【摘要】：銅箔是制造印制電路板(PCB)的關(guān)鍵性導(dǎo)電材料。隨著PCB朝著多層化、薄型化、高密度化、高速化方向發(fā)展,對具有超薄、低輪廓、高強(qiáng)度、高延展性等高品質(zhì)的銅箔的需求愈加緊迫。所以超薄銅箔的制備和剝離問題已經(jīng)成為銅箔行業(yè)的研發(fā)熱點(diǎn)。本文旨在尋求新的單一或復(fù)合的有機(jī)剝離層組分,能夠在載體表面一次吸附成膜,用于制備最小厚度不超過4μm的超薄載體銅箔。本文用于形成剝離層的有機(jī)物有三種,包括苯并三氮唑(BTA)、噻唑類化合物MAT、以及MAT和植酸的混合物,其中BTA是作為參照物加以實(shí)驗(yàn)。采用恒電流法在35μm厚度的載體銅箔上沉積超薄銅箔,優(yōu)化有機(jī)吸附液濃度及吸附時間、沉積電流密度、沉積溫度和沉積時間；采用光學(xué)顯微鏡和掃描電子顯微鏡對所制備的超薄銅箔進(jìn)行表面形貌表征；采用Taf'el法和交流阻抗法分析各種剝離層對銅沉積電子傳遞過程的影響。結(jié)果表明,在銅箔沉積過程中,剝離層本性及吸附量、電流密度、溫度等因素對超薄銅箔的表面均勻性和可剝離性有明顯的影響,且不同剝離層對銅沉積電子傳遞過程的影響差異甚大。BTA剝離層對銅沉積反應(yīng)的阻力很大,且形成有效剝離層的BTA濃度高達(dá)10 g.L-1,制得的銅箔最小厚度為MAT剝離層對銅沉積反應(yīng)的阻力遠(yuǎn)小于BTA,形成有效剝離層的MAT濃度不超過1.0 g.L-1,制得的銅箔為片層狀結(jié)晶、表面平整的低輪廓銅箔,最小厚度不超過4μm。將植酸引入MAT中形成復(fù)合剝離層,使銅沉積反應(yīng)的阻力大為增加,制得的銅箔最小厚度進(jìn)一步減小為3μm,但銅箔的表面形貌對電流密度的大小很敏感,電流密度增大到6.0 A.dm-2以上時,銅箔表面顆粒變得粗糙疏松�？傊�,MAT作為一種新型剝離層明顯優(yōu)于BTA；植酸作為一種銅離子螯合劑在減小超薄銅箔厚度方面起到了初步的作用。
[Abstract]:Copper foil is the key conductive material for manufacturing printed circuit board (PCB). With the development of PCB towards multi-layer, thin, high density and high speed, the demand for ultra-thin, low profile, high strength, high extensibility and other high quality copper foil is becoming more and more urgent. Therefore, the preparation and peeling of ultra-thin copper foil has become a hot research and development topic in copper foil industry. The purpose of this paper is to find a new single or composite organic peeling layer component, which can be adsorbed on the surface of the carrier to form a film at one time, and can be used to prepare ultra-thin carrier copper foil with a minimum thickness of not more than 4 渭 m. In this paper, there are three kinds of organic compounds used to form stripping layer, including benzotriazole (BTA), thiazole compound MAT, and the mixture of MAT and phytic acid, in which BTA is used as a reference. Ultra-thin copper foil was deposited on 35 渭 m thick carrier copper foil by constant current method. The concentration and adsorption time of organic adsorption solution, deposition current density, deposition temperature and deposition time were optimized. The surface morphology of the ultra-thin copper foil was characterized by optical microscope and scanning electron microscope, and the effects of various stripping layers on the electron transfer process of copper deposition were analyzed by Taf'el and AC impedance methods. The results show that the nature of stripping layer, adsorption capacity, current density and temperature have obvious effects on the surface uniformity and strippability of ultra-thin copper foil in the process of copper foil deposition. The influence of different stripping layers on the electron transfer process of copper deposition is very different. The resistance of BTA stripping layer to copper deposition reaction is very great, and the BTA concentration of effective stripping layer is as high as 10 g 路L ~ (- 1). The minimum thickness of the prepared copper foil is that the resistance of the MAT stripping layer to the copper deposition reaction is much lower than that of the effective stripping layer formed by BTA,. The MAT concentration of the effective stripping layer is not more than 1.0 g 路L 鈮，

本文編號：2492711