【摘要】：隨著電子產(chǎn)品微型化趨勢的不斷推進(jìn),電遷移成為不可忽視的可靠性問題。微型化的推進(jìn)迫使微焊點(diǎn)的尺寸不斷減小,通過焊點(diǎn)中的電流密度持續(xù)增高,目前通過焊點(diǎn)的電流密度已經(jīng)高達(dá)104A/cm2。另外,電子產(chǎn)品在無鉛化過渡期間,勢必存在著有鉛和無鉛的復(fù)合現(xiàn)象。目前對復(fù)合焊點(diǎn)的研究還停留在工藝和組織性能上,其電遷移可靠性的研究還存在空白。因此,對無鉛焊點(diǎn)和復(fù)合焊點(diǎn)電遷移可靠性的研究具有重要意義。本研究中首先對不同Ag含量的Sn-Ag-Cu無鉛焊點(diǎn)在熱電耦合條件下的電遷移行為進(jìn)行了研究,重點(diǎn)討論了Ag含量和溫度等影響因素對焊點(diǎn)界面電遷移行為的影響,同時(shí)研究了電遷移對焊點(diǎn)力學(xué)性能的影響。隨后對Sn-3.0Ag-0.5Cu釬料和Sn-37Pb釬料復(fù)合焊點(diǎn)的電遷移行進(jìn)行了研究,重點(diǎn)討論了單一成分焊點(diǎn)和復(fù)合焊點(diǎn)電遷移中的界面行為,給出了界面IMC生長模型,并對焊點(diǎn)的電遷移平均失效時(shí)間進(jìn)行了計(jì)算。研究結(jié)果表明,一定范圍內(nèi)Ag含量的增加,有效的提高了焊點(diǎn)的電遷移可靠性,溫度對電遷移行為起到了促進(jìn)作用。焊點(diǎn)基體中的β-Sn相具有強(qiáng)烈的各向異性,導(dǎo)致電遷移過程中流經(jīng)β-Sn相的原子通量不平衡,晶粒發(fā)生旋轉(zhuǎn)進(jìn)而在焊點(diǎn)表明形成了晶界的凸起和凹陷。電遷移對焊點(diǎn)的拉伸性能具有明顯影響,降低了焊點(diǎn)的拉伸強(qiáng)度,界面IMC的遷移削弱了界面和基板的結(jié)合強(qiáng)度,使焊點(diǎn)的斷裂位置由釬料斷裂向陰極界面斷裂轉(zhuǎn)變。在復(fù)合焊點(diǎn)電遷移行為的研究中,研究發(fā)現(xiàn)結(jié)構(gòu)復(fù)合焊點(diǎn)中Sn-3.0Ag-0.5Cu網(wǎng)狀共晶相在熱電耦合的作用下發(fā)生粗化,并由陰極向陽極遷移。通電500h前,焊點(diǎn)陽極界面厚度沒有明顯的增加,通電超過500h后,Sn-3.0Ag-0.5Cu合金中大量的Cu6Sn5顆粒逐漸遷移至陽極界面,使其厚度快速增加。電遷移作用下,焊點(diǎn)陰極界面IMC厚度的變化受到其自身IMC厚度的影響,而陽極界面IMC的厚度受到釬料合金成分、焊點(diǎn)結(jié)構(gòu)、通電時(shí)間和溫度等多種因素的影響。通過有限元方法研究了焊點(diǎn)中電流密度分布和溫度分布,結(jié)果表明,電流的加載方式對焊點(diǎn)中電流密度分布有明顯影響,結(jié)構(gòu)復(fù)合焊點(diǎn)的焦耳熱生成介于有鉛焊點(diǎn)和無鉛焊點(diǎn)之間。Black方程計(jì)算結(jié)果表明,結(jié)構(gòu)復(fù)合焊點(diǎn)的平均失效時(shí)間介于Sn-Ag-Cu焊點(diǎn)和Sn-37Pb焊點(diǎn)之間。
[Abstract]:With the development of the miniaturization trend of electronic products, the electrical migration becomes an unnegligible reliability problem. The microminiaturization of the push force forces the size of the microsolder joint to decrease continuously, and the current density through the welding spot continues to increase, and the current density through the welding spot is now up to 104A/ cm2. In addition, during the lead-free transition of the electronic product, there will be a combination of lead and lead-free. At present, the research of composite welding spot is still in process and organization performance, and the research of its electromigration reliability is also blank. Therefore, the research on the reliability of the electromigration reliability of the lead-free solder joint and the composite welding spot is of great significance. In this study, the electro-migration behavior of Sn-Ag-Cu lead-free solder joint with different Ag content under the condition of thermoelectric couple is studied. The influence of the influence factors such as Ag content and temperature on the electromigration behavior of the interface is discussed, and the effect of electromigration on the mechanical properties of the solder joint is also studied. In this paper, the electrical migration of Sn-3.0Ag-0.5Cu and Sn-37Pb composite solder joints is studied. The interface behavior of the single-component solder joint and the composite solder joint is discussed, and the growth model of the interface IMC is given, and the average failure time of the electric migration of the solder joint is calculated. The results show that the increase of Ag content in a certain range can effectively improve the reliability and the temperature of the solder joint. The Sn-Sn phase in the solder joint matrix has strong anisotropy, resulting in an imbalance of the atomic flux flowing through the Si-Sn phase during the electromigration process, and the rotation of the crystal grains further indicates that the grain boundary is formed and the depression is formed at the welding spot. The electrical migration has an obvious influence on the tensile property of the solder joint, the tensile strength of the welding spot is reduced, the migration of the interface IMC reduces the bonding strength of the interface and the substrate, and the fracture position of the welding spot is changed from the fracture of the graphite material to the cathode interface. In the study of electromigration behavior of composite solder joint, it was found that the Sn-3.0Ag-0.5Cu mesh eutectic phase in the structure composite solder joint was coarsened under the action of the thermo-electric coupling and migrated from the cathode to the anode. The thickness of the anodic interface of the solder joint was not obviously increased before 500 h, and the large amount of Cu6Sn5 particles in the Sn-3.0Ag-0.5Cu alloy gradually migrated to the anode interface and the thickness of the Sn-3.0Ag-0.5Cu alloy gradually increased. Under the action of electromigration, the change of the IMC thickness of the cathode interface of the welding spot is affected by the thickness of the IMC, and the thickness of the IMC in the anode interface is affected by various factors such as the composition of the alloy, the structure of the welding spot, the time of the energization and the temperature. The current density distribution and temperature distribution in the welding spot are studied by the finite element method. The results show that the current loading mode has a significant influence on the current density distribution in the welding spot, and the Joule heat of the structure composite welding spot is between the lead-free solder joint and the lead-free solder joint. The results of the Black equation show that the average failure time of the structural composite solder joint is between the Sn-Ag-Cu solder joint and the Sn-37Pb solder joint.
【學(xué)位授予單位】：江蘇科技大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2016
【分類號】：TG40

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