【摘要】：在Sn,Sn-3.0Ag-0.5Cu和Sn42-Bi58釬料中添加具有納米結(jié)構(gòu)的籠形硅氧烷齊聚物(POSS)作為增強(qiáng)相,研究了增強(qiáng)相在恒溫恒濕(85℃,相對(duì)濕度85%)條件下對(duì)錫基無Pb焊層晶須生長(zhǎng)行為的影響.結(jié)果表明,在恒溫恒濕條件下,錫基無Pb焊層晶須生長(zhǎng)的驅(qū)動(dòng)力是Sn的氧化物生成引起體積膨脹從而對(duì)周圍焊層產(chǎn)生的壓應(yīng)力;添加POSS可以有效緩解金屬Sn的氧化進(jìn)程,抑制Sn的氧化物生成,從而減緩晶須生長(zhǎng);在Sn,Sn3.0Ag0.5Cu和Sn58Bi焊層中,Sn焊層晶須生長(zhǎng)能力最強(qiáng),Sn58Bi焊層晶須生長(zhǎng)能力最弱.
[Abstract]:Sn,Sn-3.0Ag-0.5Cu and Sn42-Bi58 solders were filled with caged siloxane oligomer (POSS) with nano-structure as reinforcement phase. The effect of reinforcing phase on whisker growth behavior without Pb layer on tin substrate was studied under constant temperature and humidity (85 鈩，

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