【摘要】：半導(dǎo)體產(chǎn)業(yè)是現(xiàn)代信息產(chǎn)品生產(chǎn)制造的重要基礎(chǔ),在各行業(yè)均有著廣泛的應(yīng)用。在早期,半導(dǎo)體產(chǎn)業(yè)的運(yùn)營模式是由生產(chǎn)企業(yè)承擔(dān)產(chǎn)品設(shè)計(jì)、生產(chǎn)制造及市場銷售各項(xiàng)業(yè)務(wù),可以在企業(yè)內(nèi)部對產(chǎn)品質(zhì)量進(jìn)行有效地控制。隨著半導(dǎo)體產(chǎn)業(yè)的進(jìn)一步發(fā)展與產(chǎn)業(yè)規(guī)模的不斷擴(kuò)大,受到成本競爭壓力和資源整合優(yōu)化、產(chǎn)業(yè)細(xì)分趨勢的影響,其產(chǎn)業(yè)結(jié)構(gòu)從原來的垂直整合型轉(zhuǎn)變?yōu)樗椒稚⑿?制造環(huán)節(jié)紛紛外包給專業(yè)的半導(dǎo)體制造商。因此,對于半導(dǎo)體產(chǎn)品質(zhì)量的管理也從原來傳統(tǒng)的企業(yè)內(nèi)部質(zhì)量管理,轉(zhuǎn)變成整個(gè)供應(yīng)鏈的質(zhì)量管理,對半導(dǎo)體產(chǎn)業(yè)的質(zhì)量管理提出了新要求。 半導(dǎo)體產(chǎn)品種類眾多、生產(chǎn)工藝復(fù)雜、合作協(xié)同程度要求高,其制造外包質(zhì)量管理存在著一定的特殊性和較大的難度。其中,外包交接接口定義模糊、需求不清晰、缺乏信息反饋與持續(xù)改進(jìn)機(jī)制等是目前質(zhì)量管理中凸現(xiàn)的主要問題,尚缺乏有針對性的整體供應(yīng)鏈質(zhì)量管理模型。 本文在作者長期從事相關(guān)實(shí)踐工作的基礎(chǔ)上,運(yùn)用全球供應(yīng)鏈協(xié)會SCC提出的SCOR模型(Supply-Chain Operations Reference model,供應(yīng)鏈運(yùn)營參考模型)從整體供應(yīng)鏈角度對半導(dǎo)體產(chǎn)業(yè)制造外包的質(zhì)量管理作了探索性研究。首先,對半導(dǎo)體產(chǎn)業(yè)制造外包的基本模式及發(fā)展趨勢作深入分析,以SCOR模型為框架結(jié)合半導(dǎo)體制造外包的質(zhì)量管理需求與特點(diǎn),闡述了質(zhì)量管理的關(guān)鍵要求及薄弱環(huán)節(jié),提出了基于SCOR的半導(dǎo)體制造外包質(zhì)量管理方法。然后,通過對上述質(zhì)量管理的流程體系、績效指標(biāo)及相關(guān)機(jī)制的進(jìn)一步研究,從整體供應(yīng)鏈角度構(gòu)建了半導(dǎo)體制造外包的質(zhì)量管理模型,并通過實(shí)際案例證明其運(yùn)作的有效性和重要的應(yīng)用價(jià)值。 本文共分以下六章：第一章為緒論,闡述了研究背景與選題意義、國內(nèi)外研究現(xiàn)狀及本文研究的內(nèi)容；第二章分析了半導(dǎo)體制造外包發(fā)展趨勢及現(xiàn)狀；第三章提出了基于SCOR的半導(dǎo)體制造外包質(zhì)量管理方法；第四章進(jìn)一步構(gòu)建了基于SCOR的半導(dǎo)體制造外包質(zhì)量管理模型；第五章為案例與應(yīng)用分析；第六章對本文的研究成果作了總結(jié),并提出了未來研究工作的展望。 本文研究工作的主要創(chuàng)新性在于運(yùn)用SCOR模型從整體供應(yīng)鏈角度提出了半導(dǎo)體制造外包質(zhì)量管理的新方法并構(gòu)建了有效的質(zhì)量管理模型,使得半導(dǎo)體相關(guān)企業(yè)之間能夠準(zhǔn)確地交流供應(yīng)鏈質(zhì)量問題、客觀地評價(jià)質(zhì)量管理績效并形成了持續(xù)改進(jìn)質(zhì)量的新機(jī)制,為解決半導(dǎo)體產(chǎn)業(yè)質(zhì)量管理中目前存在的主要問題提供了重要的參考。
[Abstract]:Semiconductor industry is an important foundation of modern information products production and manufacturing, and has been widely used in various industries. In the early days, the operation mode of semiconductor industry was that the production enterprises were responsible for product design, manufacturing and marketing, which could effectively control the quality of products within the enterprises. With the further development of semiconductor industry and the continuous expansion of industrial scale, affected by the pressure of cost competition, the optimization of resource integration and the trend of industrial subdivision, the industrial structure of semiconductor industry has changed from vertical integration to horizontal dispersion. Manufacturing links have been outsourced to professional semiconductor manufacturers. Therefore, the quality management of semiconductor products has changed from the traditional internal quality management of enterprises to the quality management of the whole supply chain, which puts forward new requirements for the quality management of semiconductor industry. There are many kinds of semiconductor products, the production process is complex, and the degree of cooperation and cooperation is high. The quality management of manufacturing outsourcing has its own particularity and great difficulty. Among them, vague definition of outsourcing interface, unclear requirements, lack of information feedback and continuous improvement mechanism are the main problems in current quality management, and there is still a lack of targeted overall supply chain quality management model. On the basis of the author's long-term practice, In this paper, the supply chain Operations reference Model (SCOR) proposed by the Global supply chain Association (SCC) is used to study the quality management of semiconductor manufacturing outsourcing from the perspective of global supply chain. First of all, the basic mode and development trend of semiconductor manufacturing outsourcing are deeply analyzed, and the key requirements and weak links of quality management are expounded based on the SCOR model and the quality management requirements and characteristics of semiconductor manufacturing outsourcing. The quality management method of semiconductor manufacturing outsourcing based on SCOR is proposed. Then, through the further study of the process system, performance indicators and related mechanisms of the above quality management, the quality management model of semiconductor manufacturing outsourcing is constructed from the perspective of the whole supply chain. The effectiveness of its operation and its important application value are proved by practical cases. This paper is divided into the following six chapters: the first chapter is the introduction, elaborated the research background and topic selection significance, the domestic and foreign research present situation and this article research content, the second chapter has analyzed the semiconductor manufacturing outsourcing development tendency and the present situation; The third chapter puts forward the semiconductor manufacturing outsourcing quality management method based on SCOR, the fourth chapter further constructs the SCOR-based semiconductor manufacturing outsourcing quality management model, the fifth chapter is the case and application analysis; Chapter six summarizes the research results of this paper and puts forward the prospect of future research work. The main innovation of this paper is to use SCOR model to put forward a new method of semiconductor manufacturing outsourcing quality management from the point of view of the whole supply chain and to construct an effective quality management model. It enables semiconductor-related enterprises to communicate supply chain quality problems accurately, evaluate quality management performance objectively and form a new mechanism for continuous improvement of quality. It provides an important reference for solving the main problems existing in the semiconductor industry quality management.
【學(xué)位授予單位】：復(fù)旦大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2013
【分類號】：F426.63

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本文編號：2133912