【摘要】：采用復合電鍍技術,在酸性硫酸鹽鍍銅電鍍液中加入粒徑為20μm的金剛石粉體制備Cu-金剛石復合鍍層。通過正交試驗優(yōu)化Cu-金剛石復合電鍍的工藝參數,采用掃描電鏡(SEM)、能譜儀(EDS)和顯微硬度計研究CuSO_4·5H_2O濃度、陰極電流密度、金剛石粉體濃度和鍍液溫度對鍍層質量的影響。采用X射線分析儀(XRD)、掃描電鏡(SEM)和摩擦實驗機表征優(yōu)化后復合鍍層的相結構、表面形貌及摩擦性能。結果表明:優(yōu)化的鍍液組成和工藝參數為CuSO_4·5H_2O 190 g/L,H_2SO_4 60 g/L,陰極電流密度10 A/dm~2,金剛石粉體濃度20 g/L,鍍液溫度20℃;優(yōu)化后的復合鍍層晶粒均勻,金剛石粉體質量分數為21.50%,具有較好的顯微硬度和摩擦性能。
[Abstract]:Cu-diamond composite coating was prepared by adding diamond powder with diameter of 20 渭 m into acid sulfate copper plating solution by composite electroplating technology. The process parameters of Cu-diamond composite electroplating were optimized by orthogonal test. The effects of CuSO_4 5H_2O concentration, cathodic current density, diamond powder concentration and bath temperature on the coating quality were studied by scanning electron microscope (SEM) (SEM), energy spectrometer (EDS) and microhardness meter. The phase structure, surface morphology and tribological properties of the optimized composite coating were characterized by X-ray analyzer (XRD), scanning electron microscope (SEM) and friction tester. The results show that the optimized bath composition and process parameters are CuSO_4 5H_2O 190g / L, the cathode current density is 10 / A / dm-2, the concentration of diamond powder is 20 g / L, the bath temperature is 20 鈩，

本文編號：2186235