發(fā)布時(shí)間：2018-02-12 06:03

  本文關(guān)鍵詞： 倒裝芯片 實(shí)驗(yàn)驗(yàn)證 二維化 數(shù)值分析 多邊填充　出處：《華東理工大學(xué)》2017年碩士論文　論文類型：學(xué)位論文

【摘要】：倒裝芯片技術(shù)由于具有輸入/輸出容量大、能改善電氣性能等優(yōu)點(diǎn)而被廣泛應(yīng)用于半導(dǎo)體封裝行業(yè)。下填充是倒裝芯片封裝中的重要工藝環(huán)節(jié),其中又以毛細(xì)壓驅(qū)動(dòng)的下填充封裝工藝最為常見。研究封裝材料在下填充過程中的流動(dòng)行為對(duì)實(shí)際的下填充封裝生產(chǎn)有重要的指導(dǎo)作用。本文通過實(shí)驗(yàn)的方法研究了下填充流體的流動(dòng)行為,重點(diǎn)考察了焊球的大小、間距和布膠方式對(duì)流動(dòng)的影響,并據(jù)此驗(yàn)證了二維化數(shù)值分析方法的準(zhǔn)確性。本文的主要研究?jī)?nèi)容和結(jié)果有以下幾個(gè)方面:(1)應(yīng)用光刻技術(shù)制作了下填充實(shí)驗(yàn)所需要的倒裝芯片試樣,其中基板和芯片用透明的玻璃片代替,焊球通過刻蝕玻璃片表面的硅得到,三者通過SOG(Silicon on Glass)技術(shù)鍵合在一起,實(shí)現(xiàn)了下填充流動(dòng)過程的可視化。(2)搭建了下填充流動(dòng)可視化實(shí)驗(yàn)平臺(tái),通過對(duì)13組試樣的下填充實(shí)驗(yàn)對(duì)比,研究了焊球直徑、焊球間距以及布膠方式對(duì)下填充流動(dòng)的影響。(3)針對(duì)實(shí)驗(yàn)案例,應(yīng)用二維化數(shù)值分析方法模擬了下填充流動(dòng)過程,通過與實(shí)驗(yàn)結(jié)果比較,驗(yàn)證了二維模擬的準(zhǔn)確性,并進(jìn)一步分析了模擬與實(shí)驗(yàn)結(jié)果之間的誤差。(4)將二維化數(shù)值分析方法應(yīng)用于來自IBM公司的倒裝芯片的下填充過程,用下填充實(shí)驗(yàn)檢驗(yàn)了其準(zhǔn)確性,說明了二維化數(shù)值分析方法在倒裝芯片下填充領(lǐng)域具有較大的實(shí)際應(yīng)用價(jià)值。
[Abstract]:Flip-chip technology is widely used in semiconductor packaging industry because of its large input / output capacity and the ability to improve electrical performance. Among them, the capillary pressure driven underfill packaging process is the most common. The study of the flow behavior of packaging materials in the process of underfill packaging has an important guiding role in the actual production of underfilled packaging. The flow behavior of the down-filled fluid is studied. The effects of the size, spacing and glue pattern of the solder ball on the flow were investigated. The accuracy of the two-dimensional numerical analysis method is verified. The main contents and results of this paper are as follows: 1. The substrate and chip are replaced by transparent glass sheets, the solder balls are obtained by etching silicon on the surface of the glass sheets, and the three are bonded together by SOG(Silicon on glass technology. The visualization of the flow process is realized. (2) A visual experimental platform for the flow of the lower filling is built. The diameter of the solder ball is studied by comparing the experiments of 13 groups of samples. The effect of solder ball spacing and glue distribution on the flow of underfill. (3) in view of the experimental cases, the flow process of the lower filling is simulated by using two-dimensional numerical analysis method. The accuracy of the two-dimensional simulation is verified by comparing with the experimental results. Furthermore, the error between simulation and experimental results is analyzed. The two-dimensional numerical analysis method is applied to the underfilling process of the inverted chip from IBM Company. The accuracy of this method is verified by the underfilling experiment. It is shown that the two-dimensional numerical analysis method has great practical application value in the field of filling under the inverted chip.
【學(xué)位授予單位】：華東理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TN405;O35

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