【摘要】："十三五"國(guó)家戰(zhàn)略性新興產(chǎn)業(yè)發(fā)展規(guī)劃重點(diǎn)頒發(fā)了69個(gè)重大任務(wù)。關(guān)于半導(dǎo)體產(chǎn)業(yè)的發(fā)展,規(guī)劃已經(jīng)宣布:關(guān)鍵芯片的設(shè)計(jì)、存儲(chǔ)、封測(cè)、顯示將是下一步重點(diǎn)加強(qiáng)領(lǐng)域。這意味著,這些領(lǐng)域?qū)?huì)是繼半導(dǎo)體晶圓制造以后的下一個(gè)投資熱點(diǎn)。
[Abstract]:The National Strategic emerging Industry Development Plan of the Thirteenth five-year Plan has issued 69 major tasks. With regard to the development of the semiconductor industry, plans have been announced: key chip design, storage, closed testing, and display will be the next priority areas for strengthening. This means that these areas will be the next investment hotspot after semiconductor wafer manufacturing.
【作者單位】： 臺(tái)灣TrendForce拓X２笛芯吭，

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