【摘要】：在高真空條件下采用Ti-35Zr-35Ni-15Cu(質(zhì)量分?jǐn)?shù)/%)釬料對(duì)SiC陶瓷進(jìn)行了釬焊連接,研究了接頭界面組織的形成過(guò)程以及工藝參數(shù)對(duì)接頭性能的影響。結(jié)果表明:釬料與SiC陶瓷發(fā)生了復(fù)雜的界面反應(yīng),生成了多種界面產(chǎn)物。當(dāng)釬焊溫度為960℃,保溫時(shí)間為10min時(shí),SiC陶瓷側(cè)形成了連續(xù)的TiC和Ti5Si3+Zr2Si層,同時(shí)Ti5Si3+Zr2Si向釬縫中心生長(zhǎng)呈長(zhǎng)條狀。SiC陶瓷到接頭釬縫中心的顯微組織依次為:SiC/TiC/Ti5Si3+Zr2Si/Zr(s,s)/Ti(s,s)+Ti2(Cu,Ni)/(Ti,Zr)(Ni,Cu)。釬焊溫度為960℃,保溫時(shí)間為30min時(shí),長(zhǎng)條狀的Ti5Si3+Zr2Si貫穿了整個(gè)接頭。釬焊接頭強(qiáng)度隨著釬焊溫度的升高和釬焊時(shí)間的延長(zhǎng)都呈現(xiàn)先增大后減小的趨勢(shì)。當(dāng)釬焊溫度為960℃,保溫時(shí)間為10min時(shí),接頭的剪切強(qiáng)度最高,達(dá)到了110MPa。
[Abstract]:Ti-35Zr-35Ni-15Cu (mass fraction /%) filler metal was used to braze the SiC ceramics in high vacuum condition. The formation process of interface structure and the effect of process parameters on the properties of the joint were studied. The results show that the solder and SiC ceramics have a complex interfacial reaction and a variety of interfacial products are formed. When brazing temperature is 960 鈩，

本文編號(hào)：2427450