Sn-Sb-Cu-Ni焊料和焊點在低溫條件下組織和性能研究
發(fā)布時間:2018-11-10 08:15
【摘要】:為保證Sn-Sb-Cu-Ni合金及焊點在低溫環(huán)境下使用可靠性,將SnSb 4.5CuNi合金焊料和焊點在25,-10,-20,-60℃恒溫環(huán)境中進行儲存565天后,考察了不同溫度下SnSb 4.5CuNi合金微觀組織形貌、物相、密度、電導率、抗拉強度和塑性的變化,通過納米壓痕法測量SnSb 4.5CuNi/Cu焊點界面過渡層Cu6Sn5金屬間化合物(IMC)的硬度和彈性模量,對焊接接頭進行抗拉強度、剪切強度和低周疲勞測試。結果表明:合金主要由SbSn和β-Sn組成,低溫處理565天后合金組織形貌逐漸轉變?yōu)闃渲罱M織,焊料合金的密度和電導率均隨溫度降低而升高,表明經(jīng)低溫儲存后合金沒有發(fā)生灰錫轉變,但脆性SbSn相析出量的增多和枝晶組織致使鑄態(tài)合金的拉伸強度降低,增加了合金脆斷風險;隨著溫度的下降,焊接界面IMC層的彈性模量和硬度增大,焊件拉伸破壞模式從焊料內(nèi)部轉為IMC層,斷口越趨平整,焊件的抗拉強度、抗剪強度下降,呈現(xiàn)了低溫脆性斷裂的傾向。
[Abstract]:In order to ensure the reliability of Sn-Sb-Cu-Ni alloy and solder joint at low temperature, the solder and solder joint of SnSb 4.5CuNi alloy were stored for 565 days in a constant temperature environment of 25 ~ 10 ~ 20 ~ 60 鈩,
本文編號:2321901
[Abstract]:In order to ensure the reliability of Sn-Sb-Cu-Ni alloy and solder joint at low temperature, the solder and solder joint of SnSb 4.5CuNi alloy were stored for 565 days in a constant temperature environment of 25 ~ 10 ~ 20 ~ 60 鈩,
本文編號:2321901
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