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環(huán)糊精修飾丙烯酰胺聚合物對(duì)L485鋼的腐蝕行為研究

發(fā)布時(shí)間:2018-03-26 14:54

  本文選題:環(huán)糊精 切入點(diǎn):丙烯酰胺 出處:《西南石油大學(xué)》2015年碩士論文


【摘要】:在石油天然氣開(kāi)發(fā)過(guò)程中,油田管道與設(shè)備的腐蝕普遍存在,因此研究金屬的腐蝕與防護(hù)對(duì)石油工業(yè)的發(fā)展具有重要意義。緩蝕劑由于具有加量少、見(jiàn)效快等優(yōu)點(diǎn)而應(yīng)用最為廣泛。本文運(yùn)用電化學(xué)阻抗譜(EIS、Tafel極化曲線(xiàn)、掃描電子顯微鏡技術(shù)(SEM)及分子動(dòng)力學(xué)模擬(MD)研究了環(huán)糊精修飾丙烯酰胺聚合物(HCMPAM)在0.5mol/LH2SO4溶液中對(duì)L485鋼的腐蝕行為。同時(shí)分析了HCMPAM在L485鋼表面的吸附模型和熱力學(xué)、動(dòng)力學(xué)參數(shù),為HCMPAM作為緩蝕劑在實(shí)際中的應(yīng)用及可行性提供理論依據(jù)。論文的主要研究?jī)?nèi)容如下: (1)本文利用EIS、Tafel曲線(xiàn)研究了在不同物質(zhì)濃度、介質(zhì)溫度條件下,p-環(huán)糊精(p-CD)和HCMPAM在0.5mol/L H2SO4容液中對(duì)L485鋼的腐蝕行為。結(jié)果表明:加入β-CD和HCMPAM后,L485鋼在H2S04中發(fā)生腐蝕的電荷轉(zhuǎn)移電阻Rct增大,雙電層電容Q1降低,腐蝕電流密度icorr減小,L485鋼在H2S04中的腐蝕減弱,且HCMPAM能L485鋼表面吸附形成保護(hù)膜而并沒(méi)有改變鋼的腐蝕機(jī)理。另外,HCMPAM表現(xiàn)為混合型緩蝕劑,其緩蝕效率隨著濃度的增大而增加,隨著溫度的升高而降低。其中p-CD和HCMPAM緩蝕效率順序?yàn)?HCMPAMβ-CD,β-CD對(duì)L485鋼幾乎不表現(xiàn)出緩蝕效果。 (2)利用Tafel曲線(xiàn)的icorr數(shù)據(jù)分析了HCMPAM在L485鋼表面的吸附模型及相關(guān)動(dòng)力學(xué)、熱力學(xué)參數(shù)。結(jié)果表明:L485鋼在H2S04中的腐蝕為吸熱過(guò)程,因此溫度的升高會(huì)加劇L485鋼的腐蝕。HCMPAM的加入,使L485鋼在H2S04中發(fā)生腐蝕反應(yīng)所需的活化能Ea和活化焓△H*增加,從而增大了L485鋼發(fā)生溶解腐蝕的阻力。同時(shí)HCMPAM在L485鋼表面的吸附符合Langmuir吸附模型,HCMPAM分子通過(guò)化學(xué)作用自發(fā)的吸附在L485鋼表面。另外,HCMPAM在L485鋼表面的吸附是放熱過(guò)程,因此升溫會(huì)減弱HCMPAM在L485鋼表面的吸附。 (3)SEM和EDS分析結(jié)果表明:相比空白溶液而言,當(dāng)加入HCMPAM時(shí),L485鋼表面表現(xiàn)為均勻腐蝕,無(wú)點(diǎn)蝕發(fā)生;另外,從EDS分析結(jié)果可以看出,加入HCMPAM后,L485鋼表面腐蝕產(chǎn)物中Fe的含量明顯升高,O的含量明顯降低,且檢測(cè)到N原子的存在,因此HCMPAM分子能吸附在L485鋼表面形成保護(hù)膜從而阻礙H2SO4介質(zhì)與L485鋼表面接觸。 (4)MD研究表明:HCMPAM能較快且平行地吸附在Fe表面,且HCMPAM分子通過(guò)分子中的氮、氧等原子與Fe原子的成鍵和非鍵共同作用吸附在Fe表面。
[Abstract]:In the course of oil and gas development, corrosion of pipelines and equipments in oil fields is widespread, so it is important to study corrosion and protection of metals for the development of petroleum industry. In this paper, electrochemical impedance spectroscopy (EIS) and Tafel polarization curve are used. The corrosion behavior of cyclodextrin modified acrylamide polymer (HCMPAM) on L485 steel in 0.5mol/LH2SO4 solution was studied by scanning electron microscopy (SEM) and molecular dynamics simulation (MD). The adsorption model, thermodynamics and kinetic parameters of HCMPAM on L485 steel surface were also analyzed. To provide theoretical basis for the application and feasibility of HCMPAM as corrosion inhibitor in practice. The main contents of this paper are as follows:. 1) in this paper, the concentration of different substances was studied by using the EIS-Tafel curve. The corrosion behavior of p-CD and HCMPAM on L485 steel in 0.5mol/L H2SO4 solution at medium temperature. The results show that the charge transfer resistance (Rct) of L485 steel corroded in H2S04 increases with the addition of 尾 -CD and HCMPAM, and the double layer capacitance Q1 decreases with the addition of 尾 -CD and HCMPAM. The corrosion current density (icorr) decreases the corrosion of L485 steel in H2S04, and the corrosion inhibition efficiency increases with the increase of the concentration of L485 steel, and the corrosion mechanism of L485 steel is not changed by the adsorption of the protective film on the surface of HCMPAM, and the corrosion inhibition efficiency of L485 steel increases with the increase of the concentration. The corrosion inhibition efficiency of p-CD and HCMPAM is in the order of: HCMPAM 尾 -CD-CD, and 尾 -CD has little inhibition effect on L485 steel. Using the icorr data of Tafel curve, the adsorption model of HCMPAM on the surface of L485 steel and the related kinetic and thermodynamic parameters are analyzed. The results show that the corrosion of HCMPAM in H2S04 is an endothermic process, so the increase of temperature will aggravate the corrosion of L485 steel. The activation energy (EA) and activation enthalpy (H *) required for the corrosion reaction of L485 steel in H2S04 were increased. Meanwhile, the adsorption of HCMPAM on L485 steel surface accords with the Langmuir adsorption model. The adsorption of HCMPAM molecules on L485 steel surface spontaneously by chemical action. In addition, the adsorption of HCMPAM on L485 steel surface is exothermic, and the adsorption of HCMPAM on L485 steel surface is an exothermic process, and the adsorption of HCMPAM on L485 steel surface is an exothermic process. Therefore, the adsorption of HCMPAM on the surface of L485 steel will be weakened by heating. The results of SEM and EDS analysis show that compared with the blank solution, the surface of L485 steel is uniformly corroded and no pitting corrosion occurs when HCMPAM is added, in addition, it can be seen from the results of EDS analysis, After adding HCMPAM, the content of Fe in the corrosion products of L485 steel obviously increased and the content of O decreased obviously, and the presence of N atoms was detected. Therefore, HCMPAM molecules can be adsorbed on the surface of L485 steel to form a protective film, which hinders the contact between H2SO4 medium and the surface of L485 steel. The results show that HCMPAM molecules can be adsorbed on Fe surface quickly and parallel, and HCMPAM molecules are adsorbed on Fe surface by the bonding and non-bonding interaction of atoms such as nitrogen and oxygen with Fe atoms.
【學(xué)位授予單位】:西南石油大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2015
【分類(lèi)號(hào)】:TE980;O631.3

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