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大氣等離子噴涂熱障涂層顯微結(jié)構(gòu)與熱導(dǎo)率關(guān)系的定量研究

發(fā)布時(shí)間:2018-05-14 23:38

  本文選題:EBSD圖像 + 顯微結(jié)構(gòu)。 參考:《上海應(yīng)用技術(shù)大學(xué)》2017年碩士論文


【摘要】:Y_2O_3部分穩(wěn)定的ZrO_2具有較低的熱導(dǎo)率和熱膨脹系數(shù)、韌性好、強(qiáng)度高以及良好的耐腐蝕、抗熱沖擊性能,加之價(jià)格便宜等優(yōu)勢(shì),而成為目前使用最廣泛的熱障涂層材料。然而,針對(duì)未來熱障涂層材料需要滿足更低熱導(dǎo)率的要求,熱障涂層的研究面臨著諸多的挑戰(zhàn)。需要分析影響涂層熱導(dǎo)率的因素。YSZ涂層的顯微結(jié)構(gòu)是由相組成,裂紋,氣孔,片層之間的界面,以及晶界等組成。這些都是影響涂層的熱導(dǎo)率的重要的因素。但是又由于涂層中界面的存在,直接通過涂層的顯微結(jié)構(gòu)分析各個(gè)因素對(duì)熱導(dǎo)率的影響是很困難的。為了解決這個(gè)問題,實(shí)驗(yàn)中先研究YSZ陶瓷,通過壓制燒結(jié)的方法,制備基本致密的氧化鋯陶瓷,制備的氧化鋯陶瓷不是層狀結(jié)構(gòu),所以沒有片層之間的界面。然后,基于YSZ陶瓷的EBSD圖像,通過有限元模擬的方法,計(jì)算分析了四方相以及晶界的熱導(dǎo)率。這個(gè)是本文研究的一部分內(nèi)容。另外,在這個(gè)實(shí)驗(yàn)的基礎(chǔ)上,考慮界面的理想狀態(tài)下的分布情況,基于涂層的EBSD圖像,利用有限元模擬的技術(shù)手段,模擬得出的結(jié)果,與實(shí)驗(yàn)測(cè)得的涂層的熱導(dǎo)率數(shù)值進(jìn)行對(duì)比,兩者之間的誤差在10%以內(nèi)。通過有限元網(wǎng)絡(luò)模型,計(jì)算了單斜相,裂紋氣孔,晶界,界面以及界面與裂紋氣孔之間的相互作用對(duì)涂層的熱導(dǎo)率的影響系數(shù)。主要結(jié)果有:(1)通過壓制燒結(jié)的方法,制備出了基本致密的YSZ陶瓷,通過改變保溫溫度,獲得了晶粒大小不同的YSZ陶瓷。基于兩種YSZ陶瓷的EBSD圖像,計(jì)算中了 YSZ陶瓷中四方相以及晶界的熱導(dǎo)率的數(shù)值。(2)通過大氣等離子噴涂技術(shù),通過不同的噴涂參數(shù),制備出了三種不同顯微結(jié)構(gòu)的YSZ熱障涂層,基于涂層的EBSD圖像結(jié)合界面的理想狀態(tài)下的部分情況,獲得了涂層的理想的顯微結(jié)構(gòu)模型,通過這個(gè)模型計(jì)算的涂層的熱導(dǎo)率與實(shí)驗(yàn)測(cè)得的熱導(dǎo)率的數(shù)值之間的誤差在10%以內(nèi)。(3)基于涂層的理想狀態(tài)下的模型,通過有限元模擬計(jì)算,通過對(duì)比涂層中有無界面,計(jì)算出了界面對(duì)涂層的熱導(dǎo)率的影響系數(shù)。通過對(duì)比基體中有無裂紋氣孔,同時(shí)加入界面的影響,兩者之間熱導(dǎo)率的差值,得出了裂紋氣孔與界面之間相互作用對(duì)涂層熱導(dǎo)率的影響系數(shù)。(4)基于涂層的EBSD圖像,通過有限元模擬的方法,通過對(duì)比涂層中有無裂紋氣孔兩者熱導(dǎo)率之間的差值,可以計(jì)算得出了裂紋氣孔對(duì)熱導(dǎo)率的影響系數(shù),通過對(duì)比有無單斜相的兩個(gè)涂層之間的熱導(dǎo)率的差值,可以計(jì)算出單斜相對(duì)熱導(dǎo)率的影響系數(shù)。通過對(duì)比有無晶界的兩個(gè)涂層之間的熱導(dǎo)率的差值,可以計(jì)算出晶界對(duì)熱導(dǎo)率的影響系數(shù)。
[Abstract]:Y_2O_3 partially stabilized ZrO_2 has the advantages of low thermal conductivity, thermal expansion coefficient, good toughness, high strength, good corrosion resistance, thermal shock resistance and low price, so it has become the most widely used thermal barrier coating material. However, the research of thermal barrier coatings is faced with many challenges in order to meet the requirements of lower thermal conductivity in future thermal barrier coating materials. The microstructure of YSZ coating is composed of phase, crack, porosity, interface between lamellar layers and grain boundary. These are important factors affecting the thermal conductivity of the coating. However, due to the existence of interface in the coating, it is difficult to analyze the influence of various factors on the thermal conductivity directly through the microstructure of the coating. In order to solve this problem, the YSZ ceramics were studied in the experiment. The basic dense zirconia ceramics were prepared by pressing and sintering. The zirconia ceramics were not layered structure, so there was no interlamellar interface. Then, based on the EBSD images of YSZ ceramics, the thermal conductivity of tetragonal phase and grain boundary is calculated and analyzed by finite element simulation. This is a part of this study. In addition, on the basis of this experiment, considering the distribution of the interface in ideal state, the EBSD image based on the coating is simulated by the technical means of finite element simulation. Compared with the experimental results, the error between them is less than 10%. The influence coefficients of monoclinic phase, crack porosity, grain boundary, interface and interaction between interface and crack pore on thermal conductivity of coating were calculated by finite element network model. The main results are as follows: (1) the compact YSZ ceramics were prepared by pressing sintering, and the YSZ ceramics with different grain sizes were obtained by changing the holding temperature. Based on the EBSD images of two kinds of YSZ ceramics, the thermal conductivity of tetragonal phase and grain boundary in YSZ ceramics was calculated. Three kinds of YSZ thermal barrier coatings with different microstructure were prepared by atmospheric plasma spraying technology and different spraying parameters. Based on the EBSD image of the coating, the ideal microstructure model of the coating is obtained by combining the part of the interface in the ideal state. The error between the thermal conductivity of the coating calculated by this model and the experimental value of the thermal conductivity is less than 10%.) based on the ideal state of the coating, the finite element method is used to calculate the thermal conductivity of the coating and the interface between the coating and the coating is compared. The influence of the interface on the thermal conductivity of the coating was calculated. By comparing the existence of crack pores in the matrix and the influence of interface, the difference of thermal conductivity between them is obtained. The influence coefficient of the interaction between crack porosity and interface on the thermal conductivity of the coating is obtained. The EBSD image based on the coating is obtained. By means of finite element simulation and by comparing the difference between the thermal conductivity of the coating with or without crack porosity, the influence coefficient of crack porosity on thermal conductivity can be calculated. By comparing the difference of thermal conductivity between two coatings with or without monoclinic phase, the influence coefficient of monoclinic relative thermal conductivity can be calculated. By comparing the difference of thermal conductivity between two coatings with or without grain boundary, the influence coefficient of grain boundary on thermal conductivity can be calculated.
【學(xué)位授予單位】:上海應(yīng)用技術(shù)大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2017
【分類號(hào)】:TQ174.1

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