本文選題：Cu-P基非晶釬料 + 熔化特性��； 參考：《安徽工業(yè)大學(xué)》2017年碩士論文

【摘要】：本文概括描述了銅磷基釬料的性能特點(diǎn)及其在相關(guān)領(lǐng)域中的應(yīng)用前景,同時(shí)也闡述了銅磷釬料在釬焊中面臨的問題。為了降低成本并提高釬焊接頭性能,本文對(duì)釬料進(jìn)行成分優(yōu)化以及釬焊工藝的改善。實(shí)驗(yàn)設(shè)計(jì)了五種不同成分的銅磷基釬料,通過單輥急冷設(shè)備制成非晶條帶,以不等間隙代替等間隙的方式進(jìn)行真空釬焊,并分析添加合金元素在促進(jìn)形成非晶及改善接頭性能方面的作用。為了全面了解Cu-P基非晶釬料的性能優(yōu)點(diǎn),本文將制備的非晶釬料和成分相同的傳統(tǒng)釬料做比較試驗(yàn)。通過差示掃描量熱方法(DSC)分析兩種不同結(jié)構(gòu)釬料在加熱升溫過程中的熔化性能。以真空環(huán)境下,加熱熔化釬料在純銅板表面的鋪展范圍來研究釬料對(duì)純銅的潤(rùn)濕能力。對(duì)于真空條件下非晶釬料釬焊純銅得到的接頭,通過X射線分析(XRD)、掃描電鏡分析(SEM)、金相顯微分析以及納米壓痕測(cè)試等現(xiàn)代測(cè)試方法,研究添加元素和釬焊工藝等對(duì)接頭組織結(jié)構(gòu)和相關(guān)性能的作用。試驗(yàn)結(jié)果表明:Cu_(76)P_(140Ni_7Sn_3、Cu_(76)P_(14)Ni_8Sn_2、Cu_(75)P_(14)Ni_8Sn_3、Cu_(74)P_(14)Ni_8Sn_4、Cu_(74)P_(14)Ni_9Sn_3五種成分銅磷基釬料的非晶形成能力較強(qiáng),且制備的薄帶表面光滑、厚度均勻,能夠?qū)φ?80°不斷裂,具有良好的柔韌性。其中以Cu_(75)P_(14)Ni_8Sn_3的綜合性能最佳。在成分完全相同的情況下,銅磷基非晶釬料比晶態(tài)釬料的固、液相線低,且熔化溫度范圍更窄。合金元素Ni、Sn的添加,有利于釬料熔化范圍的窄化。加熱溫度和保溫時(shí)間對(duì)液態(tài)釬料的鋪展?jié)櫇裼泻艽蟮挠绊?銅磷基非晶釬料的鋪展范圍隨加熱溫度和持續(xù)時(shí)間的增長(zhǎng)而先升后降,且在660℃下保溫12 min時(shí)鋪展范圍達(dá)到最大;而普通晶態(tài)釬料在相同條件下的鋪展范圍則一直呈現(xiàn)上升趨勢(shì)。同樣的釬焊工藝下,銅磷基非晶釬料對(duì)母材的鋪展?jié)櫇褡饔帽染B(tài)釬料優(yōu)越。銅磷基非晶釬焊料的焊后接頭形成了良好的冶金結(jié)合,整個(gè)焊縫主要是由元素?cái)U(kuò)散區(qū)、釬料和母材相互作用的界面區(qū)以及釬料殘余物組成的中心區(qū)三部分組織組成。擴(kuò)散滲透區(qū)和界面區(qū)域基本由銅基固溶體組成,釬料殘留中心區(qū)則主要由銅基固溶體和Cu-P、Ni-P脆硬化合物組成。整個(gè)焊縫的硬度從基體到焊縫中心,硬度逐漸升高,其中以釬料殘留中心區(qū)的脆硬相硬度最高。釬焊得到的接頭剪切強(qiáng)度隨加熱溫度和保溫持續(xù)時(shí)間的增加,表現(xiàn)出先增后減的趨向,其中不等間隙對(duì)接頭力學(xué)性能起到明顯的改善作用。試驗(yàn)中,以Cu_(75)P_(14)Ni_8Sn_3非晶釬料在670℃保溫12 min下得到的接頭強(qiáng)度最高,達(dá)到55 MPa。
[Abstract]:In this paper, the performance characteristics of copper-phosphorus based solder and its application prospect in related fields are described. At the same time, the problems faced by Cu-P filler metal in brazing are also described.In order to reduce the cost and improve the properties of brazing joint, the composition of brazing alloy and the improvement of brazing process are optimized in this paper.Five kinds of copper-phosphorus based solders with different compositions were designed experimentally. Amorphous strips were made by single roll quench equipment, and vacuum brazing was carried out by using unequal gap instead of equal gap.The effect of adding alloying elements on forming amorphous and improving the properties of joints was analyzed.In order to fully understand the properties and advantages of Cu-P based amorphous solder, a comparative test was made between the prepared amorphous solder and the traditional solder with the same composition.The melting properties of two kinds of brazing alloys with different structures during heating were analyzed by differential scanning calorimetry (DSC).The wetting ability of solder on pure copper was studied by using the spreading range of heating melting filler metal on the surface of pure copper plate in vacuum environment.For the joint of pure copper brazed by amorphous solder under vacuum condition, modern testing methods such as X-ray analysis, SEM analysis, metallographic microanalysis and nano-indentation test are used.The effects of adding elements and brazing technology on the microstructure and properties of joints were studied.Among them, the comprehensive performance of Cu_(75)P_(14)Ni_8Sn_3 is the best.When the composition is the same, the solid and liquid phase line of Cu-P based amorphous solder is lower than that of crystalline filler metal, and the melting temperature range is narrower.The addition of nio Sn is beneficial to narrow the melting range of solder.Heating temperature and holding time have great influence on the spreading and wetting of liquid solder. The spreading range of Cu-P based amorphous solder increases first and then decreases with the increase of heating temperature and duration, and reaches the maximum at 660 鈩，

本文編號(hào)：1732733