【摘要】：采用基于隔膜電積濕法冶金新工藝從廢棄電路板銅錫多金屬粉中高效提取金屬錫,研究并優(yōu)化了銅錫多金屬粉浸出及隔膜電積提錫工藝.浸出實驗結(jié)果表明,在溫度為40℃,初始Sn~(4+)質(zhì)量濃度50 g/L,HCl濃度4 mol/L,液固比為5∶1,循環(huán)浸出三次的條件下,錫浸出率約為96%,最終浸出液中Sn~(2+)質(zhì)量濃度68.58 g/L.錫隔膜電積實驗表明,在Sn~(2+)質(zhì)量濃度40~100 g/L,HCl濃度3 mol/L,溫度35℃,電流密度200 A/m2的條件下,陰極電流效率97.51%,能耗低于1 200 k Wh/t.在此優(yōu)化條件下進行隔膜電積8 h,得到平整、致密且純度99.9%的陰極錫板.
[Abstract]:High efficiency extraction of tin from waste circuit board copper-tin polymetallic powder was carried out by a new process of hydrometallurgy based on diaphragm electrowinning. The leaching process of copper-tin polymetallic powder and electrodeposition of tin by diaphragm were studied and optimized. The results of leaching experiments show that the leaching rate of tin is about 96 under the conditions of temperature 40 鈩，

本文編號：2301256