發(fā)布時間：2018-12-18 00:24

【摘要】：為提高軟性磨粒流切削的效能,研究了利用超聲空化作用加快材料去除的方法。在分析磨粒拋光試驗和計算流體動力學(xué)仿真結(jié)果的基礎(chǔ)上,提出并驗證磨粒碰撞壁面的動能是影響切削效率主要因素的假設(shè);根據(jù)對超聲空化氣泡潰滅,及其在外圍水域中沖擊波形成與傳播的研究結(jié)果,分析氣泡潰滅在推動磨粒改變其動能時所起的增強湍流效果的作用。在此基礎(chǔ)上搭建了超聲輔助磨粒流試驗裝置,以表面覆有氧化層的硅片為試驗對象,根據(jù)其表面氧化層的去除情況,分析超聲空化對硅片表面材料去除能力的影響,并在磨粒流加工無氧化層硅片表面的試驗中,觀察到超聲空化對磨粒流切削的顯著影響。驗證了超聲空化能使磨粒流中的磨粒的動能發(fā)生改變,從而起到提高切削效率和提高表面質(zhì)量的作用,以期為超聲波作用下磨粒流加工工藝的改進(jìn)提供參考。
[Abstract]:In order to improve the efficiency of soft abrasive cutting, the method of accelerating material removal by ultrasonic cavitation was studied. Based on the analysis of abrasive polishing test and computational fluid dynamics simulation results, the hypothesis that the kinetic energy of abrasive particle collision wall is the main factor affecting cutting efficiency is proposed and verified. Based on the results of ultrasonic cavitation bubble collapse and the formation and propagation of shock waves in the surrounding waters, the effect of bubble collapse on enhancing turbulent flow when abrasive particles change their kinetic energy is analyzed. On the basis of this, an ultrasonic assisted abrasive particle flow test device was set up. The effect of ultrasonic cavitation on the removal ability of surface materials of silicon wafer was analyzed according to the removal of oxide layer on the surface of silicon wafer. The effect of ultrasonic cavitation on abrasive flow cutting was observed in the experiments of abrasive flow machining of non-oxidized silicon wafers. It is verified that ultrasonic cavitation can change the kinetic energy of abrasive particles in abrasive flow, which can improve the cutting efficiency and surface quality.
【作者單位】： 浙江工業(yè)大學(xué)機械工程學(xué)院;麗水學(xué)院浙江省特色文創(chuàng)產(chǎn)品數(shù)字化設(shè)計與智能制造重點實驗室;
【基金】：國家自然科學(xué)基金資助項目(51575494;51375446) 浙江省自然科學(xué)基金重點項目(LZ14E050001) 浙江省杰出青年科學(xué)基金項目(LR16E050001)
【分類號】：TB559;TG664

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