本文選題：物聯(lián)網(wǎng) + 核心板��； 參考：《山東大學(xué)》2017年碩士論文

【摘要】：近年來(lái),隨著物聯(lián)網(wǎng)的飛速發(fā)展,萬(wàn)物互聯(lián)的趨勢(shì)越來(lái)越顯著,各種智能設(shè)備的研發(fā)需求越來(lái)越多,而無(wú)論是4G通信技術(shù),還是智能器件的應(yīng)用,智能設(shè)備研發(fā)的難度,已經(jīng)成為物聯(lián)網(wǎng)的發(fā)展的瓶頸。為了解決這個(gè)問(wèn)題,利用消費(fèi)類電子的技術(shù)方案,研發(fā)一款支持4G全網(wǎng)通的核心板。核心板承載了大部分的研發(fā)任務(wù),提供給物聯(lián)網(wǎng)設(shè)備廠家,他們根據(jù)自身需求進(jìn)行簡(jiǎn)單的二次開(kāi)發(fā)即可。本文從物聯(lián)網(wǎng)設(shè)備的需求出發(fā),確認(rèn)核心板的規(guī)格,從而搭建合適的原理圖,進(jìn)行PCB的設(shè)計(jì)。在核心板PCB設(shè)計(jì)過(guò)程中,必然要面對(duì)電磁干擾的問(wèn)題。結(jié)合項(xiàng)目具體的設(shè)計(jì)研究,論文對(duì)核心板的開(kāi)發(fā)過(guò)程和主要技術(shù)進(jìn)行了詳細(xì)的總結(jié)介紹。主要內(nèi)容包括:1.介紹核心板采用的芯片方案,對(duì)各主要芯片的功能進(jìn)行簡(jiǎn)單的介紹,并給出系統(tǒng)框架圖。2.確定核心板的外圍接口并進(jìn)行詳細(xì)的介紹,也總結(jié)相關(guān)接口的設(shè)計(jì)規(guī)則。此外,設(shè)計(jì)了一套4G全網(wǎng)通的解決方案,并給出相關(guān)的架構(gòu)圖。3.對(duì)核心板的EMC設(shè)計(jì)進(jìn)行研究總結(jié)。從疊層結(jié)構(gòu)、阻抗控制、器件布局以及射頻部分EMC設(shè)計(jì)等多個(gè)方面進(jìn)行了深入研究,在已有EMC設(shè)計(jì)經(jīng)驗(yàn)的基礎(chǔ)上,根據(jù)實(shí)際設(shè)計(jì)情況,提出一些新的設(shè)計(jì)方法。4.研究電源完整性設(shè)計(jì),總結(jié)PDN設(shè)計(jì)中的的多個(gè)要點(diǎn)。設(shè)計(jì)完成之后通過(guò)軟件仿真來(lái)驗(yàn)證,并不斷修改設(shè)計(jì)以保證最終滿足PDN設(shè)計(jì)的阻抗要求。5.給出核心板各層設(shè)計(jì)圖,并提供核心板相關(guān)的生產(chǎn)測(cè)試工裝設(shè)計(jì)。
[Abstract]:In recent years, with the rapid development of the Internet of things, the trend of interconnection of all things becomes more and more obvious, and the research and development needs of various intelligent devices are more and more, and whether 4G communication technology or the application of smart devices, the research and development of intelligent devices is difficult. Has become the bottleneck of the development of the Internet of things. In order to solve this problem, a core board supporting 4G All-Netcom is developed using the technology of consumer electronics. The core board carries most of the research and development tasks and provides to the Internet of things equipment manufacturers, they can carry out simple secondary development according to their own needs. Based on the requirements of the Internet of things, this paper confirms the specification of the core board, and builds a suitable schematic to design the PCB. In the process of core board PCB design, electromagnetic interference is inevitable. Combined with the specific design of the project, the development process and main technology of the core board are summarized and introduced in detail. The main contents include: 1. This paper introduces the chip scheme used in the core board, briefly introduces the functions of the main chips, and gives the system frame diagram. 2. 2. The peripheral interface of the core board is determined and introduced in detail, and the design rules of the related interface are also summarized. In addition, a solution of 4G All-Netcom is designed, and the related architecture diagram. 3. 3. The EMC design of the core board is summarized. In this paper, the stack structure, impedance control, device layout and RF part EMC design are studied in detail. Based on the experience of EMC design, some new design methods .4. This paper studies the power integrity design and summarizes several key points in the PDN design. After the design is completed, it is verified by software simulation, and the design is constantly modified to ensure that the impedance requirement of PDN design is finally met. The design drawings of each layer of the core board are given, and the design of the production test tools related to the core board is provided.
【學(xué)位授予單位】：山東大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TP391.44;TN929.5;TN41

【相似文獻(xiàn)】

相關(guān)期刊論文 前8條

1 ;2009年版中國(guó)科技期刊引證報(bào)告(核心板)[J];系統(tǒng)仿真學(xué)報(bào);2010年03期

2 ;2009年版中國(guó)科技期刊引證報(bào)告(核心板)[J];系統(tǒng)仿真學(xué)報(bào);2010年05期

3 ;2009年版中國(guó)科技期刊引證報(bào)告(核心板)[J];系統(tǒng)仿真學(xué)報(bào);2009年24期

4 ;2009年版中國(guó)科技期刊引證報(bào)告(核心板)[J];系統(tǒng)仿真學(xué)報(bào);2010年01期

5 李頎;張艷東;;一種新型多功能手持設(shè)備核心板的設(shè)計(jì)與實(shí)現(xiàn)[J];計(jì)算機(jī)測(cè)量與控制;2012年02期

6 ;研華推出基于Freescale i.MX53工業(yè)級(jí)ARM核心板[J];工業(yè)控制計(jì)算機(jī);2011年11期

7 ;研華推出基于Freescale i.MX53工業(yè)級(jí)ARM核心板[J];自動(dòng)化與儀器儀表;2011年06期

8 張波;;關(guān)于YLE2410核心板Flash的增容方法[J];中國(guó)現(xiàn)代教育裝備;2009年09期

相關(guān)碩士學(xué)位論文 前7條

1 荊麗梅;基于多核心板互換的單片機(jī)實(shí)訓(xùn)教學(xué)系統(tǒng)的設(shè)計(jì)[D];湖南大學(xué);2015年

2 姜會(huì)友;面向物聯(lián)網(wǎng)的核心板方案的設(shè)計(jì)與研究[D];山東大學(xué);2017年

3 郭曉亮;可擴(kuò)展的高速信號(hào)處理核心板硬件設(shè)計(jì)[D];哈爾濱工程大學(xué);2012年

4 張艷東;基于PXA 3XX的手持設(shè)備核心板的設(shè)計(jì)與開(kāi)發(fā)[D];陜西科技大學(xué);2012年

5 張麗霞;數(shù)據(jù)采集裝置嵌入式ARM9核心板的設(shè)計(jì)與實(shí)現(xiàn)[D];湖南大學(xué);2011年

6 李俊杰;基于STM32F207工業(yè)核心板的研究與實(shí)現(xiàn)[D];湖南大學(xué);2012年

7 云慧峰;基于S3C2410X嵌入式核心板的設(shè)計(jì)與制作[D];內(nèi)蒙古大學(xué);2010年

，

本文編號(hào)：1917463