【摘要】：采用熱壓燒結法制備了Al-12Si自釬劑釬料環(huán),對不同燒結壓力下釬料的潤濕性、顯微硬度和顯微組織進行了研究.結果表明,自釬劑釬料潤濕性環(huán)隨著燒結壓力升高呈現(xiàn)上升趨勢,在燒結壓力為222 MPa時鋪展面積達到152 mm2;隨著燒結壓力的增大,自釬劑釬料密度、顯微硬度逐漸增大,但上升趨勢變緩;釬料顯微組織主要是灰色基體上均勻分布著黑色大塊狀相和白色小顆粒;XRD結果顯示自釬劑釬料只有α-Al固溶體,初晶硅和Nocolok釬劑三種物相,熱壓燒結法制備自釬劑釬料未發(fā)生氧化、水解等反應,加上硅的活化作用保證了釬料高活性.
[Abstract]:The Al-12Si self-flux brazing ring was prepared by hot pressing sintering. The wettability, microhardness and microstructure of the solder under different sintering pressures were studied. The results show that the wettable ring of self-fluxing filler metal increases with the increase of sintering pressure, and the spreading area reaches 152 mm2; when sintering pressure is 222 MPa. With the increase of sintering pressure, the density and microhardness of the self-fluxing solder increase gradually, but the increasing trend becomes slower, and the microstructure of the solder is mainly composed of large black phases and small white particles distributed uniformly on the gray matrix. XRD results show that the solder has only three phases: 偽-Al solid solution, primary silicon and Nocolok flux. There are no oxidation and hydrolysis reactions in the solder prepared by hot pressing sintering, and the activation of silicon ensures the high activity of the solder.
【作者單位】： 鄭州機械研究所新型釬焊材料與技術國家重點實驗室;河南工業(yè)大學土木建筑學院;
【基金】：國際科技合作專項資助項目(2014DFR50820) 華南理工大學開放基金資助項目(2013001)
【分類號】：TG425

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