銅基釬料釬焊W-Cu復(fù)合材料與不銹鋼的連接機理研究
發(fā)布時間：2018-08-09 12:29
【摘要】：鎢銅復(fù)合材料由于其兼具銅和鎢的優(yōu)異性能,在現(xiàn)代化的生活中越來越得到重視和應(yīng)用。但是在實際的使用過程中,鎢銅復(fù)合材料存在韌性不足和抗氧化性能差的缺點,所以為了提高抗氧化性能,考慮用抗氧化性好的不銹鋼材料和鎢銅復(fù)合材料連接在一起,這樣可以擴大鎢銅復(fù)合材料的應(yīng)用鄰域。在現(xiàn)行的條件下,采用銀基焊料、金基焊料釬焊的時候焊接性能較好,釬焊接頭的強度也較高,但是成本太高難以實現(xiàn)大規(guī)模使用。當采用鎳基焊料時釬縫容易出現(xiàn)脆性層等缺點,而且一般情況下鎳基釬料的接頭強度較低。所以本文在研究基礎(chǔ)之上選擇銅基釬料來釬焊鎢銅和不銹鋼材料。本課題使用熔煉的Cu-Mn-Co-Ni3、Cu-Mn-Co-Zr3、Cu-Mn-Co-Zr5以及Cu-Ni-Ti四種成分的釬料對鎢銅復(fù)合材料和不銹鋼進行釬焊連接,然后分析釬縫的微觀組織和元素擴散特征,測試接頭的彎曲強度及斷裂特征,研究鎢銅復(fù)合材料和18-8不銹鋼的連接機理。Cu-Mn-Co-Ni3釬料釬焊接頭的組織是由Cu基固溶體和富Fe相:Cu(Mn-Fe)和Fe(Co)組成,這類組織有利于提高接頭的塑韌性。其接頭彎曲強度高達590MPa,接頭斷裂于鎢銅母材近縫區(qū),斷面上出現(xiàn)大量韌窩。添加的Ni元素可以提高接頭的耐高溫性能,Ni與W在高溫下固溶也有利提高接頭性能。對于Cu-Mn-Co-Zr3、Cu-Mn-Co-Zr5這兩種釬料而言,隨著活性元素Zr的加入,提高了釬料和母材元素的擴散。釬縫主要是由Cu基固溶體和富Fe相:Cu(Mn-Fe)和Fe(Co)組成,通過分析發(fā)現(xiàn)Fe2Zr、CuZr_2等金屬間化合物。二種釬料的釬焊接頭彎曲強度都超過450MPa,但是隨著Zr含量的增加會導(dǎo)致接頭金屬間化合物的增加,不利于接頭性能,所以含量為5%的釬料性能不如含量為3%的釬料。對于Cu-Ni-Ti釬料而言,釬焊接頭釬縫主要由(Cu-Ni)和(Fe-Ni)富銅富鐵相、Cu-Ti等金屬化合物以及微量的(Ti-W)、(Ni-W)固溶體組成。Ti作為活性元素添加在釬料中,可以促進鎢銅中的Cu朝著釬縫擴散,Ti還能去W形成有限固溶體,Ni在高溫情況下和W可以固溶,對于提高接頭的塑韌性起到積極的作用,Cu-Ni-Ti釬料的釬焊接頭斷面主要由韌窩痕和解理面組成,性能比前面釬料稍差,彎曲強度為440Mpa。
[Abstract]:Due to its excellent properties of both copper and tungsten, tungsten and copper composites have been paid more and more attention to and applied in modern life. However, in the process of practical use, tungsten and copper composites have the disadvantages of poor toughness and poor oxidation resistance, so in order to improve the oxidation resistance, we consider using stainless steel materials with good oxidation resistance to connect with tungsten and copper composites. In this way, the application neighborhood of tungsten and copper composites can be expanded. Under the current conditions, the gold-based solder has good welding performance and high strength of brazed joints, but the cost is too high to realize large-scale use. When the nickel-based solder is used, the brazing seam is prone to appear brittle layer, and the joint strength of the nickel-based solder is low in general. Therefore, based on the research, copper-based solder is selected to braze tungsten-copper and stainless steel. In this paper, brazing of tungsten and copper composites and stainless steel was carried out by using the melting Cu-Mn-Co-Ni3CU Cu-Mn-Co-Zr5 and Cu-Ni-Ti brazing materials. The microstructure and elemental diffusion characteristics of the brazing joints were analyzed, and the bending strength and fracture characteristics of the joints were tested. The bonding mechanism between tungsten and copper composites and 18-8 stainless steel was studied. The microstructure of brazed joints with Cu-Mn-Co-Ni3 solder is composed of Cu-based solid solution, Fe-rich phase: Mn-Fe and Fe (Co). This kind of microstructure is beneficial to improve the toughness of the joints. The bending strength of the joint is as high as 590MPa, and the joint breaks near the joint area of tungsten and copper base metal, and a large number of dimples appear on the cross section. The addition of Ni element can improve the high temperature resistance of the joints. The solution of Ni and W at high temperature can also improve the properties of the joints. For Cu-Mn-Co-Zr3- Cu-Mn-Co-Zr5 solder, the diffusion of filler metal and base metal elements increased with the addition of active element Zr. The brazing seam is mainly composed of Cu-based solid solution, Fe rich phase: Cu (Mn-Fe) and Fe (Co). The bending strength of the brazed joints of the two kinds of solders is more than 450 MPA, but with the increase of Zr content, the intermetallic compounds of the joints will increase, which is not conducive to the properties of the joints. Therefore, the brazing filler metals containing 5% of the filler metals are inferior to the filler metals with the content of 3%. For Cu-Ni-Ti solder, brazing joint is mainly composed of (Cu-Ni) and (Fe-Ni) copper-rich iron phase Cu-Ti and trace (Ti-W), (Ni-W) solid solution. It can promote the diffusion of Cu in tungsten and copper towards the brazing seam. It can also remove W to form a finite solid solution, Ni and W can be dissolved at high temperature. The joint section of Cu-Ni-Ti brazing filler metal is mainly composed of dimple marks and surfaces, and its properties are a little worse than that of the former brazing filler metal. The bending strength is 440 Mpa.
【學位授予單位】：江蘇科技大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TG454
本文編號：2174075
[Abstract]:Due to its excellent properties of both copper and tungsten, tungsten and copper composites have been paid more and more attention to and applied in modern life. However, in the process of practical use, tungsten and copper composites have the disadvantages of poor toughness and poor oxidation resistance, so in order to improve the oxidation resistance, we consider using stainless steel materials with good oxidation resistance to connect with tungsten and copper composites. In this way, the application neighborhood of tungsten and copper composites can be expanded. Under the current conditions, the gold-based solder has good welding performance and high strength of brazed joints, but the cost is too high to realize large-scale use. When the nickel-based solder is used, the brazing seam is prone to appear brittle layer, and the joint strength of the nickel-based solder is low in general. Therefore, based on the research, copper-based solder is selected to braze tungsten-copper and stainless steel. In this paper, brazing of tungsten and copper composites and stainless steel was carried out by using the melting Cu-Mn-Co-Ni3CU Cu-Mn-Co-Zr5 and Cu-Ni-Ti brazing materials. The microstructure and elemental diffusion characteristics of the brazing joints were analyzed, and the bending strength and fracture characteristics of the joints were tested. The bonding mechanism between tungsten and copper composites and 18-8 stainless steel was studied. The microstructure of brazed joints with Cu-Mn-Co-Ni3 solder is composed of Cu-based solid solution, Fe-rich phase: Mn-Fe and Fe (Co). This kind of microstructure is beneficial to improve the toughness of the joints. The bending strength of the joint is as high as 590MPa, and the joint breaks near the joint area of tungsten and copper base metal, and a large number of dimples appear on the cross section. The addition of Ni element can improve the high temperature resistance of the joints. The solution of Ni and W at high temperature can also improve the properties of the joints. For Cu-Mn-Co-Zr3- Cu-Mn-Co-Zr5 solder, the diffusion of filler metal and base metal elements increased with the addition of active element Zr. The brazing seam is mainly composed of Cu-based solid solution, Fe rich phase: Cu (Mn-Fe) and Fe (Co). The bending strength of the brazed joints of the two kinds of solders is more than 450 MPA, but with the increase of Zr content, the intermetallic compounds of the joints will increase, which is not conducive to the properties of the joints. Therefore, the brazing filler metals containing 5% of the filler metals are inferior to the filler metals with the content of 3%. For Cu-Ni-Ti solder, brazing joint is mainly composed of (Cu-Ni) and (Fe-Ni) copper-rich iron phase Cu-Ti and trace (Ti-W), (Ni-W) solid solution. It can promote the diffusion of Cu in tungsten and copper towards the brazing seam. It can also remove W to form a finite solid solution, Ni and W can be dissolved at high temperature. The joint section of Cu-Ni-Ti brazing filler metal is mainly composed of dimple marks and surfaces, and its properties are a little worse than that of the former brazing filler metal. The bending strength is 440 Mpa.
【學位授予單位】：江蘇科技大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TG454
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