【摘要】：隨著集成電路的發(fā)展,應(yīng)對(duì)各種新材料與半導(dǎo)體的需要,先進(jìn)的封裝技術(shù)也隨之發(fā)展和改變,為了使芯片能跟外設(shè)平滑輸入\輸出,需要建立電連接,這個(gè)連接是在外部管腳和內(nèi)部芯片之間,還有芯片相互之間,并且是整個(gè)厚后封裝過(guò)程中極重要的步驟,90%以上的所有封裝管腳使用引線鍵合焊接,實(shí)現(xiàn)了簡(jiǎn)單、成本低、適合于各種中的主導(dǎo)地位的連接方式。引線鍵合之前,首先從引線框架材料(外引線)上選取金屬帶切斷,通過(guò)熱壓方法加壓在引線框架上的高純度Si或Ge的半導(dǎo)體元件,和一個(gè)導(dǎo)電樹(shù)脂如銀漿料覆有金或通過(guò)在引線框架的表面上少部分電鍍一層很薄的金;用特殊焊接方式使電路和金屬絲鍵合,貼合后的電路是帶有保護(hù)性的樹(shù)脂封裝。到20世紀(jì)90年代,機(jī)器視覺(jué)系統(tǒng)的研究和集成電路芯片制造設(shè)備的集成電路芯片視覺(jué)檢測(cè)如雨后春筍般出現(xiàn)了。從印刷電路板(PCB)的檢測(cè),芯片封裝過(guò)程以及向焊點(diǎn),焊絲質(zhì)量檢測(cè),以實(shí)時(shí)檢測(cè)和控制,越來(lái)越廣泛的使用范疇。視覺(jué)系統(tǒng)被用來(lái)從簡(jiǎn)單的存在性驗(yàn)查和分類進(jìn)行檢測(cè),涉及到尺寸檢查和表面質(zhì)量檢查,然后對(duì)集成電路芯片精度定位,這將很大程度上提高視覺(jué)伺服控制和視覺(jué)系統(tǒng)的實(shí)時(shí)性和復(fù)雜性。由于芯片的集成度日益變高,芯片封裝速度和精度需要更先進(jìn)的封裝設(shè)備。近年來(lái)先后陸續(xù)出現(xiàn)焊接精度低于2.5um,焊線速度超過(guò)12線/秒的并且精度很高的自動(dòng)金絲球焊機(jī),這些機(jī)型的精度和速度的控制系統(tǒng)的改進(jìn)主要是由于線性電機(jī)驅(qū)動(dòng)的使用、軟觸摸控制和許多其他許多新技術(shù)的三維工作臺(tái)的采用;以及視覺(jué)系統(tǒng)使用多倍放大的顯微視覺(jué)系統(tǒng),高清CCD攝像機(jī)和一個(gè)獨(dú)特的視覺(jué)定位方法。本文的主要目的是考察機(jī)器人精密平臺(tái)在3D空間進(jìn)行芯片引線鍵合等操作,因此主要研究?jī)?nèi)容將圍繞在顯微環(huán)境下的視覺(jué)控制器的設(shè)計(jì)和攝像機(jī)參數(shù)的自標(biāo)定,同時(shí)考察芯片圖像的精密定位方法及視覺(jué)控制的效果、并探討視覺(jué)系統(tǒng)與運(yùn)動(dòng)控制系統(tǒng)集成的坐標(biāo)變換關(guān)系,及反饋控制實(shí)現(xiàn)方式。在現(xiàn)有的實(shí)驗(yàn)條件下,通過(guò)對(duì)現(xiàn)實(shí)生產(chǎn)環(huán)境的模擬實(shí)驗(yàn)表明,通過(guò)本文提出的芯片封裝顯微視覺(jué)系統(tǒng)的標(biāo)定算法定位所得的坐標(biāo)更為精確,誤差相對(duì)更小。
[Abstract]:With the development of integrated circuits, to meet the needs of various new materials and semiconductors, advanced packaging technology has also developed and changed. In order to make the chip and peripheral devices smooth input and output, we need to establish electrical connection. This connection is between the external pin and the internal chip, and also between the chips, and is an extremely important step in the whole thick post-packaging process. More than 90% of all packaging pins are welded by wire bonding, which is simple and low cost. Suitable for all kinds of dominant connections. Before the lead bonding, the semiconductor elements of high purity Si or Ge on the lead frame are first selected from the lead frame material (outer lead) to be cut off by hot pressing method. And a conductive resin such as silver paste coated with gold or by electroplating a thin layer of gold on the surface of the lead frame; the circuit is bonded to the wire by special welding, and the circuit after bonding is a protective resin package. By the 1990s, the research of machine vision system and the detection of integrated circuit chip for IC chip manufacturing equipment appeared. From PCB (PCB) detection chip encapsulation process to solder joint welding wire quality detection to real-time detection and control more and more widely used fields. Visual systems are used to detect from simple existential checks and classifications, involving size checks and surface quality checks, and then positioning the accuracy of integrated circuit chips. This will greatly improve the real-time and complexity of visual servo control and visual system. Due to the increasing integration of the chip, the speed and precision of the chip packaging need more advanced packaging equipment. In recent years, automatic gold-wire ball welding machines with welding accuracy of less than 2.5 umum, wire speed of more than 12 lines per second and high precision have been successively appeared. The improvement of the precision and speed control system of these machines is mainly due to the use of linear motor drive. Soft touch control and the adoption of many other new technologies for 3D workbench; and vision systems using multiple magnification microvision systems, high-definition CCD cameras and a unique visual positioning method. The main purpose of this paper is to investigate the robot precision platform in 3D space chip lead bonding operations, so the main research content will focus on the design of the vision controller and camera parameters self-calibration in the micro-environment. At the same time, the precision positioning method of chip image and the effect of visual control are investigated, and the coordinate transformation relationship between visual system and motion control system is discussed, and the realization of feedback control is also discussed. Under the existing experimental conditions, the simulation experiments on the real production environment show that the calibration algorithm proposed in this paper is more accurate and the error is relatively small.
【學(xué)位授予單位】：武漢工程大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2016
【分類號(hào)】：TN405;TP391.41

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