【摘要】：目的優(yōu)化鉬表面直流磁控濺射鍍鎳薄膜的工藝,提出后續(xù)熱處理方法。方法設(shè)計正交實驗,探究濺射功率、濺射氣壓、負(fù)偏壓和沉積時間對鎳薄膜沉積速率和附著力的影響,從而優(yōu)化工藝參數(shù)。利用掃描電鏡和平整度儀對最佳工藝參數(shù)下制備的薄膜的組織結(jié)構(gòu)進(jìn)行表征,并研究后續(xù)熱處理對薄膜附著力的影響。結(jié)果工藝參數(shù)對鍍鎳薄膜沉積速率影響的主次順序為:功率濺射氣壓負(fù)偏壓;對薄膜附著力的影響主次順序為:負(fù)偏壓沉積時間功率濺射氣壓。隨濺射功率增大,沉積速率增大,薄膜附著力先增后減;隨濺射氣壓增大,沉積速率和薄膜附著力均先增后減。負(fù)偏壓增大對沉積速率影響較小,但有利于提高薄膜附著力。隨沉積時間延長,薄膜附著力降低。在氫氣氣氛下進(jìn)行850℃×1 h的后續(xù)熱處理,能夠促進(jìn)擴(kuò)散層的形成,明顯提高鎳薄膜的附著力。結(jié)論最佳鍍鎳工藝參數(shù)為:濺射功率1.8 k W,濺射氣壓0.3 Pa,負(fù)偏壓450 V,沉積時間10 min。在該條件下制備的鎳薄膜厚度達(dá)到1.15μm左右,與基體結(jié)合緊密,表面平整、連續(xù)、致密。后續(xù)增加熱處理工序是提高鎳薄膜附著力的有效方法。
[Abstract]:Aim to optimize the process of nickel plating on molybdenum surface by DC magnetron sputtering, and to propose a follow-up heat treatment method. Methods orthogonal experiments were designed to study the effects of sputtering power, sputtering pressure, negative bias voltage and deposition time on the deposition rate and adhesion of nickel film. The microstructure of the films prepared under the optimum technological parameters was characterized by scanning electron microscopy (SEM) and flatness analyzer. The effect of subsequent heat treatment on the adhesion of the films was studied. Results the primary and secondary order of the influence of process parameters on the deposition rate of nickel-plated films was as follows: the negative bias of power sputtering pressure and the primary and secondary order of influence on the adhesion of the films were: negative bias deposition time power sputtering pressure. With the increase of sputtering power, the deposition rate increases and then decreases, and with the increase of sputtering pressure, the deposition rate and film adhesion increase first and then decrease. The increase of negative bias voltage has little effect on the deposition rate, but it can improve the adhesion of the film. With the increase of deposition time, the adhesion of the film decreases. After heat treatment at 850 鈩，

本文編號：2133231