【摘要】：無鉛焊膏是表面貼裝技術(shù)(SMT)中的重要耗材,隨著表面貼裝技術(shù)的快速發(fā)展,無鉛焊膏的可靠性研究得到了廣泛關(guān)注。無鉛焊膏的可靠性是與釬料的成分、焊膏的粘度、印刷效果和回流焊溫度曲線有關(guān)。因此,本文針對新型無鉛釬料SACBN07制備性能相匹配的焊膏,在印刷中控制好印刷參數(shù)并制定新焊膏的回流曲線進行回流焊接;用所制備的新型焊膏與市場上的SAC305焊膏進行冷熱循環(huán)實驗對比。利用剪切實驗、納米壓痕實驗等微觀測試方法研究冷熱循環(huán)后界面組織及力學性能的變化。具體內(nèi)容及結(jié)果如下:研究表明:通過三組試驗對比得出實驗錫膏中新型釬料粉末所占質(zhì)量分數(shù)為87.5%時,焊錫膏的粘度合適印刷效果最好。根據(jù)SACBN07釬料的DSC曲線,制定適應(yīng)的回流工藝曲線更好的發(fā)揮焊膏的作用,得到可靠的焊點�；亓骱盖�為預熱區(qū)溫度150℃,活性區(qū)溫度為195℃,保溫區(qū)溫度為260℃,冷卻區(qū)溫度為150℃,整個焊接時間為554 s。對SAC305焊膏和SACBN07焊膏進行鋪展實驗。SACBN07的鋪展系數(shù)為84.3%,SAC305錫膏鋪展系數(shù)為81.1%。新型錫膏的鋪展系數(shù)略高于SAC305錫膏;Bi、Ni元素的添加增大了SAC系釬料的鋪展面積,使焊錫膏潤濕性得到改善。在冷熱循環(huán)600 h實驗后,通過統(tǒng)計SAC305和SACBN07兩種焊膏所焊接接頭出現(xiàn)裂紋的情況,SACBN07/Cu有裂紋焊點的比例29.2%,SAC305/Cu有裂紋焊點的比例為48.3%。冷熱循環(huán)實驗后,SACBN07焊膏與SAC305焊膏形成的焊點的界面化合物逐漸變厚,呈層狀生長。600 h后SAC305/Cu焊點界面化合物層明顯比SACBN07/Cu焊點界面IMC厚,新型錫膏中的Bi、Ni元素有效的抑制了IMC的生長,SACBN07/Cu界面IMC為蠕蟲狀的(Cu,Ni)6Sn5,相比高銀焊膏SAC305/Cu焊點化合物Cu6Sn5晶粒尺寸明顯細化。SACBN07/Cu焊點界面化合物層厚度比SAC305/Cu低16%,SACBN07/Cu界面化合物生長速率更小。Ni的添加對IMC層的生長有很好的抑制作用;Bi的添加使IMC層生長速率下降,低于SAC305/Cu界面IMC的生長速率。600 h冷熱循環(huán)后SACBN07/Cu體釬料硬度與實驗前的相比降低了17.4%,SAC305/Cu與實驗前釬料硬度相比降低了31.3%,SACBN07/Cu的軟化程度小于SAC305/Cu。冷熱循環(huán)后SAC305/Cu剪切強度較SACBN07/Cu低31.4%,SACBN07/Cu抗剪切性能優(yōu)于SAC305/Cu。
[Abstract]:Lead-free solder paste is an important consumable material in surface mounting technology (SMT). With the rapid development of surface mounting technology, the reliability of lead-free solder paste has been widely concerned. The reliability of lead-free solder paste is related to the composition of solder, viscosity of solder paste, printing effect and reflow soldering temperature curve. The solder paste with matching properties was prepared, and the printing parameters were well controlled and the reflux curve of the new solder paste was drawn up for reflux welding. The specific contents and results are as follows: The results show that the best printing effect can be obtained when the mass fraction of the new solder powder is 87.5%. According to the DSC curve of SACBN07 solder, the suitable reflux process curve can be drawn up to better play the role of solder paste. Reliable solder joints. The reflow soldering curve is 150 C in preheating zone, 195 C in active zone, 260 C in insulation zone, 150 C in cooling zone and 554 s in whole soldering time. Experiments on spreading of SAC305 solder paste and SACBN07 solder paste are carried out. The spreading coefficient of SACBN07 is 84.3%, and that of SAC305 solder paste is 81.1%. It is slightly higher than SAC305 solder paste; Bi and Ni increase the spreading area of SAC solder and improve the wettability of solder paste. The interfacial compound of SACBN07 solder paste and SAC305 solder paste became thicker and grew layer by layer after cold and hot cycling test. After 600 hours, the interfacial compound layer of SAC305/Cu solder joint was obviously thicker than that of SACBN07/Cu solder joint. Bi and Ni in the new solder paste inhibited the growth of IMC effectively. The interfacial IMC of SACBN07/Cu was wormlike (Cu, Ni) 6Sn5. Compared with high silver paste SAC305/Cu solder joint compound Cu6Sn5 grain size was significantly refined. SACBN07/Cu solder joint interface compound layer thickness was 16% lower than SAC305/Cu, SACBN07/Cu interface compound growth rate was smaller. Ni addition had a good inhibitory effect on the growth of IMC layer; Bi addition reduced the growth rate of IMC layer, lower than SAC305/Cu interface IMC. The hardness of SACBN07/Cu solder decreases by 17.4%, the hardness of SAC305/Cu decreases by 31.3% and the softening degree of SACBN07/Cu is less than that of SAC305/Cu. The shear strength of SAC305/Cu is 31.4% lower than that of SACBN07/Cu after cold and hot cycling, and the shear resistance of SACBN07/Cu is better than that of SAC305/Cu.
【學位授予單位】：哈爾濱理工大學
【學位級別】：碩士
【學位授予年份】：2017
【分類號】：TG42

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本文編號：2216043