本文選題：硬脆材料 + 金剛石線切割　； 參考：《南京航空航天大學》2017年碩士論文

【摘要】：固結(jié)磨料金剛石線切割技術(shù),又稱金剛石線鋸切割技術(shù),是近年來迅速發(fā)展的利用固結(jié)磨料金剛石線切割硬脆材料的加工技術(shù),已經(jīng)廣泛應用于玻璃、硅晶體、石英晶體、硬質(zhì)合金、陶瓷和稀土磁性材料等硬脆材料的鋸切加工。隨著半導體加工要求越來越高:一方面由于特殊形狀半導體晶體的加工需求,使得金剛石線切割不斷向大直徑切割、輪廓切割和形狀切割等方向發(fā)展;另一方面,又要求切割后的工件具有極高的加工質(zhì)量和加工成品率。這些要求極大地提高了半導體等硬脆材料的加工難度,也對加工工具和加工設(shè)備提出了更高的要求。本課題針對以上問題,對現(xiàn)有的金剛石線切割機床的走絲系統(tǒng)和控制技術(shù)進行了改造。為解決金剛石線切割在型面切割過程中出現(xiàn)的彎絲影響切割件形狀精度的問題,研制了基于金剛石線位置的檢測及控制裝置;為提高往復走絲金剛石線切割機床的切割穩(wěn)定性和加工精度,針對其往復走絲加工過程中存在的金剛石線張力變化的問題進行了研究,研制了張力檢測及調(diào)節(jié)機構(gòu)。主要工作內(nèi)容如下:(1)利用SolidWorks和Autocad軟件對金剛石線切割彎絲檢測機構(gòu)和張力均衡控制機構(gòu)的零部件進行設(shè)計,滿足彎絲檢測控制和張力檢測控制的要求。編制零部件加工工藝,對零部件進行加工,完成對金剛石線切割機床走絲系統(tǒng)的改造。(2)研究了金剛石線切割過程中彎絲現(xiàn)象產(chǎn)生的原因,建立了金剛石線的撓曲量與切割抗力模型,提出了一種基于金剛石線位置檢測的彎絲檢測方法--光投影檢測法,制定了彎絲檢測控制方案,研制了基于金剛石線位置檢測的雙向檢測控制系統(tǒng),使其能進行金剛石線空間位置的判斷并進行反饋控制。(3)分析了張力變化的影響因素,對張力變化對切割過程的影響進行了研究,建立了磨粒切割機理模型,設(shè)計了張力檢測和控制機構(gòu),能夠?qū)饎偸�切割過程中的張力值進行實時檢測,并且有效提高加工的穩(wěn)定性和加工效率。(4)利用金剛石彎絲檢測控制系統(tǒng)對多晶硅材料進行了切割效果的驗證試驗,切割厚度20mm,直徑φ20mm的多晶硅圓度控制在0.05mm以內(nèi),大幅提高了切割形狀精度及切割穩(wěn)定性。(5)利用張力均衡控制系統(tǒng)對多晶硅材料進行了切割效果的驗證試驗,證明檢測調(diào)節(jié)機構(gòu)能有效控制金剛石線在往復走絲過程中張力不穩(wěn)定的問題,正反向走絲張力波動幅度能控制在0.6N以內(nèi),并且切割效率、切割表面粗糙度及加工尺寸精度都有較大改善。
[Abstract]:Consolidation abrasive diamond wire cutting technology, also known as diamond wire saw cutting technology, is a rapid development in recent years using consolidated abrasive diamond wire cutting hard and brittle materials processing technology, has been widely used in glass, silicon crystals, quartz crystals, Sawing of hard and brittle materials such as cemented carbides, ceramics and rare earth magnetic materials. With the increasing requirements of semiconductor processing, on the one hand, due to the special shape of semiconductor crystal processing requirements, diamond wire cutting to the direction of large diameter cutting, contour cutting and shape cutting, on the other hand, It is also required that the cut workpiece have high machining quality and finished product rate. These requirements greatly improve the processing difficulty of hard and brittle materials such as semiconductors, and put forward higher requirements for processing tools and equipment. In order to solve the above problems, the wire-moving system and control technology of the existing diamond wire-cutting machine tools have been reformed. In order to solve the problem that the curved wire in the cutting process of diamond wire cutting affects the shape accuracy of cutting parts, a device for detecting and controlling the position of diamond wire is developed. In order to improve the cutting stability and machining accuracy of reciprocating wire walking diamond wire cutting machine, the problem of the change of diamond wire tension in the process of reciprocating wire walking is studied, and the tension detection and adjustment mechanism is developed. The main contents of the work are as follows: (1) the components of diamond wire cutting and tension equalization control mechanism are designed by SolidWorks and Autocad software to meet the requirements of wire bending control and tension detection control. The machining process of the parts and components is worked out, and the modification of the wire running system of the diamond wire cutting machine is completed. (2) the reason of the wire bending phenomenon in the diamond wire cutting process is studied. The model of flexure and cutting resistance of diamond wire is established, and a new method based on position detection of diamond wire, light projection detection method, is put forward, and the control scheme of wire bending detection is established. A bidirectional detection control system based on diamond line position detection is developed, which enables it to judge the spatial position of diamond wire and to control it with feedback. (3) the influencing factors of tension change are analyzed. The influence of the change of tension on the cutting process is studied. The mechanical model of abrasive cutting is established, and the tension detection and control mechanism is designed, which can detect the tension value in the process of diamond wire cutting in real time. It also improves the stability and efficiency of machining effectively. (4) the cutting effect of polysilicon is verified by diamond wire bending control system. The cutting thickness is 20mm and the diameter 蠁 20mm polysilicon roundness is controlled within 0.05mm. The cutting precision and stability are greatly improved. (5) the cutting effect of polysilicon is verified by using the tension equalization control system. It is proved that the detecting and regulating mechanism can effectively control the instability of the tension of diamond wire during the reciprocating process, and the fluctuation amplitude of the forward and backward striping tension can be controlled within 0.6 N, and the cutting efficiency is obtained. Cutting surface roughness and machining dimensional accuracy have been greatly improved.
【學位授予單位】：南京航空航天大學
【學位級別】：碩士
【學位授予年份】：2017
【分類號】：TQ163

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