【摘要】：以Sn-3.5%Ag-x Bi(x=0wt%、2wt%、3.5wt%、5wt%和7 wt%)為研究對象,通過潤濕性試驗和剪切試驗探索了Bi含量對焊料潤濕性和接頭剪切強度的影響。結(jié)果表明,隨著Bi含量的增大,Sn-3.5%Ag-x Bi焊料潤濕角減小,潤濕性能得到一定的提高。隨著Bi含量的增加,釬焊接頭剪切強度先是增大,然后減小,Bi含量為5%時剪切強度最大;當Bi含量從0增加到5%時,接頭剪切強度明顯增加。
[Abstract]:The effects of Bi content on wettability and shear strength of solder were investigated by wettability test and shear test with Sn-3.5%Ag-x Bi (xx0wt%, 2wt%, 3.5wt%, 5wt% and 7 wt%) as research objects. The results show that with the increase of Bi content, the wetting angle of Sn-3.5%Ag-x Bi solder decreases and the wettability is improved to a certain extent. With the increase of Bi content, the shear strength of brazed joint increases first and then decreases, and the shear strength of brazed joint increases when the content of Bi is 5%, and when the content of Bi increases from 0 to 5%, the shear strength of brazed joint increases obviously when the content of Bi increases from 0 to 5%.
【作者單位】： 合肥工業(yè)大學(xué)工業(yè)培訓(xùn)中心;合肥工業(yè)大學(xué)材料科學(xué)與工程學(xué)院;
【基金】：博士專項基金資助項目(JZ2014HGBZ0031)
【分類號】：TG42
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本文編號：2431734