本文選題：超聲　切入點(diǎn)：微電鑄技術(shù)　出處：《大連理工大學(xué)》2016年博士論文

【摘要】：隨著微機(jī)電系統(tǒng)的發(fā)展,金屬微器件越來越受到人們的關(guān)注。金屬微器件的制作方法有多種,包括電火花加工技術(shù)、激光加工技術(shù)和微電鑄技術(shù)等。其中,微電鑄技術(shù)以其復(fù)制精度高、可批量化生產(chǎn)的優(yōu)勢,更適合于金屬微器件的加工制作。在利用微電鑄技術(shù)制作金屬微器件的過程中存在著微電鑄層與金屬基底界面結(jié)合性能差的問題。微電鑄層與金屬基底結(jié)合不牢使得微電鑄層容易從金屬基底脫落,嚴(yán)重時(shí)會(huì)造成金屬微器件的制作失敗。此問題影響了金屬微器件的質(zhì)量從而成為制約微電鑄技術(shù)發(fā)展的瓶頸問題之一。本文針對微電鑄層與金屬基底的界面結(jié)合性能開展研究。為了明晰微電鑄層晶粒尺寸與界面結(jié)合能的定量關(guān)系,本文根據(jù)斷裂能量平衡準(zhǔn)則、表面張力模型和米德馬半經(jīng)驗(yàn)電子模型建立了晶粒尺寸與界面結(jié)合能關(guān)系的理論模型。模型表明,界面結(jié)合能隨著晶粒尺寸的增大而增大,并逐漸趨于穩(wěn)定。為了驗(yàn)證模型的正確性,設(shè)計(jì)了微電鑄實(shí)驗(yàn),利用不同的電流密度制備了不同晶粒尺寸的微電鑄層。采用X Ray Diffraction (XRD)衍射法測量了微電鑄層晶粒尺寸,利用劃痕法表征了界面結(jié)合能。實(shí)驗(yàn)結(jié)果表明,隨著微電鑄層晶粒尺寸的增大界面結(jié)合能逐漸增大,并趨于穩(wěn)定。實(shí)驗(yàn)結(jié)果驗(yàn)證了模型的正確性。該模型為合理選取小電流密度、超聲電鑄等適度增大晶粒尺寸,提高界面結(jié)合能的電鑄工藝參數(shù)提供一定的理論依據(jù)。研究了電流密度對微電鑄層與金屬基底界面結(jié)合能的影響。在晶粒尺寸與界面結(jié)合能關(guān)系的理論模型的基礎(chǔ)上,分析了電流密度對晶粒尺寸和界面結(jié)合能的影響。設(shè)計(jì)了不同電流密度的電鑄實(shí)驗(yàn),測量了微電鑄層晶粒尺寸、壓應(yīng)力和真實(shí)接觸表面積,利用劃痕法表征了界面結(jié)合能。根據(jù)金屬離子局部放電理論和陰極極化理論對小電流密度提高界面結(jié)合能的機(jī)理進(jìn)行了分析：一方面,利用小電流密度進(jìn)行電鑄其陰極過電位較低,制備的微電鑄層晶粒尺寸較大,根據(jù)晶粒尺寸與界面結(jié)合能關(guān)系的理論模型,適度增大晶粒尺寸能夠提高界面結(jié)合能；另一方面,小電流密度增大了微電鑄層真實(shí)接觸表面積,提高了微電鑄層與基底的機(jī)械嵌合作用,改善了界面結(jié)合能。小電流密度電鑄法可以有效提高界面結(jié)合能。研究了超聲電鑄法對微電鑄層與金屬基底界面結(jié)合能的影響。設(shè)計(jì)了超聲電鑄實(shí)驗(yàn),研究了超聲場對電鑄反應(yīng)過程的影響,利用極化法研究了超聲條件下的陰極極化特性,利用交流阻抗法研究了超聲條件下的電鑄反應(yīng)速率。實(shí)驗(yàn)結(jié)果表明,超聲條件下的微電鑄層壓應(yīng)力較小,晶粒尺寸與真實(shí)接觸表面積較大。界面結(jié)合能首先隨著超聲功率的增大而增大,在超聲功率為200W時(shí)最高,隨后略有減小。界面結(jié)合能在超聲頻率為40kHz時(shí)較高,隨著超聲頻率的增大逐漸減小。本文根據(jù)晶粒尺寸與界面結(jié)合能關(guān)系的理論模型,探討了超聲場提高界面結(jié)合能的機(jī)理,即：在電鑄過程中施加超聲場能夠減小陰極過電位,適度增大微電鑄層晶粒尺寸從而提高界面結(jié)合能。另一方面超聲場增大了微電鑄層的真實(shí)接觸表面積,提高了微電鑄層與基底的機(jī)械嵌合作用進(jìn)而改善了界面結(jié)合能。在電鑄過程中采用功率為200W、頻率為40kHz的超聲進(jìn)行電鑄提高界面結(jié)合能的效果較好。提出了超聲復(fù)合電鑄提高界面結(jié)合能的新方法。首先探討了化學(xué)腐蝕法對界面結(jié)合能的影響。設(shè)計(jì)了化學(xué)腐蝕電鑄實(shí)驗(yàn),實(shí)驗(yàn)結(jié)果表明,化學(xué)腐蝕法能夠提高基底表面粗糙度Ra,增大微電鑄層的真實(shí)接觸表面積,從而提高界面結(jié)合能。在化學(xué)腐蝕法、小電流密度電鑄法與超聲電鑄法的研究基礎(chǔ)上,以晶粒尺寸與界面結(jié)合能關(guān)系的理論模型為指導(dǎo),提出了超聲復(fù)合電鑄提高界面結(jié)合能的新方法,并通過實(shí)驗(yàn)加以驗(yàn)證。復(fù)合電鑄實(shí)驗(yàn)結(jié)果表明,相對于普通電鑄法,超聲復(fù)合電鑄法使得界面結(jié)合能提高了134%。為了驗(yàn)證超聲復(fù)合電鑄法提高金屬微器件界面結(jié)合性能的效果,利用超聲復(fù)合電鑄法制備了金屬微柱陣列結(jié)構(gòu),并表征了金屬微柱陣列結(jié)構(gòu)的界面結(jié)合性能。實(shí)驗(yàn)結(jié)果表明,超聲復(fù)合電鑄法提高了金屬微柱陣列結(jié)構(gòu)的界面結(jié)合性能。本文研究工作對提高金屬微器件的界面結(jié)合性能具有一定的借鑒意義。
[Abstract]:With the development of MEMS, micro metal devices have attracted more and more attention. There are many methods to fabricate metal micro devices, including EDM, laser processing technology and micro electroforming technology. The micro electroforming technology with its replication accuracy, mass production advantage, more suitable for processing fabrication of metal micro devices. Using micro electroforming technology in the production process of metal micro devices exist in the micro electroforming layer and the metal substrate interface. The problem of poor performance of micro electroforming layer and the metal substrate binding is not strong so that the micro electroforming layer from the metal substrate is easy to fall off, can cause severe production of metal micro devices this failure. The problems affected the quality of metal micro devices to become one of the bottleneck problems of micro electroforming technology development constraints. According to the interface of micro electroforming layer and metal substrate binding properties is studied. In order to clarify the micro Combined with the quantitative relationship between energy size and interfacial electroformed layer grain, according to the energy balance criterion of fracture, surface tension model and semi empirical model of midmar electronic grain size and interface bonding relationship. Theoretical model can model show that the interfacial energy increases with the increase of the grain size, and gradually stabilized in order to correct. To verify the model, the design of micro electroforming experiments, preparation of micro electroforming layer with different grain size with different current density. Using X Ray Diffraction (XRD) measurement of the micro electroforming layer of grain size, the scratch was used to characterize the interfacial energy. The experimental results show that with the increase of grain size of micro electroforming layer the interface binding energy increases gradually, and tends to be stable. The experimental results verify the correctness of the model. The model is a reasonable selection of small current density, ultrasonic electroforming moderate increase of grain size Inch, improve to provide a theoretical basis for combining the electroforming process parameters of current density interface. The binding energy of the micro electroforming layer and the metal substrate interface. The grain size and interface based on the theoretical model of relationship analysis, the current density with the effect of grain size and interface design. The electroforming experiments of different current density, micro electroforming layer grain size measurement, compressive stress and the real contact area and the use of scratch was used to characterize the interfacial energy of metal ions. According to partial discharge theory and theory to improve the cathodic polarization was analyzed with energy mechanism of the interface for small current density: on the one hand, deposits the cathodic overpotential is low with a small current density, the preparation of micro electroforming layer with larger grain size, according to the theoretical model of the relationship between grain size and interfacial energy, moderate increase of grain size can To improve the interfacial energy; on the other hand, a small increase in current density of micro electroforming layer contact surface area, improve the mechanical interaction of micro electroforming layer and the substrate, improve the interfacial binding energy at low current density electroforming method can effectively improve the interfacial energy. Research on ultrasonic electroforming method combined with the effect of micro electroforming layer and metal substrate interface. The design of ultrasonic electroforming experiment, studied the effect of ultrasonic field on electroforming reaction process, the cathodic polarization characteristics under ultrasonic condition using polarization method, the reaction rate of electroforming under ultrasonic condition using impedance spectroscopy. The experimental results show that the micro electroforming laminate under ultrasonic condition stress small grain size and large surface area. The contact interface binding energy first increases with the increase of ultrasonic power, the ultrasonic power is 200W the highest, followed by a slight decrease. The interfacial energy The frequency of 40kHz is higher, with the increase of ultrasonic frequency decreases gradually. Based on the grain size and interfacial energy relation theory model of ultrasonic field, increase the binding energy mechanism of interface: ultrasonic field can reduce the cathodic potential in the electroforming process, micro electroforming layer moderately increasing grain size and to improve the interfacial energy. On the other hand, ultrasonic field increases the area of real contact surface micro electroforming layer, improves the mechanical interaction of micro electroforming layer and the substrate, thereby improving the interfacial energy. In the electroforming process using the power of 200W, frequency of 40kHz can improve the interface of ultrasonic electroforming is better is proposed. A new method of ultrasonic composite electroforming raising the interfacial energy. First discusses the chemical etching method can impact on the interface. The design of chemical corrosion experimental results show that the electroforming experiments, The chemical etching method can improve the surface roughness Ra, increase the area of real contact surface micro electroforming layer, thereby improving the interfacial energy. The chemical etching method, based on small current density electroforming method and ultrasonic electroforming method, theory model under the guidance of the grain size and interfacial energy relation theory, put forward a new method of ultrasonic composite electroforming raising the interfacial energy, and verified by experiments. The experimental results show that the composite electroforming, compared with conventional electroforming method, ultrasonic composite electroforming method makes the interface combination can improve the 134%. in order to verify the ultrasonic combined electrical casting method to improve the performance of the micro device with metal interface effect, metal micro column array structure were prepared by ultrasound composite electroforming method, and characterized by the performance of metal micro column array structure of the interface. The experimental results show that the ultrasonic composite electroforming method improve the metal micro column array structure field The research work of this paper has a certain reference for improving the interface bonding properties of metal microdevices.

【學(xué)位授予單位】：大連理工大學(xué)
【學(xué)位級(jí)別】：博士
【學(xué)位授予年份】：2016
【分類號(hào)】：TQ153.4

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