【摘要】：在微電子領域,石英晶片主要用于制造石英晶振器件。石英晶片的質量直接影響晶振的性能與可靠性,而研磨是保證石英晶片表面質量的重要工藝措施。本文采用行星式雙面研磨機對石英晶片進行了研磨加工試驗,研究了研磨區(qū)壓強對加工效率的影響。試驗結果表明,在相同工藝條件下,材料去除量隨著研磨區(qū)壓強的增大而增大。
[Abstract]:In that micro-electronic field, the quartz crystal sheet is mainly used for manufacturing the quartz crystal vibration device. The quality of the quartz crystal sheet directly influences the performance and reliability of the crystal vibration, and the grinding is an important technical measure to ensure the surface quality of the quartz crystal sheet. The effect of the pressure on the processing efficiency of the grinding area is studied in this paper by the grinding and processing of the quartz crystal by the planetary gear grinding machine. The experimental results show that the removal of material increases with the increase of the pressure in the grinding area under the same process conditions.
【作者單位】： 沈陽理工大學;
【分類號】：TQ127.2

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