本文關鍵詞： 銀基釬料 電磁壓制 燒結工藝 致密度 潤濕性　出處：《熱加工工藝》2016年23期 　論文類型：期刊論文

【摘要】：采用電磁壓制和粉末冶金技術相結合的方法制備了Ag40Cu23Zn31In4Ni2銀基釬料箔片,分析了電磁壓制中電壓參數(shù)對壓坯致密度的影響以及燒結工藝參數(shù)對燒結坯密度和顯微組織的影響,并對該釬料的鋪展?jié)櫇裥赃M行了討論。結果表明:隨著放電電壓的增加,Ag40Cu23Zn31In4Ni2銀基釬料的壓坯致密度呈上升逐漸變緩,最后下降的趨勢,在1300 V獲得最高致密度81.85%;當燒結時間一定時,在一定的燒結溫度范圍內,隨著溫度升高,燒結坯致密度提高;而燒結溫度一定時,隨著燒結時間增長,燒結坯致密度降低。潤濕鋪展性試驗中發(fā)現(xiàn):1300 V電壓下壓制的壓坯在650℃溫度下燒結0.5 h后獲得的釬料箔片,其鋪展面積可達到298.5 mm~2,具有良好的潤濕性,能滿足Ag40Cu23Zn31In4Ni2銀基釬料的使用要求。該結果可為電磁壓制制備無鎘中溫銀基釬料新技術的工程應用提供理論和數(shù)據(jù)支持。
[Abstract]:Ag40Cu23Zn31In4Ni2 silver based brazing foil was prepared by electromagnetic pressing and powder metallurgy. The influence of voltage parameters on compaction density and the effect of sintering process parameters on density and microstructure of sintered billet were analyzed. The wettability of the filler metal was discussed. The results showed that the density of Ag 40Cu23Zn31In4Ni2 filler metal increased gradually with the increase of discharge voltage. At 1300 V, the maximum density was 81.85; When the sintering time is constant, the density of sintered billet increases with the increase of sintering temperature in a certain range of sintering temperature. When the sintering temperature is fixed, the sintering time increases. The density of the sintered billet was decreased. The brazing foil was found in the wetting spreading test after sintering at 650 鈩，

本文編號：1473263