【摘要】：通過集束拉拔技術制備了高強高導Cu-Nb微觀復合材料,采用X射線衍射和掃描電鏡等手段分析了不同熱處理條件下材料晶體取向和界面結(jié)構(gòu)的演變,通過應力應變曲線和電導測試研究了不同熱處理條件對材料強度和電導的影響規(guī)律,結(jié)果表明:700℃熱處理就可促使形成Cu、Nb的再結(jié)晶織構(gòu),由極塑變形所導致的區(qū)域化學勢差異及原子擴散是影響Cu/Nb界面穩(wěn)定性的關鍵因素;而700℃的中間熱處理可以極大改善材料后續(xù)的加工塑性,同時在一定后續(xù)形變量條件下仍可獲得高強度性能,而且通過低溫調(diào)整熱處理可改善材料導電性,同時保持較高強度。
[Abstract]:High strength and high conductivity Cu-Nb microcomposites were prepared by cluster drawing technique. The evolution of crystal orientation and interface structure under different heat treatment conditions were analyzed by means of X-ray diffraction and scanning electron microscope. The effects of different heat treatment conditions on the strength and conductivity of Cu,Nb were studied by means of stress-strain curves and conductance measurements. The results showed that the recrystallization texture of Cu,Nb could be formed by heat treatment at 700 鈩，

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