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  本文選題：固-液復合連接 + 脈沖旁路耦合MIG電弧焊��； 參考：《蘭州理工大學》2017年碩士論文

【摘要】：本文針對不同的鋁銅連接方式在不同的試驗參數(shù)下獲得的鋁銅接頭的組織及導電性之間的問題進行研究。采用固-液復合連接的方法選用1060鋁板以及T2銅板獲得鋁銅復合接頭,采用脈沖旁路耦合MIG焊的方法選用ER4043、ER4047以及ER1100焊絲在不同的試驗參數(shù)下獲得鋁銅焊接接頭。在對不同連接方式接頭的界面進行分析的過程中發(fā)現(xiàn)接頭界面的組織及導電性存在很大的差異。對于固-液復合連接的接頭來說,原子間的擴散更加的充分,結(jié)合更加緊密,接頭的成分更加趨近于平衡條件下鋁銅之間的反應。在對鋁銅界面進行分析時發(fā)現(xiàn)在一定溫度保溫時鋁銅界面微觀組織的生長形貌比較平整。當擴散的能量足夠充分時,鋁銅界面的生成物含量以及種類逐漸的增加。根據(jù)前期工作,采用脈沖旁路耦合MIG電弧焊的接頭進行導電性分析的過程中發(fā)現(xiàn)焊接后用純鋁焊絲接頭的導電性小于硅系焊絲接頭的導電性,就此問題對接頭的界面進行分析,當焊絲中含有硅元素時會增加接頭的焊接性,增加接頭連接的緊密性。在對3種不同類型的接頭的界面進行分析時發(fā)現(xiàn)1100焊絲界面的金屬間化合物層的厚度要大于4043以及4047焊絲接頭的金屬間化合物層的厚度,4047焊絲接頭相對于4043焊絲接頭的金屬間化合物的厚度要薄,說明在硅元素含量一定時對接頭金屬間化合物的生長具有一定的抑制作用。在對焊接接頭進行熱處理的過程中發(fā)現(xiàn)接頭的形貌及成分會發(fā)生變化,尤其是在熱處理溫度為共晶溫度時,CuAl2相的形貌由熱處理前的塊狀變?yōu)橹?并且在CuAl2相的枝晶間以及枝晶前端析出大量的硅元素。分析不同連接方式的接頭時發(fā)現(xiàn)接頭會隨著熱量以及作用時間的變化產(chǎn)生不同的金屬間化合物層,由于焊接熱源的特殊性,在焊接接頭界面產(chǎn)生的金屬間化合物相有CuAl、CuAl2以及CuAl2的共晶組織,但根據(jù)已有的理論Cu9Al4是緊隨CuAl2產(chǎn)生的第二相,而對焊接接頭檢測沒有Cu9Al4,因此可以推斷物相的生成在滿足條件后仍然需要一定的孕育時間。對不同連接方式下的接頭的導電性進行分析時發(fā)現(xiàn)接頭的導電性隨著金屬間化合物層的厚度的增加而減少,并且當過渡層在持續(xù)及單一的情況下時,接頭的導電性較好。
[Abstract]:In this paper, the structure and electrical conductivity of Al-Cu joints obtained by different Al-Cu bonding methods under different test parameters are studied. Aluminum-copper composite joints were obtained by solid-liquid composite bonding with 1060 aluminum sheet and T2 copper plate, ER4043 and ER4047 and ER1100 wires were used to obtain Al-Cu welding joints under different test parameters by pulse by-pass coupling MIG welding. In the process of analyzing the interface of different joints, it is found that there are great differences in the structure and conductivity of the joints. For the solid-liquid composite joints, the diffusion between atoms is more sufficient and the bonding is closer, and the composition of the joints is closer to the reaction between aluminum and copper under equilibrium conditions. It is found that the microstructure of Al-Cu interface is smooth when the Al-Cu interface is heated at a certain temperature. When the diffusion energy is sufficient, the product content and species of Al-Cu interface increase gradually. According to the previous work, the electrical conductivity analysis of MIG arc welding joints with pulse bypass coupling shows that the electrical conductivity of pure aluminum welding wire joints after welding is smaller than that of silicon wire joints. The interface of the joints is analyzed in this paper. When the wire contains silicon, the weldability and tightness of the joint will be increased. The intermetallic layer thickness of 1100 wire interface is greater than that of 4043 wire joint and 4047 wire joint. The thickness of 4047 wire joint is relative to 4043 wire. The intermetallics of the joint are thin in thickness, The results show that the growth of intermetallic compounds can be inhibited when the content of silicon is constant. During heat treatment of welded joints, it was found that the morphology and composition of the joints would change, especially when the heat treatment temperature was eutectic, the morphology of CuAl2 phase changed from bulk to dendritic before heat treatment. And a large amount of silicon elements are precipitated between the dendrites and the front end of the CuAl2 phase. It is found that different intermetallic compound layers will be produced with the change of heat and action time, because of the particularity of welding heat source, because of the particularity of welding heat source. The intermetallic compound phase produced at the interface of welded joints consists of CuAlAl2 and CuAl2 eutectic structure, but according to the existing theory, Cu9Al4 is the second phase following CuAl2. However, there is no Cu9Al4 for welding joint detection, so it can be inferred that the phase formation still needs a certain incubation time after satisfying the conditions. It is found that the conductivity of the joint decreases with the increase of the intermetallic layer thickness, and when the transition layer is continuous and single, the conductivity of the joint is better.
【學位授予單位】：蘭州理工大學
【學位級別】：碩士
【學位授予年份】：2017
【分類號】：TG407

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本文編號：2039427