發(fā)布時(shí)間：2018-01-07 20:28

  本文關(guān)鍵詞：微玻璃半球諧振陀螺的結(jié)構(gòu)設(shè)計(jì)及工藝研究　出處：《中北大學(xué)》2017年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： MEMS 微玻璃半球諧振子 電極結(jié)構(gòu) 吹塑成型

【摘要】：半球諧振陀螺是利用Coriolis效應(yīng)工作的振動(dòng)慣性器件,由于這種陀螺具有較高的精度和可靠性,而且擁有較長(zhǎng)的工作壽命,所以其極具發(fā)展?jié)摿�。MEMS是將微電子技術(shù)與機(jī)械工程融合在一起的一種工業(yè)技術(shù),其具有微型化、智能化、多功能、高集成度和適于大批量生產(chǎn)的特點(diǎn)。本論文提出了基于MEMS技術(shù)的微型玻璃半球諧振陀螺的設(shè)計(jì)構(gòu)想,設(shè)計(jì)并制備出不同結(jié)構(gòu)的微型玻璃半球諧振陀螺,具有高性能、小體積和低成本的優(yōu)點(diǎn)。本文首先介紹了微型半球諧振陀螺的研究背景和國(guó)內(nèi)外現(xiàn)狀,分析了半球諧振陀螺的工作原理。在此基礎(chǔ)上,本文提出了基于吹塑成型的微玻璃半球諧振子結(jié)構(gòu),并通過有限元仿真對(duì)微玻璃半球諧振子進(jìn)行了模態(tài)分析和諧響應(yīng)分析,得到其諧振頻率;提出了環(huán)形電極和硅電極兩種結(jié)構(gòu),對(duì)兩種電極結(jié)構(gòu)與諧振子的有效平均距離進(jìn)行了計(jì)算。然后針對(duì)上述微玻璃半球諧振子結(jié)構(gòu)及電極結(jié)構(gòu)特點(diǎn),分別設(shè)計(jì)了基于同步吹塑成型和基于硅-玻璃-硅三層陽(yáng)極鍵合的微玻璃半球諧振陀螺的工藝制備流程,并完成了芯片的加工制備。最后,利用掃描電子顯微鏡和原子力顯微鏡對(duì)微玻璃半球諧振陀螺進(jìn)行形貌表征,分析表明基于同步吹塑成型的微玻璃半球諧振子與環(huán)形電極的距離為73微米,基于硅-玻璃-硅三層陽(yáng)極鍵合的微玻璃半球諧振子與硅電極的距離為8±2微米,諧振子的平均表面粗糙度Ra為0.217納米,環(huán)形電極與諧振子形成的電容值Cc為0.07226pF,硅電極與半球諧振子間的電容為C_s為0.927pF,均在合理的參數(shù)范圍內(nèi)。
[Abstract]:Hemispherical resonator gyroscope is a vibratory inertial device which uses Coriolis effect because of its high precision reliability and long working life. Therefore, MEMS is a kind of industrial technology which combines microelectronics technology with mechanical engineering. It has miniaturization, intelligence and multi-function. High integration and suitable for mass production. In this paper, the design concept of micro glass hemispherical resonator gyroscope based on MEMS technology is proposed, and different structures of micro glass hemisphere resonator gyro are designed and fabricated. It has the advantages of high performance, small volume and low cost. Firstly, this paper introduces the research background and the present situation at home and abroad of the micro hemispherical resonator gyroscope, and analyzes the working principle of the micro hemispherical resonator gyroscope. In this paper, the structure of micro glass hemispherical resonator based on blow molding is proposed, and the harmonic response of micro glass hemispherical harmonic oscillator is analyzed by finite element simulation, and the resonant frequency is obtained. Two kinds of structures, ring electrode and silicon electrode, are proposed. The effective average distance between the two kinds of electrode structures and harmonic oscillator is calculated. The fabrication process of micro-glass hemispherical resonant gyroscope based on synchronous blow molding and three-layer anode bonding of silicone-glass-silicon was designed, and the fabrication of the chip was completed. Finally. Scanning electron microscope (SEM) and atomic force microscope (AFM) were used to characterize the microglass-sphere resonator gyroscope. The results showed that the distance between the microglass-sphere resonator and the ring electrode was 73 渭 m. The distance between the microglass-sphere harmonic oscillator and the silicon electrode is 8 鹵2 渭 m, and the average surface roughness of the resonator is 0.217 nm based on the silicon-glass-silicon three-layer anodic bonding. The capacitance of ring electrode and harmonic oscillator is 0.07226pF, and the capacitance between silicon electrode and hemispherical oscillator is 0.927pF, which is within the reasonable parameter range.
【學(xué)位授予單位】：中北大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TN96

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