本文選題：薄切片翹曲　切入點(diǎn)：雙線電火花線切割　出處：《哈爾濱工業(yè)大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：近年來,隨著智能終端、便攜式計(jì)算機(jī)、移動(dòng)通信及軍事電子技術(shù)對(duì)硬件要求微型化的發(fā)展,切割出高質(zhì)量薄尺寸的基片與封裝切片成為目前加工制造業(yè)的難題。在該方面,多線切割(線鋸)是目前比較主流的技術(shù),但相比而言,具有諸多優(yōu)勢的電火花線切割加工技術(shù)因其非接觸加工的特點(diǎn),加工的切片,尤其是脆硬材料切片,具有表面質(zhì)量好、損傷層厚度薄、成品率高的優(yōu)點(diǎn)。然而該工藝方法除了效率問題外,切割較薄切片時(shí)切片易翹曲變形導(dǎo)致的加工質(zhì)量難控問題嚴(yán)重阻礙了其進(jìn)一步推廣和應(yīng)用。因此如何減小切片翹曲度、提高加工精度及其切割加工效率是本文的研究重點(diǎn)。本文首先針對(duì)薄切片的翹曲現(xiàn)象進(jìn)行了單線電火花線切割觀察實(shí)驗(yàn),研究了脈沖放電能量、工件厚度及切片厚度等加工參數(shù)對(duì)切片翹曲度的影響。在完成對(duì)脈沖放電能量、脈沖放電通道半徑、模型熱源分析的前提下,針對(duì)單雙線電火花線切割加工這兩種不同加工工藝對(duì)加工薄切片的影響進(jìn)行了仿真建模,并分析了兩種加工條件下加工材料的溫度與內(nèi)部應(yīng)力分布云圖的差異及二者與加工切片翹曲程度的關(guān)系�；谇懊娴难芯�,設(shè)計(jì)制造了一套雙線電火花線切割的絲間距調(diào)節(jié)裝置,并在原有電火花機(jī)床工作臺(tái)本體上搭建了間距可調(diào)節(jié)雙線電火花線切割加工系統(tǒng),該裝置成功實(shí)現(xiàn)了通過調(diào)節(jié)絲間距來控制加工切片厚度的目標(biāo)。針對(duì)單線切割過程中加工切片厚度低于120μm時(shí)翹曲嚴(yán)重的問題,進(jìn)行了單雙線薄切片加工對(duì)比實(shí)驗(yàn),結(jié)果顯示本系統(tǒng)可以控制厚度120μm以下加工切片的翹曲變形。為了解決多線電火花線切割精度的問題,本文以雙線切割為研究對(duì)象,通過分析其精度的影響因素,建立了雙線電火花線切割加工切片切槽模型,研究了絲間距調(diào)節(jié)精度、運(yùn)絲速度、電極絲張力、沖液等因素對(duì)加工切片厚度誤差的影響,通過手動(dòng)調(diào)節(jié)補(bǔ)償,可將切片誤差控制在5μm內(nèi)。本文最后進(jìn)行了單雙線切割效率的對(duì)比實(shí)驗(yàn),結(jié)果顯示雙線切割的效率可較單線時(shí)提高79.8%,后續(xù)實(shí)驗(yàn)中通過采集放電波形,統(tǒng)計(jì)放電狀態(tài),對(duì)效率提高的原因以及峰值電流、脈寬、脈間等電參數(shù)對(duì)放電狀態(tài)的影響規(guī)律進(jìn)行了分析。
[Abstract]:In recent years, with the development of intelligent terminal, portable computer, mobile communication and military electronic technology, cutting high quality and thin size substrates and packaging chips has become a difficult problem in the current manufacturing industry. Multi-wire cutting (wire saw) is the mainstream technology at present, but in contrast, the WEDM technology, which has many advantages, has good surface quality because of its non-contact processing characteristics, especially the brittle hard material slice. The damage layer has the advantages of thin thickness and high yield. However, in addition to the efficiency problem, The difficult control of the processing quality caused by the easy warping and deformation of slicing when cutting thin slice seriously hinders its further popularization and application. Therefore, how to reduce the warpage of slice, Improving machining accuracy and cutting efficiency is the focus of this paper. Firstly, the single wire EDM observation experiment is carried out for the warpage phenomenon of thin slice, and the pulse discharge energy is studied. The effect of machining parameters such as workpiece thickness and slice thickness on the warpage of the chip is obtained. On the premise of the analysis of pulse discharge energy, pulse discharge channel radius and model heat source, The effects of two different machining processes on the processing of thin slice were simulated and modeled. The difference between temperature and internal stress distribution of processing material and the relationship between them and the degree of warping of processing slice are analyzed. This paper designs and manufactures a set of wire spacing adjusting device for two-wire WEDM, and sets up a two-wire WEDM system on the original EDM worktable body, which can adjust the distance between EDM and EDM. The device has successfully realized the goal of controlling the thickness of processing slice by adjusting the spacing of wire. Aiming at the serious warpage problem of processing slice thickness less than 120 渭 m in the process of single wire cutting, a contrast experiment of single and double wire thin slice processing has been carried out. The results show that the system can control the warpage deformation of the slice below 120 渭 m thickness. In order to solve the problem of the precision of multi-wire WEDM, this paper takes the double-wire cutting as the research object, and analyzes the influencing factors of the precision. The cutting slot model of two-wire WEDM was established, and the effects of wire spacing adjustment accuracy, wire speed, wire tension and flushing on slice thickness error were studied, which were compensated by manual adjustment. The slice error can be controlled within 5 渭 m. Finally, a comparative experiment on the efficiency of single and double wire cutting is carried out. The results show that the efficiency of double wire cutting is 79.8% higher than that of single wire. In the subsequent experiments, the discharge waveform is collected and the discharge state is counted. The effect of peak current, pulse width and inter-pulse electric parameters on the discharge state is analyzed.
【學(xué)位授予單位】：哈爾濱工業(yè)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TG484

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本文編號(hào)：1611801