(guān)斷開/閉合過程的瞬態(tài)熱特性,熱端發(fā)熱功率為18 W時,熱開關(guān)閉合響應(yīng)時間為340s,觸發(fā)溫度為35.5℃,閉合熱阻約為2.3K/W。在2次熱開關(guān)性能測試試驗中,閉合熱阻和開關(guān)比分別為1.08K/W、279.4和1.67K/W、180.7,試驗數(shù)據(jù)與理論計算高度一致。同時指出:裝配調(diào)試過程的不確定性會造成微膨脹型熱開關(guān)宏觀熱特性的小區(qū)域波動。本文工作可為后續(xù)微膨脹型熱開關(guān)的結(jié)構(gòu)優(yōu)化設(shè)計、機械加工細化和裝調(diào)方式改進提供參考。
[Abstract]:In order to improve the heat dissipation ability and thermal environment adaptability of the space thermal control subsystem, a micro-expansion thermal switch with micron stroke is designed. The structure and working principle of the thermal switch are introduced. Through the combination of theory, simulation and experiment, the key thermal characteristics of the thermal switch, such as open thermal resistance, closed thermal resistance and switch ratio, are calculated and evaluated. The theoretical characteristics of the thermal switch are calculated according to the series-parallel relationship of the thermal resistance network. The thermal resistance is 301.71 K / W, the closing thermal resistance is 1.06K / W, and the switching ratio is about 283.6. The transient thermal characteristics of the hot switching / closing process are analyzed based on the finite element model. When the heating power at the hot end is 18 W, the closing response time is 340 s and the trigger temperature is 35.5 鈩,
本文編號:1577814
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