【摘要】：利用化學(xué)鍍Ni-Cu-P工藝對(duì)換熱器常用材料低碳鋼進(jìn)行改性,研究Ni-Cu-P鍍層表面鐵細(xì)菌污垢特性。將試樣置于鐵細(xì)菌懸液中進(jìn)行為期5天的污垢沉積實(shí)驗(yàn),記錄Ni-Cu-P鍍層表面鐵細(xì)菌污垢沉積量、腐蝕失重量以及鐵細(xì)菌生長(zhǎng)變化情況,分析鐵細(xì)菌污垢實(shí)驗(yàn)前后鍍層表面微觀形貌。測(cè)試不同時(shí)間的極化曲線和電化學(xué)阻抗譜,定性分析極化曲線和阻抗譜的變化規(guī)律,采用Zsimp Win擬合出最佳等效電路模型。研究結(jié)果表明,Ni-Cu-P鍍層可以有效抑制微生物污垢生長(zhǎng),與未施鍍的碳鋼試樣對(duì)比,Ni-Cu-P改性表面污垢沉積量減少89.1%,表面失重量減少80.2%。Ni-Cu-P鍍層自腐蝕電位高于碳鋼,自腐蝕電流密度比碳鋼小,且容抗弧半徑大于碳鋼,展現(xiàn)了較好的耐蝕性。鐵細(xì)菌對(duì)Ni-Cu-P鍍層的腐蝕速度先減小后增大,在12h腐蝕速度最小。
[Abstract]:Low carbon steel, a common material of heat exchanger, was modified by electroless Ni-Cu-P process, and the characteristics of iron bacterial fouling on the surface of Ni-Cu-P coating were studied. The samples were deposited in the suspension of iron bacteria for 5 days to record the amount of iron bacteria fouling, the weight loss of corrosion and the growth of iron bacteria on the surface of Ni-Cu-P coating. The micromorphology of the coating surface before and after the iron bacterial fouling experiment was analyzed. The polarization curves and electrochemical impedance spectra at different time were measured, and the variation of polarization curves and impedance spectra were qualitatively analyzed. The optimal equivalent circuit model was fitted by Zsimp Win. The results show that Ni-Cu-P coating can effectively inhibit the growth of microbial fouling. Compared with the uncoated carbon steel sample, the amount of fouling deposited on the modified surface of Ni-Cu-P can be reduced by 89.1. The corrosion potential of 80.2%.Ni-Cu-P coating is higher than that of carbon steel, the corrosion current density is smaller than that of carbon steel, and the arc radius of capacitive resistance is larger than that of carbon steel, which shows good corrosion resistance. The corrosion rate of iron bacteria on Ni-Cu-P coating decreases first and then increases, and the corrosion rate is the lowest at 12 h.
【作者單位】： 東北電力大學(xué)能源與動(dòng)力工程學(xué)院;
【基金】：國(guó)家自然科學(xué)基金項(xiàng)目(51476025)
【分類(lèi)號(hào)】：TG174.4

【相似文獻(xiàn)】

相關(guān)期刊論文 前10條

1 王瑞;孟國(guó)哲;Sr亞薇;張濤;王艷秋;;Ni-Cu-P化學(xué)沉積鍍層初期沖刷腐蝕的電化學(xué)行為[J];金屬熱處理;2013年01期

2 鐘惠妹,黃振霞,許彩霞,陳震;超聲波化學(xué)鍍Ni-Cu-P合金[J];電鍍與涂飾;2005年06期

3 黃亮;高巖;鄭志軍;李浩;;Cu對(duì)鋁基化學(xué)鍍Ni-Cu-P鍍層耐蝕性能的影響[J];功能材料;2007年04期

4 賈志華,王玉平;鎂及其鎂合金化學(xué)鍍Ni-Cu-P三元合金沉積工藝的研究[J];金屬世界;2004年02期

5 羅娟;朱流;酈劍;;硬質(zhì)合金Ni-Cu-P化學(xué)鍍工藝及鍍層組織性能研究[J];材料熱處理學(xué)報(bào);2010年10期

6 劉波,黃燕濱,張平,孟昭福,劉德鋼,許曉麗,褚慶國(guó);酸性化學(xué)鍍Ni-Cu-P工藝及性能研究[J];電鍍與涂飾;2005年03期

7 陳益兵;趙芳霞;張振忠;孫曉東;;純銅化學(xué)鍍Ni-Cu-P工藝的研究[J];電鍍與環(huán)保;2013年02期

8 何素珍;黃新民;鄭華明;李鵬;林志平;單傳麗;;化學(xué)鍍Ni-Cu-P鍍層在3種腐蝕介質(zhì)中沖蝕行為的研究[J];摩擦學(xué)學(xué)報(bào);2009年04期

9 吳宜勇,趙永春,姚枚,胡信國(guó);化學(xué)鍍Ni-Cu-P合金的熱穩(wěn)定性[J];材料保護(hù);1995年09期

10 蔣太祥,吳輝煌;化學(xué)沉積Ni-Cu-P合金及晶化處理對(duì)鍍層結(jié)構(gòu)和硬度的影響[J];廈門(mén)大學(xué)學(xué)報(bào)(自然科學(xué)版);2000年05期

相關(guān)會(huì)議論文 前1條

1 劉波;黃燕濱;時(shí)小軍;張平;劉德剛;許曉麗;褚慶國(guó);;酸性化學(xué)鍍Ni-Cu-P工藝及性能研究[A];第七屆全國(guó)化學(xué)鍍會(huì)議論文集[C];2004年

相關(guān)碩士學(xué)位論文 前1條

1 趙林南;壓電陶瓷表面化學(xué)鍍Ni-Cu-P合金鍍層及其性能研究[D];濟(jì)南大學(xué);2016年

，

本文編號(hào)：2397048