發(fā)布時(shí)間：2018-01-11 12:20

  本文關(guān)鍵詞：面向ATLAS Phase-Ⅱ升級(jí)部分探測器前端電子學(xué)測試平臺(tái)的研究　出處：《中國科學(xué)技術(shù)大學(xué)》2017年博士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 探測器前端電子學(xué) 高壓CMOS像素探測器 像素探測器束流測試 商用ADC耐輻照性能測試

【摘要】：位于瑞士和法國交界處的大型強(qiáng)子對撞機(jī)(LHC)作為目前世界上最大的粒子對撞機(jī),自從2008年開始運(yùn)行以來取得了許多重大的科研成果,如發(fā)現(xiàn)了希格斯玻色子等。由于LHC中各個(gè)探測器在運(yùn)行中不斷受到輻照損傷,以及預(yù)計(jì)的對撞亮度的提升將使得其事例數(shù)超出目前其探測器的電子學(xué)系統(tǒng)的處理能力,LHC總共規(guī)劃Phase-0至Phase-2三次重大的升級(jí)與更新計(jì)劃。本論文工作主要為LHC超環(huán)面儀器實(shí)驗(yàn)(ATLAS)探測器的液氬量能器與像素探測器的Phase-Ⅱ升級(jí)相關(guān)的部分前端電子學(xué)測試平臺(tái)研究工作。內(nèi)部探測器的升級(jí)作為ATLAS探測器Phase-Ⅱ升級(jí)最重要的內(nèi)容之一,其將可能會(huì)使用高壓CMOS工藝作為其傳感器工藝之一,相應(yīng)的預(yù)研工作正在緊密的進(jìn)行。為了驗(yàn)證這種工藝能夠在探測效率和抗輻照損傷這些重要參數(shù)上是否滿足像素探測器Phase-Ⅱ升級(jí)的需求,必然要對其進(jìn)行大量的電子學(xué)測試和束流測試工作以驗(yàn)證其可靠性。面向此測試需求,本論文設(shè)計(jì)了一個(gè)模塊化的,基于為ATLAS升級(jí)研究的通用前端數(shù)據(jù)采集系統(tǒng)"前端鏈路交換系統(tǒng)"(Front-End LInk eXchang,FELIX)的一個(gè)像素探測器束流測試平臺(tái)。目前該像素探測器束流測試系統(tǒng)已于2015年11月正式開始使用,完成了多款A(yù)MS(Austria Mikro Systeme)180nm工藝的像素探測器原型芯片的束流測試工作,確定了其輻照前后的探測效率與時(shí)間響應(yīng)等重要參數(shù)。且從2016年9月開始應(yīng)用于AMS 350nm工藝的像素探測器驗(yàn)證芯片的束流測試工作。液氬量能器部分將在Phase-Ⅱ升級(jí)中使用全新的前端電子學(xué)板(FEB-2),耐輻照ADC的研究為設(shè)計(jì)制造FEB-2工作的重要工作組成部分。在進(jìn)行相應(yīng)耐輻照ADC專用集成電路(ASIC)芯片設(shè)計(jì)的同時(shí),需要選擇一些能夠通過輻照測試驗(yàn)證的商用ADC作為其備份芯片。針對商用ADC耐輻照性能測試這一需求,設(shè)計(jì)了一套用于多通道高速ADC耐輻照性能測試的測試平臺(tái)。目前該ADC耐輻照性能測試平臺(tái)已經(jīng)用于第一批候選的商用多通道ADC,德州儀器公司的ADS52J90與ADI公司的AD9249的耐輻照性能測試工作。其中總劑量效應(yīng)測試在美國布魯克海文國家實(shí)驗(yàn)室的固態(tài)伽瑪輻照設(shè)施中進(jìn)行,輻照源為一個(gè)活度為700居里的60Co伽瑪源,測試時(shí)的輻照劑量率約為1OKRad(Si)每小時(shí);單粒子效應(yīng)測試在美國麻省總醫(yī)院內(nèi)用于腫瘤治療的質(zhì)子治療中心中進(jìn)行,用于進(jìn)行輻照測試的質(zhì)子能量為216MeV。輻照測試結(jié)果驗(yàn)證了該ADC耐輻照性能測試平臺(tái)的通用性與可靠性,首次確定了這兩片商用ADC的耐輻照性能指標(biāo)。此外,液氬量能器合作組在Phase-Ⅱ升級(jí)計(jì)劃中提出了一種將所有FEB-2將要使用的電子學(xué)模塊(如前放、ADC等)集成到一塊芯片"前端片上系統(tǒng)"(Front-End System on Chip,FE-SOC)上的構(gòu)想。目前FE-SOC的各個(gè)模塊的預(yù)研工作正在各個(gè)研究單位同時(shí)進(jìn)行,其中前放成形電路部分的原型ASIC有BNL研制的8通道前放成形芯片HLC1,以及法國Omega/LAL組研制的8通道前放ASIC芯片LAUROC。針對這兩種多通道前放成型ASIC的測試需求,設(shè)計(jì)了一個(gè)通用的可以對這兩種前放ASIC芯片進(jìn)行電子學(xué)以及耐輻照性能測試的測試平臺(tái)。對該平臺(tái)的測試結(jié)果表明,其能夠滿足LAUROC芯片以及HLC1芯片的電子學(xué)以及耐輻照性能測試的需求。本論文的創(chuàng)新點(diǎn)表現(xiàn)在以下幾方面:1)設(shè)計(jì)了一套能夠同時(shí)運(yùn)行與配置待測待測像素探測器、對像素探測器讀出芯片(FE-I4B)進(jìn)行控制與讀出、且同時(shí)對整個(gè)束流測試Telescope的6個(gè)IBL雙芯片像素探測器模塊進(jìn)行數(shù)據(jù)讀出的像素探測器束流測試平臺(tái)。為ATLAS探測器Phase-Ⅱ升級(jí)中可能使用的高壓CMOS像素探測器提供了測試手段。使用這套束流測試系統(tǒng),ATLAS像素探測器合作組首次確定了使用AMS公司180nm高壓CMOS工藝設(shè)計(jì)的AMS180Vx系列小尺寸像素探測器原型芯片的探測效率等重要參數(shù),直接推動(dòng)了使用該工藝進(jìn)行全尺寸驗(yàn)證芯片的研究工作。2)像素探測器束流測試平臺(tái)使用了 ATLAS升級(jí)將使用的通用前端數(shù)據(jù)采集方案"前端鏈路交換系統(tǒng)"(Front-End LInk exchange,FELIX)作為其數(shù)據(jù)采集方案,將束流測試系統(tǒng)的數(shù)據(jù)帶寬上限從以往的千兆以太網(wǎng)級(jí)別或者USB通訊級(jí)別直接提升到了 100Gbps(24Links × 4.8Gbps)級(jí)別。3)針對ATLAS探測器Phase-Ⅱ升級(jí)中液氬量能器部分前端電子學(xué)讀出板的抗輻照需求,設(shè)計(jì)了一個(gè)多通道ADC耐輻照性能測試平臺(tái)。使用此平臺(tái)測試了兩款新型商用多通道ADC:德州儀器公司的ADS52J90與ADI公司的AD9249的抗輻照性能。
[Abstract]:The Large Hadron Collider in Switzerland and France at the junction (LHC) as the world's largest particle collider, since the beginning of operation in 2008 has achieved many significant achievements in scientific research, such as discovery of the Higgs boson. Because each detector in LHC continuous irradiation damage in operation, and is expected to improve the brightness of the collision will the number of cases beyond the current capacity of the detector electronics system processing, LHC Phase-0 to Phase-2 planning a total of three major upgrade plan. The main work of this thesis is LHC toroidal instrument (ATLAS) Phase- detector of liquid argon calorimeter and pixel detector II upgrade the relevant part of the front-end electronics test the platform of research work. The internal detector ATLAS detector Phase- II upgrade upgrade as one of the most important content, it will probably use high voltage CMOS process As one of the sensor technology, the corresponding research work is closely. In order to verify this process can in the detection efficiency and anti radiation damage meets the pixel detector Phase- II needs to upgrade these important parameters, necessary to carry out a large number of electronics test and beam test to verify the reliability of the test for the demand. In this paper, we design a modular, universal front-end data acquisition system for ATLAS upgrade of front-end link exchange system based on "(Front-End LInk eXchang, FELIX) of a pixel detector beam test platform. The pixel detector beam test system has been started in November 2015, completed a variety of AMS (Austria Mikro Systeme) pixel detector prototype chip 180nm process the beam test, to determine the detection efficiency and the time before and after irradiation. The important parameters should be started. And the pixel detector is applied to AMS 350nm chip verification process of the beam test work from September 2016. The liquid argon calorimeter will use part of the front-end electronics board in new Phase- II upgrade (FEB-2), an important work of radiation resistant ADC for the design and manufacture of FEB-2 work in part. The corresponding radiation resistant ADC application specific integrated circuit (ASIC) chip design at the same time, to choose some through the irradiation test to verify the commercial ADC chip as its backup. Radiation resistance test the demand for commercial ADC, a test platform to test the performance of resistance to irradiation for multi channel high speed ADC is designed. The tolerance of ADC irradiation performance test platform has been used in commercial multi-channel ADC the first candidate, radiation resistance test of ADS52J90 and ADI, TI, AD9249. The total dose effect Solid gamma irradiation facility in the United States Brook Brookhaven National Laboratory tests, radiation source 60Co a gamma source activity was 700 Curie, when testing the radiation dose rate is about 1OKRad (Si) per hour; single particle effect testing in the United States in the Massachusetts General Hospital for proton therapy center in tumor therapy used for testing the proton irradiation, energy verified the versatility and reliability of the ADC radiation resistance test platform for 216MeV. irradiation test results, for the first time to determine the index radiation resistance of these two pieces of commercial ADC. In addition, the amount of liquid argon is the cooperation group in the Phase- II upgrade plan is put forward for electronics module all FEB-2 will be used (such as the ADC, etc.) are integrated into a chip on chip front-end system "(Front-End System on Chip, FE-SOC) on the idea. At present the modules of FE-SOC pre research work is The various research units at the same time, the first prototype of ASIC forming circuit part of the 8 channel BNL developed before forming HLC1 chip, the requirements of the test and 8 channel France Omega/LAL group developed before ASIC LAUROC. chip for the two multi channel before forming ASIC, designed a general of the two a former put ASIC chip electronics and resistance test platform. The irradiation performance test platform test results show that it can meet the LAUROC chip and HLC1 chip electronics and radiation resistance testing needs. The innovation of this paper is shown in the following aspects: 1) is designed to run at the same time and configuration the measured pixel detector to be measured, the pixel readout chip (FE-I4B) control and readout, and at the same time for the whole beam test Telescope 6 IBL dual chip pixel detector module for data The pixel detector readout beam flow test platform. The high CMOS pixel detector for ATLAS detector Phase- II upgrade in use provides a means of testing. The use of this beam test system, ATLAS pixel detector cooperation team is the first to identify the detection efficiency of the important parameters such as the use of AMS 180nm high voltage CMOS process design AMS180Vx series small size pixel detector the prototype chip, directly promotes the full size verification chip using the technology of.2) pixel detector beam test platform using ATLAS to upgrade the general front-end data collection scheme using the "front-end link exchange system" (Front-End LInk, exchange, FELIX) as the data acquisition program, data bandwidth cap beam the test system from the previous level of Gigabit Ethernet or USB communication level directly to the 100Gbps (24Links * 4.8Gbps) grade.3) In view of the ATLAS detector Phase- II upgrade liquid argon calorimeter front-end readout electronics board anti irradiation needs, design a multi channel ADC radiation resistance test platform. Anti irradiation performance of ADS52J90 and ADI, two new commercial channel ADC: TI's AD9249 test using this platform.

【學(xué)位授予單位】：中國科學(xué)技術(shù)大學(xué)
【學(xué)位級(jí)別】：博士
【學(xué)位授予年份】：2017
【分類號(hào)】：O572.212

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中國博士學(xué)位論文全文數(shù)據(jù)庫 前1條

1 劉洪斌;面向ATLAS Phase-Ⅱ升級(jí)部分探測器前端電子學(xué)測試平臺(tái)的研究[D];中國科學(xué)技術(shù)大學(xué);2017年

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本文編號(hào)：1409497