電鍍條件對CoP非晶鍍層催化活性的影響
發(fā)布時間:2018-01-28 19:45
本文關(guān)鍵詞: CoP 電鍍 硼氫化鈉 制氫 正交試驗 出處:《表面技術(shù)》2017年10期 論文類型:期刊論文
【摘要】:目的考察電鍍條件對CoP鍍層催化硼氫化鈉水解產(chǎn)氫性能的影響規(guī)律。方法通過電鍍法在銅片表面沉積CoP非晶催化劑,并用于催化硼氫化鈉水解制氫。催化劑微觀形貌和元素組成分別由場發(fā)射掃描電子顯微鏡(FE-SEM)和能譜儀(EDS)進(jìn)行表征。通過正交試驗確定沉積時間、沉積溫度、電流密度對催化劑活性的影響等級。同時,考察了NaBH4濃度、反應(yīng)溫度和循環(huán)使用對催化劑性能的影響。結(jié)果 FE-SEM和EDS分析表明,CoP鍍層由直徑200nm左右的晶粒堆積而成,Co與P的原子比為3.6:1。正交實驗結(jié)果表明,沉積時間對催化劑活性的影響程度最大,之后依次為沉積溫度和電流密度。當(dāng)沉積溫度、時間、電流密度分別為20℃、1min、5.56A/dm~2時,所制備的催化劑活性最高。30℃下,6%NaBH_4+2%NaOH體系中,氫氣的生成速率為2750mL/(min·g),反應(yīng)表觀活化能為41.2kJ/mol,循環(huán)使用4次后,催化劑活性降低64%。結(jié)論采用電鍍法成功制備了CoP/Cu催化劑,其催化硼氫化鈉水解產(chǎn)氫性能優(yōu)異。電鍍條件中,沉積時間是影響催化劑活性的首要因素,其次為沉積溫度和電流密度。
[Abstract]:Objective to investigate the effect of electroplating conditions on the catalytic properties of CoP coating for hydrogen production by hydrolysis of sodium borohydride. Methods CoP amorphous catalyst was deposited on the surface of copper by electroplating. It was also used to catalyze the hydrolysis of sodium borohydride to produce hydrogen. The microstructure and elemental composition of the catalyst were characterized by field emission scanning electron microscopy (FE-SEM) and energy dispersive spectrometer (EDS), respectively. The deposition time was determined by orthogonal test. The influence of deposition temperature and current density on the activity of the catalyst was investigated. Meanwhile, the concentration of NaBH4 was investigated. Results FE-SEM and EDS analysis showed that the coating was composed of 200 nm diameter grains. The atomic ratio of Co to P is 3.6: 1. The results of orthogonal experiment show that the influence of deposition time on catalyst activity is the greatest, followed by deposition temperature and current density. The current density is 20 鈩,
本文編號:1471390
本文鏈接:http://sikaile.net/kejilunwen/huaxuehuagong/1471390.html
最近更新
教材專著