【摘要】：多層銅布線經(jīng)過化學(xué)機(jī)械平坦化(CMP)后,銅線條表面會殘留CuO顆粒,它會對器件的穩(wěn)定性有很大的影響,因此在CMP后清洗時(shí)必須把CuO從銅表面去除。這就要求有一種可以有效去除銅表面CuO的清洗劑。本研究中提出的新型復(fù)合清洗劑主要解決兩個(gè)問題:一個(gè)是CuO的去除,另一個(gè)是防止清洗液對銅表面造成腐蝕。清洗劑的主要成分有兩種,一種是FA/OⅡ型堿性螯合劑,它主要用來去除CuO,另一種是FA/OI型表面活性劑,它主要用來解決銅表面的腐蝕問題。通過在銅光片的表面生成氧化銅膜層,利用清洗劑對氧化層的清洗能力來反映其對于CuO的去除能力。表面活性劑的抗腐蝕能力主要通過電化學(xué)實(shí)驗(yàn)來反映。最后通過對清洗后12英寸圖形片上的缺陷分析,驗(yàn)證清洗液對拋光后銅表面殘余CuO實(shí)際清洗效果。結(jié)果表明,本文提出的復(fù)合清洗劑在不腐蝕銅表面的前提下能有效去除CuO,并且對晶圓表面缺陷的整體去除效果良好。
[Abstract]:After the multilayer copper wiring has been chemically and mechanically flattened (CMP), CuO particles will remain on the copper wire strip surface, which will have a great influence on the stability of the device. Therefore, the CuO must be removed from the copper surface during the cleaning after CMP. This requires a cleaning agent that can effectively remove CuO from copper surfaces. The new compound cleaning agent proposed in this study mainly solves two problems: one is the removal of CuO and the other is to prevent the corrosion of copper surface caused by cleaning liquid. There are two main components of cleaning agent, one is FA/O 鈪，

本文編號：2360809