本文選題：氮化鋁 + 導(dǎo)熱絕緣�。� 參考：《浙江大學(xué)》2017年碩士論文

【摘要】：目前,電氣、電子產(chǎn)品都朝著質(zhì)輕、體積小、集成度高和功率大等方向發(fā)展,這對其封裝材料提出了更高的要求,它不再止于導(dǎo)熱系數(shù)這一單一性能。導(dǎo)熱絕緣材料由于有耐腐蝕、價廉、質(zhì)輕、易加工、成型能耗低、電絕緣性能好等無可比擬的優(yōu)異性能而受到越來越廣泛的重視。本論文主要研究了氮化鋁微球的可控制備以及利用氮化鋁微球為填料研究了表面改性、填料含量、多壁碳納米管共摻和聚合物基體對高導(dǎo)熱絕緣復(fù)合材料性能的影響。采用溶膠凝膠法與氮化還原法相結(jié)合的模式制備了氮化鋁微球,研究凝膠促進(jìn)劑PO和表面添加劑(十六烷基三甲基溴化銨(CTAB)、硫酸銨、氯化銨、蔗糖、檸檬酸、PEO-PPO-PEO和聚乙二醇)對氮化鋁前驅(qū)體形貌和球粒徑的影響。結(jié)果表明PO會加速凝膠反應(yīng)過程,添加量在7-9 ml的范圍內(nèi)能得到球形前驅(qū)體。表面添加劑(硫酸銨、氯化銨、蔗糖、檸檬酸、PEO-PPO-PEO和聚乙二醇)的加入均會使氮化鋁前驅(qū)體的粒徑變大,而十六烷基三甲基溴化銨(CTAB)的加入則會使氮化鋁前驅(qū)體的粒徑變小。以超高分子量聚乙烯(UHMWPE)作為聚合物基體,改性過的氮化鋁(KH550-AlN)微球作為填料,通過溶液混合和熱壓成型的方法制備了 KH550-AlN/UHMWPE復(fù)合材料,比較了自制氮化鋁微球和商業(yè)氮化鋁顆粒對復(fù)合材料導(dǎo)熱性能的影響,同時研究了填料含量對KH550-AlN/UHMWPE復(fù)合材料的熱穩(wěn)定性、導(dǎo)熱性能、力學(xué)性能和電絕緣性的影響。熱分析表明氮化鋁的添加使復(fù)合材料的熔融溫度和熱分解溫度提高,結(jié)晶度稍減少;導(dǎo)熱結(jié)果表明自制氮化鋁微球填充的復(fù)合材料具有更高的導(dǎo)熱系數(shù),隨著氮化鋁含量的提高,KH550-AlN/UHMWPE復(fù)合材料的導(dǎo)熱系數(shù)增加,當(dāng)填充量高于30 wt%,復(fù)合材料的導(dǎo)熱系數(shù)由于導(dǎo)熱網(wǎng)鏈的形成而出現(xiàn)明顯的上升。力學(xué)分析表明復(fù)合材料拉伸強(qiáng)度和斷裂伸長率都隨氮化鋁填充量的增加而降低。電絕緣性能測試表明在整個KH550-AlN的添加范圍內(nèi),復(fù)合材料的介電常數(shù)小于7,介電損耗在10-2的數(shù)量級內(nèi),表面和體積電阻率在1014數(shù)量級上,這說明復(fù)合材料的電絕緣性能滿足絕緣材料的要求。采用多巴胺(DA)對多壁碳納米管(MWCNT)進(jìn)行表面化學(xué)修飾得到聚多巴銨(PDA)包覆的多壁碳納米管(PDA-MWCNT),然后在40wt%KH550-AlN填充的UHMWPE復(fù)合材料中添加1 wt%的PDA-MWCNT制備PDA-MWCNT/KH550-AlN/UHMWPE 復(fù)合材料。采用 SEM、TEM、FTIR、TG 和 XPS 對 PDA-MWCNT進(jìn)行表征,同時測量PDA-MWCNT/KH550-AIN/UHMWPE的導(dǎo)熱系數(shù)和拉伸性能。SEM、TEM、FTIR、TG和XPS結(jié)果都說明據(jù)多巴胺成功包覆在MWCNT表面,且改性過的MWCNT與KH550-AIN/UHMWPE復(fù)合材料之間具有很好的界面相容性。熱導(dǎo)和力學(xué)測試結(jié)果表明在PDA-MWCNT/KH550-AIN/UHMWPE復(fù)合材料具有比KH550-AIN/UHMWPE更高的導(dǎo)熱系數(shù)和拉伸強(qiáng)度。討論了聚苯乙烯(PS)、高密度聚乙烯(HDPE)、聚苯硫醚(PPS)和聚酰胺6(PA6)四種聚合物基體中分別添加60 wt%KH550-AIN和60 wt%PDA-A12O3后的導(dǎo)熱系數(shù),研究聚合物基體在高導(dǎo)熱材料中的作用。結(jié)果表明聚合物基體在制備高導(dǎo)熱復(fù)合材料中起著非常重要的作用,復(fù)合材料導(dǎo)熱系數(shù)從大到小順序為PA6HDPEPPSPS,相對應(yīng)的導(dǎo)熱系數(shù)分別是 1.85、1.41、0.95 和 0.84 W·m-1·K-1。
[Abstract]:At present, electrical and electronic products are developing in the direction of light quality, small size, high integration and high power, which put forward higher requirements for its packaging materials. It no longer stops at the single performance of thermal conductivity. The heat conduction insulation material has no comparison because of corrosion resistance, low price, light quality, easy processing, low molding energy consumption and good electrical insulation performance. In this paper, the controllable preparation of aluminum nitride microspheres and the effect of aluminum nitride microspheres as filler on the surface modification, filler content, multi wall carbon nanotube co admixture and polymer matrix on the properties of high thermal insulation composites were studied in this paper. The sol-gel method and nitriding reduction method were used. The effect of PO and surface additives (sixteen alkyl three methyl ammonium bromide (CTAB), ammonium sulfate, ammonium chloride, sucrose, citric acid, PEO-PPO-PEO and PEG) on the morphology of aluminum nitride precursor and the spherulite diameter were investigated. The results showed that PO would accelerate the gel reaction process and add the amount of 7-9 ml. The addition of the surface additives (ammonium sulfate, ammonium chloride, sucrose, citric acid, PEO-PPO-PEO and PEG) will increase the particle size of the aluminum nitride precursor, and the addition of sixteen alkyl three methammonium bromide (CTAB) will make the particle size of the aluminum nitride precursor smaller. As an ultra high molecular weight polyethylene (UHMWPE) Polymer matrix and modified aluminum nitride (KH550-AlN) microspheres were used as filler to prepare KH550-AlN/UHMWPE composites by solution mixing and hot pressing. The effect of aluminum nitride microspheres and commercial aluminum nitride particles on the thermal conductivity of the composites was compared. The filler content was studied for KH550-AlN/UHMWPE composites at the same time. Thermal stability, thermal conductivity, mechanical properties and electrical insulation. The thermal analysis shows that the addition of aluminum nitride makes the melting temperature and thermal decomposition temperature of the composites increase, and the crystallinity is slightly reduced; the thermal conductivity shows that the composites filled with aluminum nitride microspheres have higher thermal conductivity, and with the increase of aluminum nitride content, KH550-A The thermal conductivity of lN/UHMWPE composites increases, when the filling amount is higher than 30 wt%, the thermal conductivity of the composite increases obviously due to the formation of the heat conduction network chain. The mechanical analysis shows that the tensile strength and elongation at break of the composite decrease with the increase of the amount of aluminum nitride. The electrical insulation performance test shows that the whole KH550-AlN is in the whole. In the addition range, the dielectric constant of the composite is less than 7, the dielectric loss is within the magnitude of 10-2, the surface and the volume resistivity are at the 1014 order of magnitude, which indicates that the electrical insulation performance of the composite satisfies the requirements of the insulating material. The surface chemical modification of the multi wall carbon nanotube (MWCNT) with dopamine (DA) is coated with polydopamine (PDA). The multi wall carbon nanotube (PDA-MWCNT) is then added to the 40wt%KH550-AlN filled UHMWPE composite material with 1 wt% PDA-MWCNT to prepare the PDA-MWCNT/KH550-AlN/UHMWPE composite. SEM, TEM, FTIR, TG and XPS are used to characterize the PDA-MWCNT, and the thermal conductivity and tensile properties are measured. XPS results show that it is clear that dopamine is successfully coated on the surface of MWCNT, and the modified MWCNT and KH550-AIN/UHMWPE composites have good interfacial compatibility. The thermal conductivity and mechanical test results show that the PDA-MWCNT/KH550-AIN/UHMWPE composites have higher thermal conductivity and tensile strength than KH550-AIN/UHMWPE. The polyphenylene B is discussed. The thermal conductivity of PS, high density polyethylene (HDPE), polyphenylene sulfide (PPS) and polyamide 6 (PA6) four polymer matrix was added to 60 wt%KH550-AIN and 60 wt%PDA-A12O3 respectively. The effect of polymer matrix in high thermal conductivity materials was studied. The results showed that polymer matrix played a very important role in the preparation of high thermal conductivity composite. The thermal conductivity of the composites is PA6HDPEPPSPS from large to small, and the corresponding thermal conductivity is 1.85,1.41,0.95 and 0.84 W. M-1. K-1., respectively.
【學(xué)位授予單位】：浙江大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2017
【分類號】：TB332;TQ133.1

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