本文選題：機(jī)器視覺 + 非球面透鏡�。� 參考：《工程設(shè)計(jì)學(xué)報》2017年06期

【摘要】：在半導(dǎo)體激光器封裝過程中,針對非球面透鏡與半導(dǎo)體激光器的對準(zhǔn)過程中存在人工操作精度低、效率低的缺點(diǎn),開發(fā)了一套高精度自動化對準(zhǔn)系統(tǒng)。系統(tǒng)以機(jī)器視覺技術(shù)為基礎(chǔ),配置高性能CCS光源和高分辨率Basler相機(jī),能夠?qū)崟r采集高精度圖像;利用累計(jì)概率Hough變換和迭代重加權(quán)最小二乘法等圖像處理算法,快速擬合非球面透鏡和半導(dǎo)體激光器的邊緣直線,實(shí)現(xiàn)自動對準(zhǔn)。該系統(tǒng)采集的圖像精度達(dá)到了亞微米級別,而且在0.5s內(nèi)便可完成整個對準(zhǔn)過程,極大提高了非球面透鏡與半導(dǎo)體激光器封裝精度與效率。本視覺對準(zhǔn)系統(tǒng)基于高性能配置的精確的圖像處理算法,對傳統(tǒng)的封裝技術(shù)作出了很大改進(jìn),對提高未來半導(dǎo)體激光器封裝精度和效率具有較大的推動作用。
[Abstract]:In the process of semiconductor laser packaging, a set of high precision automatic alignment system is developed to overcome the disadvantages of low manual operation precision and low efficiency in the alignment process between aspheric lens and semiconductor laser. On the basis of machine vision technology, the system is equipped with high performance CCS light source and high resolution Basler camera, which can collect high precision images in real time, and make use of image processing algorithms such as cumulative probability Hough transform and iterative reweighted least square method, etc. The edge line of aspherical lens and semiconductor laser is fitted quickly and automatic alignment is realized. The system achieves sub-micron precision, and the whole alignment process can be completed within 0.5 s, which greatly improves the accuracy and efficiency of aspheric lens and semiconductor laser packaging. Based on the accurate image processing algorithm of high performance configuration, this vision alignment system has greatly improved the traditional packaging technology, and has great impetus to improve the accuracy and efficiency of semiconductor laser packaging in the future.
【作者單位】： 中南大學(xué)高性能復(fù)雜制造國家重點(diǎn)實(shí)驗(yàn)室;
【基金】：國家自然科學(xué)基金資助項(xiàng)目(51075402;50975293)
【分類號】：TN248.4;TP391.41
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本文編號：1873641