3D打印工藝(以前稱為快速成型(RP))是一種附加制造工藝,而不是傳統(tǒng)方法的減材制造。與傳統(tǒng)制造不同的是,傳統(tǒng)制造從一塊材料開始,機(jī)械地去除不需要的材料,直到形成所需的零件,3D打印需要一個(gè)自下而上的過程,從零開始創(chuàng)建3D有形零件,逐層構(gòu)建。該技術(shù)可廣泛應(yīng)用于工程領(lǐng)域,包括儲能裝置材料、低密度高強(qiáng)度復(fù)合材料等,但某些技術(shù)的材料選擇有限,限制了其應(yīng)用。因此,有必要對三維打印進(jìn)行更多的研究,以確定如何提高儲能裝置的性能。一般而言,3D打印過程從使用計(jì)算機(jī)輔助設(shè)計(jì)(CAD)或掃描真實(shí)物理對象的計(jì)算機(jī)中的數(shù)字模型開始。將數(shù)字模型切片,生成許多有限厚度的橫截面層,然后發(fā)送到3D打印機(jī),該打印機(jī)將這些層依次組合,直到形成物理部件。在這一領(lǐng)域的大量研究已經(jīng)產(chǎn)生了大量的添加劑制造技術(shù),包括但不限于:熔融沉積建模(FDM)、選擇性激光燒結(jié)(SLS)、立體光刻(SLA)。例如,利用由切片軟件獲得的模型橫截面圖,利用紫外激光逐層選擇性地固化光敏聚合物樹脂來制作物體。本論文旨在探討微立體光刻技術(shù)之制程,以期找到一種方法來設(shè)計(jì)與制造一個(gè)具有微尺度孔隙的復(fù)雜金屬結(jié)構(gòu)。由于依賴光聚合工藝固化聚合物樹脂的微立體光刻無...

【文章頁數(shù)】：66 頁

【學(xué)位級別】：碩士

【文章目錄】：
Abstract
摘要
Table of Major Symbols and Units
Abbreviations
Chapter I Background Information
    1.1 Introduction to3D Printing
        1.1.1 Selective Binding
        1.1.2 Selective deposition
        1.1.3 Selective solidification
    1.2 Micro-stereolithography
    1.3 Metallization process
    1.4 Supercapacitors
    1.5 Objective of the project
    1.6 Thesis structure
Chapter II Micro-stereolithography3D Printing Technique
    2.1 Introduction
    2.2 Types of Micro-stereolithography
        2.2.1 ScanningμSL
        2.2.2 Two-photon polymerization
        2.2.3 Projection Micro-stereolithography(PμSL)
        2.2.4 Projection Micro-stereolithography(PμSL)systems
    2.3 Basic fabrication Processes
    2.4 Basic set-up of PμSL system
    2.5 Photopolymerization Process
Chapter III Methodology
    3.1 Introduction
        3.1.1 CAD Model
        3.1.2 Slicing of stl file
        3.1.3 Parameter setting
        3.1.4 Actual printing process
        3.1.5 Part removal
        3.1.6 Post-processing
    3.2 Results and discussion
    3.3 Mechanical test
        3.3.1 Introduction
        3.3.2 Theory
        3.3.3 Tensile test procedure
    3.4 Results
        3.4.1 Engineering stress and engineering strain
    3.5 Conclusion
Chapter IV Metallization process
    4.1 Introduction
        4.1.1 Vacuum metallization
        4.1.2 Thermal spray processes
        4.1.3 Electroless plating metallization
        4.1.4 Electroplating metallization
    4.2 Electroless Nickel Plating
        4.2.1 Introduction
        4.2.2 Electroless plating procedure
        4.2.3 Pre-treatment
        4.2.4 Actual electroless nickel plating
        4.2.5 Explanation
    4.3 Factors affecting electroless nickel plating process
        4.3.1 Stabilizers
        4.3.2 Energy
        4.3.3 pH
    4.4 Results and discussion
    4.5 Conclusion
Chapter V Conclusion and Future Work
    6.1 Conclusion
    6.2 Future work
References
Appendix A Mathematical model
Acknowledgement



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