電噴鍍鎳—磷—氮化硼復(fù)合鍍層工藝及其性能研究
發(fā)布時(shí)間:2018-07-06 12:58
本文選題:電噴鍍 + Ni-P-BN(h)復(fù)合鍍層 ; 參考:《南京農(nóng)業(yè)大學(xué)》2015年碩士論文
【摘要】:電鍍是改善基體金屬表面質(zhì)量的一種常用而有效的方法,電噴鍍技術(shù)作為在傳統(tǒng)電鍍基礎(chǔ)上發(fā)展起來(lái)的表面電沉積新技術(shù),大大提高了沉積速度,且制備的鍍層表面質(zhì)量良好。有著"白色石墨"之稱的BN,其抗氧化性、化學(xué)穩(wěn)定性、自潤(rùn)滑性較好,采用納米BN(h)顆粒與金屬共沉積的方法制得的Ni-P-BN(h)復(fù)合鍍層,整體上具有優(yōu)于普通Ni-P合金鍍層更好的物理、化學(xué)性能,具有很大的應(yīng)用前景。本文在自行研制的數(shù)控電噴鍍裝置上制備Ni-P-BN(h)復(fù)合鍍層,分析工藝參數(shù)的影響規(guī)律,并對(duì)鍍層性能進(jìn)行檢測(cè),具體包括以下幾方面的內(nèi)容:(1)表面活性劑的選擇和BN(h)顆粒濃度的確定。開展單因素試驗(yàn),通過(guò)不同表面活性劑制得的復(fù)合鍍層的Zeta電位、BN(h)顆粒懸浮穩(wěn)定性及表面形貌檢測(cè),得出表面活性劑應(yīng)選擇十六烷基三甲基溴化銨(CTAB);通過(guò)不同BN(h)顆粒濃度下制得的復(fù)合鍍層的表面形貌、顯微硬度及表面粗糙度比較,得出BN(h)顆粒濃度應(yīng)為10g/L。(2)電噴鍍Ni-P-BN(h)復(fù)合鍍層的計(jì)算機(jī)仿真研究。采用ANSYS軟件和FLUENT軟件對(duì)加工區(qū)域的電場(chǎng)和流場(chǎng)進(jìn)行二維仿真分析,得出采用不對(duì)稱的單邊刃口型噴嘴可得到均勻鍍層,且選擇了合適的鍍液流速,為電噴鍍?cè)囼?yàn)做準(zhǔn)備。(3)電噴鍍Ni-P-BN(h)復(fù)合鍍層的工藝試驗(yàn)研究。采用JMP定制設(shè)計(jì)器進(jìn)行試驗(yàn)設(shè)計(jì)及數(shù)據(jù)回歸分析,研究電壓、鍍液溫度、兩極相對(duì)間隙、兩極相對(duì)運(yùn)動(dòng)速度對(duì)復(fù)合鍍層沉積速度、顯微硬度、表面粗糙度的影響,并將各響應(yīng)與電噴鍍Ni-P合金鍍層進(jìn)行比較。利用期望函數(shù)法進(jìn)行多響應(yīng)優(yōu)化,得到最優(yōu)工藝參數(shù)組合為:電壓16V,鍍液溫度63℃,相對(duì)間隙1.3mm,兩極相對(duì)運(yùn)動(dòng)速度135mm/min;此工藝條件下測(cè)得鍍層的平均沉積速度為49.27μm/min,顯微硬度為673.19Hv,表面粗糙度為0.216μm。(4)電噴鍍Ni-P-BN(h)復(fù)合鍍層的摩擦磨損性能研究。采用摩擦系數(shù)測(cè)定、磨損量計(jì)算及磨痕表面形貌檢測(cè),得出Ni-P-BN(h)復(fù)合鍍層具有高于Ni-P合金鍍層、遠(yuǎn)高于45鋼的耐磨性,并探究了磨損機(jī)制。(5)電噴鍍Ni-P-BN(h)復(fù)合鍍層的耐腐蝕性能研究。采用動(dòng)電位掃描測(cè)定極化曲線的方法及腐蝕后表面形貌的檢測(cè),計(jì)算鍍層在質(zhì)量分?jǐn)?shù)3.5%的NaCl溶液中的腐蝕電位和腐蝕電流,得出Ni-P-BN(h)復(fù)合鍍層具有高于Ni-P合金鍍層的優(yōu)良耐蝕性,并分析了腐蝕機(jī)理。
[Abstract]:Electroplating is a common and effective method to improve the surface quality of substrate metal. As a new surface electrodeposition technology developed on the basis of traditional electroplating, electrospray plating technology greatly improves the deposition rate and the surface quality of the coating is good. BNs, known as "white graphite", have better oxidation resistance, chemical stability and self-lubricity. Ni-P-BN (h) composite coatings prepared by co-deposition of nano-BN (h) particles with metals have better physical properties than ordinary Ni-P alloy coatings on the whole. The chemical properties have great application prospect. In this paper, Ni-P-BN (h) composite coating was prepared on the NC electrospray plating device, the influence of process parameters was analyzed, and the performance of the coating was tested. The main contents are as follows: (1) selection of surfactant and determination of concentration of BN (h) particles. The suspension stability and surface morphology of Zeta potential BN (h) particles of composite coatings prepared by different surfactants were tested by single factor test. It is concluded that cetyltrimethylammonium bromide (CTAB) should be selected as surfactant, and the surface morphology, microhardness and surface roughness of the composite coating prepared by different concentration of BN (h) particles are compared. The results show that the concentration of BN (h) particles should be 10 g / L. (2) computer simulation of Ni-P-BN (h) composite coating by electrospray plating. By using ANSYS software and fluent software, the electric field and flow field in the machining area are simulated and analyzed. It is concluded that the uniform coating can be obtained by using asymmetrical one-sided edge nozzle, and the appropriate velocity of plating bath is selected. (3) study on the process of electrospray plating Ni-P-BN (h) composite coating. The effect of voltage, bath temperature, relative gap between two poles, relative velocity of two poles on deposition speed, microhardness and surface roughness of composite coating was studied by using JMP custom designer and data regression analysis. The response of Ni-P alloy coating was compared with that of electrospray plating. The optimum process parameters are as follows: voltage 16V, bath temperature 63 鈩,
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