【摘要】：采用差示掃描量熱法、X射線衍射及透射電子顯微鏡研究了固溶和固溶一冷軋Ag-7wt.%Cu合金在時(shí)效過(guò)程中富Cu相的析出動(dòng)力學(xué)和形貌特征,同時(shí)結(jié)合電阻率和顯微硬度的測(cè)量,定量對(duì)比了固溶和固溶一冷軋Ag-7wt.%Cu合金時(shí)效過(guò)程中富Cu相對(duì)電阻率和硬度的影響及其機(jī)理.研究結(jié)果表明:固溶樣品中富Cu相反應(yīng)溫度為300℃-350℃,析出激活能為(111±1.6)kJ/mol;而固溶一冷軋樣品中由于形變能的存在,富Cu相溫度降低為290℃-330℃,析出激活能升高為(128±12)kJ/mol.XRD結(jié)果證實(shí)富Cu相的析出過(guò)程與時(shí)效溫度有關(guān).固溶和固溶一冷軋合金在450℃時(shí)效后均能觀察到球狀的富Cu相,富Cu相的析出和溶解過(guò)程對(duì)電阻率和顯微硬度有顯著影響.當(dāng)時(shí)效溫度低于450℃時(shí),隨時(shí)效溫度的提高,固溶一時(shí)效樣品的電阻率降低,顯微硬度增加:而固溶一冷軋一時(shí)效樣品的電阻率和顯微硬度均逐漸降低.顯微硬度除了受富Cu相的影響外,還受到位錯(cuò)和形變孿晶的影響.當(dāng)時(shí)效溫度高于450℃時(shí),兩種樣品的電阻率增大,而顯微硬度降低.
[Abstract]:The precipitation kinetics and morphology of Cu-rich phase in solid solution and solid solution cold rolled Ag-7wt.%Cu alloy during aging were studied by differential scanning Calorimeter (DSC), X-ray diffraction (XRD) and transmission electron microscope (TEM). At the same time, combined with the measurement of resistance and microhardness, the effects and mechanism of relative resistance and hardness of Cu rich in solid solution and solid solution cold rolled Ag-7wt.%Cu alloy during aging were quantitatively compared. The results show that the reaction temperature of Cu rich in solid solution is 300 鈩，

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