本文關(guān)鍵詞：傳感器TEC制冷封裝技術(shù)研究　出處：《中國科學(xué)院大學(xué)(中國科學(xué)院光電技術(shù)研究所)》2017年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 熱電制冷器 傳感器制冷 ANSYSIcepak TEC制冷封裝 制冷控制

【摘要】：某些傳感器芯片,諸如圖像傳感器以及壓力傳感器等,其關(guān)鍵性能受溫度影響很大,當(dāng)溫度大于絕對(duì)零度時(shí),溫度越高,其工作時(shí)產(chǎn)生的熱噪聲越大,靈敏度越低。為了解決這一工程問題,我們對(duì)部分傳感器進(jìn)行了熱電制冷(TEC)封裝的研究,利用熱電制冷器對(duì)其進(jìn)行制冷,以抑制因傳感器工作時(shí)產(chǎn)生的熱噪聲或者高溫導(dǎo)致的靈敏度降低等情況。研究表明高溫也加速著傳感器芯片的老化,因此給傳感器芯片集成熱電制冷封裝是很有必要的。本文主要包括以下方面的內(nèi)容:第一部分,介紹了傳感器熱電制冷封裝的結(jié)構(gòu)、功能、以及其研究意義。對(duì)傳感器的制冷方法進(jìn)行了總結(jié)和對(duì)比,并闡述了TEC制冷封裝的優(yōu)勢與特點(diǎn)。并在此部分對(duì)熱電制冷封裝的國內(nèi)外研究動(dòng)態(tài)以及發(fā)展情況進(jìn)行了介紹,指出此技術(shù)在國內(nèi)外發(fā)展的水平及其不平衡。第二部分,介紹了熱電制冷器的基本效應(yīng)與基本原理,列出了熱電制冷器的相關(guān)計(jì)算公式,幫助我們估算熱電制冷器的制冷能力。對(duì)通用的熱電制冷器選型的方法進(jìn)行了總結(jié),并介紹我們的熱電制冷器選型的詳細(xì)過程。第三部分,介紹了傳感器TEC制冷封裝的設(shè)計(jì)過程。首先對(duì)TEC制冷封裝進(jìn)行了基于ANSYS Icepak的有限元仿真分析,記錄了詳細(xì)的仿真步驟,并分析仿真結(jié)果。接下來研究了仿真得到的封裝結(jié)構(gòu),總結(jié)了各部分的材料、密封腔的引線引出技術(shù)以及散熱器的選擇方法。最后對(duì)封裝配套的TEC制冷控制系統(tǒng)的設(shè)計(jì)過程進(jìn)行了闡述。本設(shè)計(jì)利用FPGA作為主控芯片,通過數(shù)字PID算法,輸出PWM信號(hào)控制H橋以驅(qū)動(dòng)熱電制冷器。溫度傳感器使用了PT1000,通過MAX31865芯片轉(zhuǎn)換電阻值傳并送至FPGA。上位機(jī)通過串口與控制器進(jìn)行通信,以設(shè)定制冷目標(biāo)溫度。第四部分,搭建了傳感器TEC制冷封裝實(shí)驗(yàn)平臺(tái),設(shè)計(jì)相關(guān)制冷實(shí)驗(yàn)并對(duì)實(shí)驗(yàn)結(jié)果進(jìn)行了分析。
[Abstract]:Some sensor chips, such as image sensors and pressure sensors, whose key performance is greatly affected by temperature, when the temperature is greater than absolute zero, the higher the temperature, the greater the thermal noise generated when it works. In order to solve this engineering problem, we study the thermoelectric chiller packaging of some sensors and use thermoelectric refrigerators to refrigerate them. In order to restrain the thermal noise caused by the sensor working or the sensitivity decrease caused by the high temperature, the research shows that the high temperature also accelerates the aging of the sensor chip. So it is necessary to integrate thermoelectric refrigeration package into sensor chip. This paper mainly includes the following aspects: the first part introduces the structure and function of sensor thermoelectric refrigeration package. And its significance. The refrigeration methods of the sensor are summarized and compared. The advantages and characteristics of TEC refrigeration package are described. In this part, the domestic and foreign research trends and development of thermoelectric refrigeration package are introduced. The development level and unbalance of this technology at home and abroad are pointed out. In the second part, the basic effect and principle of thermoelectric cooler are introduced, and the calculation formulas of thermoelectric cooler are listed. To help us estimate the refrigeration capacity of thermoelectric refrigerators. The general method of thermoelectric refrigerators selection is summarized, and the detailed process of the selection of our thermoelectric refrigerators is introduced. The third part. The design process of sensor TEC refrigeration package is introduced. Firstly, the finite element simulation analysis of TEC refrigeration package based on ANSYS Icepak is carried out, and the detailed simulation steps are recorded. The simulation results are analyzed. Then, the encapsulation structure of the simulation is studied, and the materials of each part are summarized. The lead extraction technology of the seal chamber and the selection method of the radiator. Finally, the design process of the packaged TEC refrigeration control system is described. In this design, FPGA is used as the main control chip. Through the digital PID algorithm, the output PWM signal controls the H bridge to drive the thermoelectric cooler. The temperature sensor uses PT1000. The host computer communicates with the controller through serial port to set the refrigeration target temperature. 4th part. The experimental platform of sensor TEC refrigeration package was built, and the related refrigeration experiment was designed and the experimental results were analyzed.
【學(xué)位授予單位】：中國科學(xué)院大學(xué)(中國科學(xué)院光電技術(shù)研究所)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TP212

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本文編號(hào)：1371511