【摘要】：通過集束拉拔技術(shù)制備了高強(qiáng)高導(dǎo)Cu-Nb微觀復(fù)合材料,采用X射線衍射和掃描電鏡等手段分析了不同熱處理?xiàng)l件下材料晶體取向和界面結(jié)構(gòu)的演變,通過應(yīng)力應(yīng)變曲線和電導(dǎo)測試研究了不同熱處理?xiàng)l件對材料強(qiáng)度和電導(dǎo)的影響規(guī)律,結(jié)果表明:700℃熱處理就可促使形成Cu、Nb的再結(jié)晶織構(gòu),由極塑變形所導(dǎo)致的區(qū)域化學(xué)勢差異及原子擴(kuò)散是影響Cu/Nb界面穩(wěn)定性的關(guān)鍵因素;而700℃的中間熱處理可以極大改善材料后續(xù)的加工塑性,同時(shí)在一定后續(xù)形變量條件下仍可獲得高強(qiáng)度性能,而且通過低溫調(diào)整熱處理可改善材料導(dǎo)電性,同時(shí)保持較高強(qiáng)度。
[Abstract]:High strength and high conductivity Cu-Nb microcomposites were prepared by cluster drawing technique. The evolution of crystal orientation and interface structure under different heat treatment conditions were analyzed by means of X-ray diffraction and scanning electron microscope. The effects of different heat treatment conditions on the strength and conductivity of Cu,Nb were studied by means of stress-strain curves and conductance measurements. The results showed that the recrystallization texture of Cu,Nb could be formed by heat treatment at 700 鈩，

本文編號(hào)：2353837