【摘要】：當(dāng)下,鋁合金表面的氧化膜已經(jīng)成為其更加廣泛發(fā)展應(yīng)用的關(guān)鍵制約。工業(yè)上常采用電鍍的方式對Al合金進(jìn)行改性,但電鍍廢液會造成環(huán)境污染。超聲波在液態(tài)釬料中傳播過程中會伴隨空化和聲流效應(yīng)的形成,這兩種效應(yīng)可以用來擊碎Al合金表面的氧化膜,促進(jìn)液態(tài)釬料在Al合金表面潤濕鋪展,形成冶金結(jié)合。Sn基釬料被廣泛的應(yīng)用于電子產(chǎn)業(yè),但Sn-Al之間的互溶度很小,也不會形成冶金結(jié)合,阻礙了Al合金在電子產(chǎn)業(yè)領(lǐng)域的應(yīng)用�；诖�,采用超聲波輔助釬焊法釬焊了1060Al合金,系統(tǒng)的研究了工藝對Sn-Al結(jié)合的影響,以及對接頭組織性能的影響,并分析了超聲波作用下的Sn與Al結(jié)合機(jī)制。同時采用超聲波輔助釬焊法實現(xiàn)在Al合金表面鍍覆Sn基釬料,得到最優(yōu)異的鍍覆工藝參數(shù)。試驗結(jié)果表明,溫度為300℃,超聲作用10 s的條件下,三種Sn釬料均可得到質(zhì)量良好的接頭。純Sn釬料釬焊接頭的組織為α-Al和β-Sn,接頭最高剪切強(qiáng)度為38 MPa,接頭斷裂位置位于界面處,為韌性斷裂模式。Sn-9Zn釬料釬焊接頭的組織為Sn-9Zn共晶、α-Al及桿狀富Zn相,接頭最高剪切強(qiáng)度為61 MPa,斷裂位置位于焊縫,為韌性斷裂。Sn-3Ag釬料釬焊接頭組織為Sn-3Ag共晶、α-Al以及Ag2Al,接頭最高強(qiáng)度為48 MPa,斷裂位置位于焊縫,斷裂形式為沿晶斷裂。升高溫度和增加超聲作用時間,均會增加焊縫中的含Al量,提高界面的結(jié)合效果,溫度為400℃時焊縫中的含Al量為10.03%。Zn元素的加入會促進(jìn)Sn在Al表面的潤濕鋪展,促進(jìn)Sn向母材中的溶解,增強(qiáng)Sn-Al的界面結(jié)合。溫度為300℃,超聲間隔加載12 s,可實現(xiàn)在Al基板表面局部鍍覆純Sn從而實現(xiàn)對Al基板進(jìn)行表面改性,熱風(fēng)整平工藝可得到平整鍍覆Sn層以及平滑過渡的天線焊點(diǎn)。溫度為300℃,超聲作用10 s可實現(xiàn)在Al基板表面局部鍍覆Sn-9Zn層。采用大功率超聲波焊機(jī)可實現(xiàn)對大面積Al基板全面改性,增加超聲功率和延長超聲作用時間可以增強(qiáng)表面鍍覆效果。Al/Cu回流焊過程中,表面鍍覆有純Sn的Al基板界面結(jié)合良好,未發(fā)現(xiàn)裂紋及孔洞。
[Abstract]:At present, the oxide film on the surface of aluminum alloy has become the key constraint of its more extensive development and application. Al alloy is often modified by electroplating in industry, but electroplating waste liquid will cause environmental pollution. Ultrasonic wave propagation in liquid solder will be accompanied by cavitation and sound flow effect. These two effects can be used to break the oxide film on the surface of Al alloy, promote the wetting and spreading of liquid solder on the surface of Al alloy, and form metallurgical bonding. SN based solder is widely used in electronic industry, but the mutual solubility between Sn-Al is very small and does not form metallurgical bonding, which hinders the application of Al alloy in the field of electronic industry. Based on this, 1060Al alloy was brazed by ultrasonic assisted brazing. The effect of process on the bonding of Sn-Al and the microstructure and properties of the joint was studied systematically, and the bonding mechanism between Sn and Al under ultrasonic wave was analyzed. At the same time, the Sn base solder was coated on the surface of Al alloy by ultrasonic assisted brazing method, and the best plating process parameters were obtained. The experimental results show that the joints with good quality can be obtained by three kinds of Sn solder under the condition of temperature of 300 鈩，

本文編號：2500613