【摘要】：通過機(jī)械結(jié)構(gòu)、控制系統(tǒng)及顯示系統(tǒng)設(shè)計(jì),研制了硅片總厚度偏差及翹曲度檢測(cè)裝置,該裝置具備自動(dòng)送料、自動(dòng)檢測(cè)、自動(dòng)回料、自動(dòng)顯示與數(shù)據(jù)存儲(chǔ)等功能;設(shè)計(jì)相關(guān)實(shí)驗(yàn)條件,對(duì)裝置進(jìn)行了測(cè)試,并根據(jù)測(cè)試結(jié)果分析了其測(cè)量不確定度;將裝置與Mahr測(cè)長(zhǎng)儀進(jìn)行了比較測(cè)量,試驗(yàn)表明,該裝置精度滿足設(shè)計(jì)要求,且性能穩(wěn)定。
[Abstract]:Through the design of mechanical structure, control system and display system, a device for detecting the total thickness deviation and warpage of silicon wafer is developed. The device has the functions of automatic feeding, automatic detection, automatic material return, automatic display and data storage. The relative experimental conditions were designed and the measurement uncertainty was analyzed according to the test results. The experimental results show that the accuracy of the device meets the design requirements and the performance of the device is stable.
【作者單位】： 浙江機(jī)電職業(yè)技術(shù)學(xué)院;臺(tái)州市計(jì)量技術(shù)研究院;湖州出入境檢驗(yàn)檢疫局;
【基金】：浙江省質(zhì)量技術(shù)監(jiān)督系統(tǒng)科研項(xiàng)目(20130294)
【分類號(hào)】：TQ056;TQ127.2

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