通過添加POSS顆粒抑制錫基無Pb焊層的晶須生長
發(fā)布時間：2018-10-14 17:45
【摘要】：在Sn,Sn-3.0Ag-0.5Cu和Sn42-Bi58釬料中添加具有納米結構的籠形硅氧烷齊聚物(POSS)作為增強相,研究了增強相在恒溫恒濕(85℃,相對濕度85%)條件下對錫基無Pb焊層晶須生長行為的影響.結果表明,在恒溫恒濕條件下,錫基無Pb焊層晶須生長的驅動力是Sn的氧化物生成引起體積膨脹從而對周圍焊層產生的壓應力;添加POSS可以有效緩解金屬Sn的氧化進程,抑制Sn的氧化物生成,從而減緩晶須生長;在Sn,Sn3.0Ag0.5Cu和Sn58Bi焊層中,Sn焊層晶須生長能力最強,Sn58Bi焊層晶須生長能力最弱.
[Abstract]:Sn,Sn-3.0Ag-0.5Cu and Sn42-Bi58 solders were filled with caged siloxane oligomer (POSS) with nano-structure as reinforcement phase. The effect of reinforcing phase on whisker growth behavior without Pb layer on tin substrate was studied under constant temperature and humidity (85 鈩，
本文編號：2271166
[Abstract]:Sn,Sn-3.0Ag-0.5Cu and Sn42-Bi58 solders were filled with caged siloxane oligomer (POSS) with nano-structure as reinforcement phase. The effect of reinforcing phase on whisker growth behavior without Pb layer on tin substrate was studied under constant temperature and humidity (85 鈩，
本文編號：2271166
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