用于降低接觸熱阻的復合黏結材料的制備優(yōu)化
發(fā)布時間:2019-05-07 15:54
【摘要】:基于提高吸附床的導熱性能,研制一種可涂于吸附床與吸附劑之間降低接觸熱阻的耐高溫耐腐蝕的高導熱復合黏結材料。通過穩(wěn)態(tài)試驗研究導熱填料、稀釋劑與偶聯劑等因素對復合黏結材料熱導率的影響,采用正交試驗方法優(yōu)化復合黏結材料的配制方案。研究結果表明:復合黏結材料的導熱性能隨著Al_2O_3導熱填料的質量分數的增加而提高,采用10μm Al_2O_3導熱填料粒子的導熱性能略高于采用35μm Al_2O_3導熱填料粒子的復合黏結材料,10μm Al_2O_3導熱填料粒子用質量分數8%的偶聯劑處理,復合黏結材料的熱導率最高。采用適當配比的導熱填料、稀釋劑與偶聯劑能顯著提高復合黏結材料的熱導率。
[Abstract]:In order to improve the thermal conductivity of the adsorption bed, a high temperature and corrosion resistant composite bonding material with high temperature and corrosion resistance was developed, which can be coated between the adsorption bed and the adsorbent to reduce the contact thermal resistance. The effects of heat conduction filler, diluent and coupling agent on the thermal conductivity of composite bonding materials were studied by steady-state test. The orthogonal test method was used to optimize the preparation scheme of composite bonding materials. The results show that the thermal conductivity of the composite binder increases with the increase of the mass fraction of Al_2O_3 filler. The thermal conductivity of 10 渭 m Al_2O_3 filler particle is slightly higher than that of 35 渭 m Al_2O_3 thermal conductive filler particle, and the 10 渭 m Al_2O_3 heat conduction filler particle is treated with 8% coupling agent. The composite bonding material has the highest thermal conductivity. The thermal conductivity of the composite bonded material can be significantly improved by proper proportion of heat conduction filler, diluent and coupling agent.
【作者單位】: 山東大學蘇州研究院;山東大學能源與動力工程學院;
【基金】:蘇州市科技發(fā)展計劃資助項目(ZXG201443) 國家自然科學基金資助項目(51476093) 山東省科技發(fā)展計劃資助項目(2013GGX10403)
【分類號】:O551.3;TB34
本文編號:2471209
[Abstract]:In order to improve the thermal conductivity of the adsorption bed, a high temperature and corrosion resistant composite bonding material with high temperature and corrosion resistance was developed, which can be coated between the adsorption bed and the adsorbent to reduce the contact thermal resistance. The effects of heat conduction filler, diluent and coupling agent on the thermal conductivity of composite bonding materials were studied by steady-state test. The orthogonal test method was used to optimize the preparation scheme of composite bonding materials. The results show that the thermal conductivity of the composite binder increases with the increase of the mass fraction of Al_2O_3 filler. The thermal conductivity of 10 渭 m Al_2O_3 filler particle is slightly higher than that of 35 渭 m Al_2O_3 thermal conductive filler particle, and the 10 渭 m Al_2O_3 heat conduction filler particle is treated with 8% coupling agent. The composite bonding material has the highest thermal conductivity. The thermal conductivity of the composite bonded material can be significantly improved by proper proportion of heat conduction filler, diluent and coupling agent.
【作者單位】: 山東大學蘇州研究院;山東大學能源與動力工程學院;
【基金】:蘇州市科技發(fā)展計劃資助項目(ZXG201443) 國家自然科學基金資助項目(51476093) 山東省科技發(fā)展計劃資助項目(2013GGX10403)
【分類號】:O551.3;TB34
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相關碩士學位論文 前1條
1 劉旭;不同黏結材料與金屬全冠黏結界面的實驗研究[D];大連醫(yī)科大學;2012年
,本文編號:2471209
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