【摘要】：通過正交試驗(yàn)研究了TC4鈦合金的真空擴(kuò)散連接工藝,進(jìn)行了擴(kuò)散連接接頭的剪切強(qiáng)度試驗(yàn)。通過光學(xué)顯微鏡(OM)、掃描電鏡(SEM)等分析手段,研究擴(kuò)散連接溫度、壓力、時(shí)間等參數(shù)對TC4真空擴(kuò)散連接質(zhì)量及擴(kuò)散連接接頭剪切強(qiáng)度的影響。結(jié)果表明:擴(kuò)散連接溫度920℃,壓力3 MPa,保溫保壓30 min時(shí),擴(kuò)散連接界面完全與基體相融,局部微孔等缺陷基本消失,孔洞彌合率達(dá)到98.63%,擴(kuò)散連接接頭的剪切強(qiáng)度為467.83 MPa,達(dá)到了母材剪切強(qiáng)度(480MPa)的97.46%。
[Abstract]:The vacuum diffusion bonding process of TC4 titanium alloy was studied by orthogonal test, and the shear strength test of the diffusion bonding joint was carried out. By means of optical microscope (OM) and scanning electron microscope (SEM), the influence of diffusion bonding temperature, pressure, time and other parameters on the connection quality of the TC4 vacuum diffusion and the shear strength of the diffusion bonding joint was studied. The results show that when the diffusion bonding temperature is 920 鈩，

本文編號：2512572